Shingo Sudo

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
- Patent number 11,631,653
- Issue date Apr 18, 2023
- Mitsubishi Electric Corporation
- Minoru Egusa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
- Patent number 11,569,197
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Minoru Egusa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device, method for manufacturing power semicond...
- Patent number 11,217,514
- Issue date Jan 4, 2022
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,768,118
- Issue date Aug 3, 2010
- Mitsubishi Electric Corporation
- Hiroshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermoplastic resin to reduce warpage
- Patent number 7,671,382
- Issue date Mar 2, 2010
- Mitsubishi Electric Corporation
- Shingo Sudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,589,412
- Issue date Sep 15, 2009
- Mitsubishi Electric Corporation
- Hironori Kashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Device, Method for Manufacturing Power Semicond...
- Publication number 20210020551
- Publication date Jan 21, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Takamasa IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING APPARATUS, ULTRASONIC BONDING INSPECTION METHOD...
- Publication number 20200035642
- Publication date Jan 30, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Minoru EGUSA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090321900
- Publication date Dec 31, 2009
- Mitsubishi Electric Corporation
- Hiroshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070215999
- Publication date Sep 20, 2007
- Mitsubishi Electric Corporation
- Hironori KASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070138624
- Publication date Jun 21, 2007
- MITSUBISHI ELECTRIC CORPORATION
- Shingo Sudo
- H01 - BASIC ELECTRIC ELEMENTS