JEDEC Solid State Product Outline, Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package, Package Designator HP-VFQFP-N & HP-WFQFP-N, Issue C, MO-220, May 2001, sheets 1 through 3 of 41. |
JEDEC Solid State Product Outlines, Very Very Thin Quad Bottom Terminal Chip Carrier Family, JESD-30 Designator W-PBCC-B/WH-PBCC-B, Issue A, Oct. 1999, MO-217, sheets 1 and 2 of 6. |
JEDEC Solid State Product Outlines, Plastic Ultra-Thin Small Outline No-Lead Package, JESD-30 Designator R-PDSO-N, Issue C, Apr. 1998, MO-196, Sheets 1 and 2 of 8. |