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Shinsuke Hagiwara
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Chikusei-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Liquid resin composition for electronic components and electronic c...
Patent number
8,232,355
Issue date
Jul 31, 2012
Hitachi Chemical Co., Ltd.
Hisato Takahashi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Liquid resin composition for electronic part sealing, and electroni...
Patent number
7,982,322
Issue date
Jul 19, 2011
Hitachi Chemical Co., Ltd.
Satoru Tsuchida
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Sealant for electronics of epoxy resin, aromatic amine, accelerator...
Patent number
7,981,977
Issue date
Jul 19, 2011
Hitachi Chemical Co., Ltd.
Kazuyoshi Tendou
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Encapsulant of epoxy resin, curing agent, and secondary aminosilane...
Patent number
7,544,727
Issue date
Jun 9, 2009
Hitachi Chemical Co., Ltd.
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Epoxy resin molding material for sealing use and semiconductor device
Patent number
7,397,139
Issue date
Jul 8, 2008
Hitachi Chemical Co., Ltd.
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication process of semiconductor package and semiconductor package
Patent number
7,187,072
Issue date
Mar 6, 2007
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication process of semiconductor package and semiconductor package
Patent number
6,746,897
Issue date
Jun 8, 2004
Naoki Fukutomi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Phenyl, naphthly or fluorene cyclopentyl epoxy resins
Patent number
6,713,589
Issue date
Mar 30, 2004
Hitachi Chemical Company, Ltd.
Haruaki Sue
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Fabrication process of semiconductor package and semiconductor package
Patent number
6,365,432
Issue date
Apr 2, 2002
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Phenyl, naphthyl or fluorene cyclopentyl epoxy resins
Patent number
6,329,492
Issue date
Dec 11, 2001
Hitachi Chemical Company, Ltd.
Haruaki Sue
C07 - ORGANIC CHEMISTRY
Information
Patent Grant
Phase-separated carboxyl group-containing elastomer modified phoeno...
Patent number
6,235,842
Issue date
May 22, 2001
Hitachi Chemical Company, Ltd.
Atsushi Kuwano
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Phenolic resin, resin composition, molding material for encapsulati...
Patent number
6,207,789
Issue date
Mar 27, 2001
Hitachi Chemical Co., Ltd.
Haruaki Sue
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Fabrication process of semiconductor package and semiconductor package
Patent number
5,976,912
Issue date
Nov 2, 1999
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor sealant of epoxy resin and organic polymer-grafted si...
Patent number
5,962,139
Issue date
Oct 5, 1999
Hitachi Chemical Co., Ltd.
Shinsuke Hagiwara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Epoxy resin molding for sealing electronic parts containing organic...
Patent number
5,739,217
Issue date
Apr 14, 1998
Hitachi Chemical Company, Ltd.
Shinsuke Hagiwara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method of preparing naphthol-modified phenolic resin and epoxy resi...
Patent number
5,510,446
Issue date
Apr 23, 1996
Hitachi Chemical Company, Ltd.
Haruaki Sue
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method of preparing naphthol-modified phenolic resin
Patent number
5,459,223
Issue date
Oct 17, 1995
Hitachi Chemical Company
Haruaki Sue
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method of producing boards for printed wiring
Patent number
5,449,480
Issue date
Sep 12, 1995
Hitachi Chemical Company, Ltd.
Hiroyuki Kuriya
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Epoxy resin molding material for sealing of electronic component
Patent number
5,319,005
Issue date
Jun 7, 1994
Hitachi Chemical Co., Ltd.
Shinsuke Hagiwara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method of producing a naphthol-modified phenolic resin of highly in...
Patent number
5,206,333
Issue date
Apr 27, 1993
Hitachi Chemical Company, Ltd.
Haruaki Sue
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONI...
Publication number
20100014263
Publication date
Jan 21, 2010
Satoru Tsuchida
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Liquid Resin Composition for Electronic Components and Electronic C...
Publication number
20090286930
Publication date
Nov 19, 2009
Hisato Takahashi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Liquid Resin Composition for Electronic Components and Electronic C...
Publication number
20090273070
Publication date
Nov 5, 2009
Kazuyoshi Tendou
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy resin molding material for sealing use and semiconductor device
Publication number
20060214153
Publication date
Sep 28, 2006
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Encapsulating epoxy resin molding material and semiconductor device
Publication number
20060074150
Publication date
Apr 6, 2006
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Fabrication process of semiconductor package and semiconductor package
Publication number
20040110319
Publication date
Jun 10, 2004
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Epoxy resin molding material for sealing
Publication number
20030201548
Publication date
Oct 30, 2003
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Fabrication process of semiconductor package and semiconductor package
Publication number
20020094606
Publication date
Jul 18, 2002
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cyclopentylene compound and intermediate thereof, epoxy resin compo...
Publication number
20020065386
Publication date
May 30, 2002
Hitachi Chemical Company, Ltd.
Haruaki Sue
C07 - ORGANIC CHEMISTRY
Information
Patent Application
Fabrication process of semiconductor package and semiconductor package
Publication number
20020039808
Publication date
Apr 4, 2002
Hitachi Chemical Company, Ltd.
Naoki Fukutomi
H01 - BASIC ELECTRIC ELEMENTS