Claims
- 1. An apparatus for bonding a semiconductor chip comprising:
a stacker in which a substrate is loaded; a tape provider which provides an adhesive tape for bonding the semiconductor chip to the substrate; a tape pick-up tool which transports pieces of the adhesive tape from the tape provider to a bonding pad of the substrate; a semiconductor chip provider in which the semiconductor chip is contained; a die pick-up tool which transports the semiconductor chip from the semiconductor chip provider; and a presser which presses the semiconductor chip placed on the adhesive tape to bond the semiconductor chip to the die pad.
- 2. The apparatus of claim 1, wherein the tape provider comprises:
a reel on which the adhesive tape is spooled; a tape cutter for cutting the adhesive tape spooled off the reel to a size that is proper for bonding the semiconductor chip to the die pad; and a tape holder for holding the adhesive tape while the adhesive tape is being cut.
- 3. The die bonding apparatus of the semiconductor device of claim 2, wherein the tape provider further comprises a set of rollers for advancing the adhesive tape to the tape cutter, the adhesive tape being placed between the rollers.
- 4. The die bonding apparatus of claim 1, further comprising a transferring means for transporting the substrate by a distance in one transferring motion.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1998-34629 |
Aug 1998 |
KR |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application Ser. No. 09/359,961, entitled “Semiconductor Package Including a Non-Conductive Adhesive Tape, and Method and Apparatus for Die Bonding,” filed Jul. 22, 1999.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09359961 |
Jul 1999 |
US |
Child |
10116786 |
Apr 2002 |
US |