Shih-Fang Chuang

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McKinney, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Heatsink-substrate-spacer structure for an integrated-circuit package
- Patent number 6,936,919
- Issue date Aug 30, 2005
- Texas Instruments Incorporated
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermally Enhanced IC Package and Method
- Publication number 20080157300
- Publication date Jul 3, 2008
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Board level solder joint support for BGA packages under heatsink co...
- Publication number 20060043586
- Publication date Mar 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip solder bump formation using a wirebonder apparatus
- Publication number 20050133571
- Publication date Jun 23, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Shih-Fang Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low coefficient of thermal expansion (CTE) semiconductor packaging...
- Publication number 20050110168
- Publication date May 26, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with heatsink support
- Publication number 20040036162
- Publication date Feb 26, 2004
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS