Shinya Takyu

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, and manufacturing method and manufacturing ap...
- Patent number 8,956,917
- Issue date Feb 17, 2015
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and processing device of semiconductor wafer, and...
- Patent number 8,790,995
- Issue date Jul 29, 2014
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and substrate separa...
- Patent number 8,771,456
- Issue date Jul 8, 2014
- Kabushiki Kaisha Toshiba
- Noriko Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and adhesive sheet
- Patent number 8,294,282
- Issue date Oct 23, 2012
- Kabushiki Kaisha Toshiba
- Hidekazu Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing a stacked semiconductor package, and stack...
- Patent number 7,932,162
- Issue date Apr 26, 2011
- Kabushiki Kaisha Toshiba
- Junya Sagara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack MCP and manufacturing method thereof
- Patent number 7,833,836
- Issue date Nov 16, 2010
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,631,680
- Issue date Dec 15, 2009
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack MCP and manufacturing method thereof
- Patent number 7,482,695
- Issue date Jan 27, 2009
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,300,818
- Issue date Nov 27, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaving a wafer through expansion resulti...
- Patent number 7,294,558
- Issue date Nov 13, 2007
- Kabushiki Kaisha Toshiba
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack MCP
- Patent number 7,285,864
- Issue date Oct 23, 2007
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 7,223,319
- Issue date May 29, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer dividing method and apparatus
- Patent number 7,135,384
- Issue date Nov 14, 2006
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,060,593
- Issue date Jun 13, 2006
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,060,532
- Issue date Jun 13, 2006
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method using ultrasonic flip chi...
- Patent number 6,838,316
- Issue date Jan 4, 2005
- Kabushiki Kaisha Toshiba
- Kazuhiro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method for reinforcing chip by u...
- Patent number 6,777,313
- Issue date Aug 17, 2004
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup device and method of manufacturing semiconductor device
- Patent number 6,774,011
- Issue date Aug 10, 2004
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer dividing apparatus and semiconductor device man...
- Patent number 6,756,562
- Issue date Jun 29, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer splitting method using cleavage
- Patent number 6,699,774
- Issue date Mar 2, 2004
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grinding a wafer back
- Patent number 6,465,330
- Issue date Oct 15, 2002
- Lintec Corporation
- Kazuhiro Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of dividing a wafer
- Patent number 6,337,258
- Issue date Jan 8, 2002
- Kabushiki Kaisha Toshiba
- Hideo Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,294,439
- Issue date Sep 25, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,184,109
- Issue date Feb 6, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 5,888,883
- Issue date Mar 30, 1999
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD...
- Publication number 20160079303
- Publication date Mar 17, 2016
- KABUSHIKI KAISHA TOSHIBA
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SUBSTRATE SEPARA...
- Publication number 20130248099
- Publication date Sep 26, 2013
- Kabushiki Kaisha Toshiba
- Noriko SHIMIZU
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING METHOD AND PROCESSING DEVICE OF SEMICONDUCTOR WAFER, AND...
- Publication number 20130001766
- Publication date Jan 3, 2013
- Kabushiki Kaisha Toshiba
- Shinya TAKYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20120329369
- Publication date Dec 27, 2012
- Kabushiki Kaisha Toshiba
- Noriko SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120235282
- Publication date Sep 20, 2012
- Kabushiki Kaisha Toshiba
- Akira TOMONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD AND MANUFACTURING AP...
- Publication number 20120187542
- Publication date Jul 26, 2012
- Kabushiki Kaisha Toshiba
- Tetsuya KUROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20110163459
- Publication date Jul 7, 2011
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ADHESIVE SHEET
- Publication number 20110068480
- Publication date Mar 24, 2011
- Hidekazu Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100311224
- Publication date Dec 9, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK MCP AND MANUFACTURING METHOD THEREOF
- Publication number 20090111218
- Publication date Apr 30, 2009
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20090096110
- Publication date Apr 16, 2009
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080299686
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Motoshige KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack MCP and manufacturing method thereof
- Publication number 20070262445
- Publication date Nov 15, 2007
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20070197002
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20060019428
- Publication date Jan 26, 2006
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cleaving a wafer through expansion resulti...
- Publication number 20050196899
- Publication date Sep 8, 2005
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack MCP and manufacturing method thereof
- Publication number 20050179127
- Publication date Aug 18, 2005
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050026326
- Publication date Feb 3, 2005
- Mika Kiritani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing apparatus and semiconductor device man...
- Publication number 20050023260
- Publication date Feb 3, 2005
- Shinya Takyu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor manufacturing apparatus and method of manufacturing s...
- Publication number 20050019980
- Publication date Jan 27, 2005
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050003636
- Publication date Jan 6, 2005
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing method and apparatus
- Publication number 20040224483
- Publication date Nov 11, 2004
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method using ultrasonic flip chi...
- Publication number 20030180986
- Publication date Sep 25, 2003
- Kazuhiro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer splitting method using cleavage
- Publication number 20030129809
- Publication date Jul 10, 2003
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20030060021
- Publication date Mar 27, 2003
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method for reinforcing chip by u...
- Publication number 20030017663
- Publication date Jan 23, 2003
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip pickup device and method of manufacturing semiconductor device
- Publication number 20020019074
- Publication date Feb 14, 2002
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS

Shinya Takyu

Person

Patents Grantslast 30 patents

Semiconductor device, and manufacturing method and manufacturing ap...

Processing method and processing device of semiconductor wafer, and...

Method of manufacturing a semiconductor device and substrate separa...

Semiconductor device and adhesive sheet

Method for manufacturing a stacked semiconductor package, and stack...

Stack MCP and manufacturing method thereof

Method of and mechanism for peeling adhesive tape bonded to segment...

Stack MCP and manufacturing method thereof

Method of and mechanism for peeling adhesive tape bonded to segment...

Method and apparatus for cleaving a wafer through expansion resulti...

Stack MCP

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor wafer dividing method and apparatus

Method of and mechanism for peeling adhesive tape bonded to segment...

Manufacturing method of semiconductor device

Semiconductor device manufacturing method using ultrasonic flip chi...

Semiconductor device manufacturing method for reinforcing chip by u...

Chip pickup device and method of manufacturing semiconductor device

Semiconductor wafer dividing apparatus and semiconductor device man...

Wafer splitting method using cleavage

Method for grinding a wafer back

Method of dividing a wafer

Method of dividing a wafer and method of manufacturing a semiconduc...

Method of dividing a wafer and method of manufacturing a semiconduc...

Method of dividing a wafer and method of manufacturing a semiconduc...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SUBSTRATE SEPARA...

PROCESSING METHOD AND PROCESSING DEVICE OF SEMICONDUCTOR WAFER, AND...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD AND MANUFACTURING AP...

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

SEMICONDUCTOR DEVICE AND ADHESIVE SHEET

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

STACK MCP AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Stack MCP and manufacturing method thereof

Method of and mechanism for peeling adhesive tape bonded to segment...

Method of and mechanism for peeling adhesive tape bonded to segment...

Method and apparatus for cleaving a wafer through expansion resulti...

Stack MCP and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor wafer dividing apparatus and semiconductor device man...

Semiconductor manufacturing apparatus and method of manufacturing s...

Manufacturing method of semiconductor device

Semiconductor wafer dividing method and apparatus

Semiconductor device manufacturing method using ultrasonic flip chi...

Wafer splitting method using cleavage

Method of and mechanism for peeling adhesive tape bonded to segment...

Semiconductor device manufacturing method for reinforcing chip by u...

Chip pickup device and method of manufacturing semiconductor device