Shiann-Tsong Tsai

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shielding structure
- Patent number 11,869,849
- Issue date Jan 9, 2024
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,705,413
- Issue date Jul 18, 2023
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shielding structure
- Patent number 11,355,450
- Issue date Jun 7, 2022
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,302,657
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-tier bonding wires and component...
- Patent number 11,257,780
- Issue date Feb 22, 2022
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,227,846
- Issue date Jan 18, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-tier bonding wires and component...
- Patent number 10,847,488
- Issue date Nov 24, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package
- Patent number 10,340,259
- Issue date Jul 2, 2019
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly
- Patent number 10,276,465
- Issue date Apr 30, 2019
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with coated bonding wires and fabrication met...
- Patent number 10,037,936
- Issue date Jul 31, 2018
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,008,441
- Issue date Jun 26, 2018
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,842,831
- Issue date Dec 12, 2017
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 7,993,970
- Issue date Aug 9, 2011
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,951,644
- Issue date May 31, 2011
- United Test Center Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-substrate region-based package and method for fabricating the...
- Patent number 7,859,118
- Issue date Dec 28, 2010
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,772,034
- Issue date Aug 10, 2010
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package and fabrication method thereof
- Patent number 7,091,623
- Issue date Aug 15, 2006
- UltraTera Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strengthened window-type semiconductor package
- Patent number 6,879,030
- Issue date Apr 12, 2005
- UltraTera Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package and fabrication method thereof
- Patent number 6,825,064
- Issue date Nov 30, 2004
- UltraTera Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220285297
- Publication date Sep 8, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMI SHIELDING STRUCTURE
- Publication number 20220262741
- Publication date Aug 18, 2022
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220102297
- Publication date Mar 31, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMI SHIELDING STRUCTURE
- Publication number 20210035919
- Publication date Feb 4, 2021
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243462
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243464
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...
- Publication number 20200235069
- Publication date Jul 23, 2020
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLUE DISPENSING APPARATUS
- Publication number 20200075364
- Publication date Mar 5, 2020
- Ke Huang Corporation
- Shiann-Tsong Tsai
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...
- Publication number 20180166414
- Publication date Jun 14, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20180090408
- Publication date Mar 29, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20180076185
- Publication date Mar 15, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20180006002
- Publication date Jan 4, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170179017
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COATED BONDING WIRES AND FABRICATION MET...
- Publication number 20170125327
- Publication date May 4, 2017
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160336303
- Publication date Nov 17, 2016
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOUD 3D MODEL CONSTRUCTION SYSTEM AND CONSTRUCTION METHOD THEREOF
- Publication number 20150105889
- Publication date Apr 16, 2015
- Shiann-Tsong Tsai
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20120220081
- Publication date Aug 30, 2012
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD
- Publication number 20100163605
- Publication date Jul 1, 2010
- United Test Center Inc.
- Shiann-Tsong Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100148361
- Publication date Jun 17, 2010
- United Test Center Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with adhesive protection layer
- Publication number 20100052161
- Publication date Mar 4, 2010
- UTAC(Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20090243096
- Publication date Oct 1, 2009
- UTAC (TAIWAN) CORPORATION
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor device
- Publication number 20090111221
- Publication date Apr 30, 2009
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-substrate region-based package and method for fabricating the...
- Publication number 20090045527
- Publication date Feb 19, 2009
- UTAC (Taiwan) Corporation
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor package and fabrication method thereof
- Publication number 20050064631
- Publication date Mar 24, 2005
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strengthened window-type semiconductor package
- Publication number 20040061209
- Publication date Apr 1, 2004
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor package and fabrication method thereof
- Publication number 20040061146
- Publication date Apr 1, 2004
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Shiann-Tsong Tsai

Person

Patents Grantslast 30 patents

Semiconductor package having improved thermal interface between sem...

Semiconductor package with EMI shielding structure

Semiconductor package having improved thermal interface between sem...

Semiconductor package with EMI shielding structure

Semiconductor package having improved thermal interface between sem...

Semiconductor package having multi-tier bonding wires and component...

Semiconductor package having improved thermal interface between sem...

Semiconductor package having multi-tier bonding wires and component...

Semiconductor chip package with resilient conductive paste post and...

Method for fabricating a semiconductor package

Semiconductor package assembly

Semiconductor package with coated bonding wires and fabrication met...

Semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor device and fabrication method thereof

Semiconductor device and method for fabricating the same

Multi-substrate region-based package and method for fabricating the...

Fabrication method of semiconductor device

Multi-chip semiconductor package and fabrication method thereof

Strengthened window-type semiconductor package

Multi-chip semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE WITH EMI SHIELDING STRUCTURE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE WITH EMI SHIELDING STRUCTURE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...

GLUE DISPENSING APPARATUS

SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...

SEMICONDUCTOR PACKAGE ASSEMBLY

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH COATED BONDING WIRES AND FABRICATION MET...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CLOUD 3D MODEL CONSTRUCTION SYSTEM AND CONSTRUCTION METHOD THEREOF

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE

BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor wafer with adhesive protection layer

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Fabrication method of semiconductor device

Multi-substrate region-based package and method for fabricating the...

Multi-chip semiconductor package and fabrication method thereof

Strengthened window-type semiconductor package

Multi-chip semiconductor package and fabrication method thereof