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Shoji Miura
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Aichi-ken, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having tin-based solder layer and method for m...
Patent number
7,579,212
Issue date
Aug 25, 2009
Denso Corporation
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing mold type semiconductor device
Patent number
7,468,318
Issue date
Dec 23, 2008
Denso Corporation
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having tin-based solder layer and method for m...
Patent number
7,361,996
Issue date
Apr 22, 2008
Denso Corporation
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor device with heat conducting members
Patent number
7,247,929
Issue date
Jul 24, 2007
Denso Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold type semiconductor device
Patent number
7,193,326
Issue date
Mar 20, 2007
Denso Corporation
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power MOS transistor having capability for setting substrate potent...
Patent number
7,109,558
Issue date
Sep 19, 2006
Denso Corporation
Takashi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having aluminum and metal electrodes and metho...
Patent number
7,030,496
Issue date
Apr 18, 2006
Denso Corporation
Keiji Shinyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package type semiconductor device
Patent number
7,009,292
Issue date
Mar 7, 2006
Denso Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal oxide semiconductor transistor having a nitrogen cluster cont...
Patent number
6,972,459
Issue date
Dec 6, 2005
Denso Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
6,946,711
Issue date
Sep 20, 2005
Denso Corporation
Mikimasa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having controlled sur...
Patent number
6,927,167
Issue date
Aug 9, 2005
Denso Corporation
Yutaka Fukuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
Patent number
6,917,103
Issue date
Jul 12, 2005
Denso Corporation
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Load drive circuit using flywheel diode
Patent number
6,829,152
Issue date
Dec 7, 2004
Denso Corporation
Shoji Miura
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
6,809,348
Issue date
Oct 26, 2004
Denso Corporation
Mikimasa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
Patent number
6,787,898
Issue date
Sep 7, 2004
Denso Corporation
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for etching trench in manufacturing semiconductor devices
Patent number
6,291,315
Issue date
Sep 18, 2001
Denso Corporation
Yoshiaki Nakayama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having thin film resistor and method of produc...
Patent number
6,287,933
Issue date
Sep 11, 2001
Nippondenso Co., Ltd.
Makio Iida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having multilayer interconnection structure an...
Patent number
6,274,452
Issue date
Aug 14, 2001
Denso Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having oblique portion as reflection
Patent number
6,242,792
Issue date
Jun 5, 2001
Denso Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Design for a semiconductor device having elements isolated by insul...
Patent number
6,104,078
Issue date
Aug 15, 2000
Denso Corporation
Makio Iida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High withstand voltage type semiconductor device having an isolatio...
Patent number
5,644,157
Issue date
Jul 1, 1997
Nippondenso Co., Ltd.
Makio Iida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI semiconductor device and method of producing same wherein warpa...
Patent number
5,599,722
Issue date
Feb 4, 1997
Nippondenso Co., Ltd.
Takayuki Sugisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric isolated type semiconductor device provided with bipolar...
Patent number
5,592,015
Issue date
Jan 7, 1997
Nippondenso Co., Ltd.
Makio Iida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric isolated type semiconductor device
Patent number
5,557,134
Issue date
Sep 17, 1996
Nippondenso Co., Ltd.
Takayuki Sugisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with thin film resistor having reduced film th...
Patent number
5,525,831
Issue date
Jun 11, 1996
Nippondenso Co., Ltd.
Makoto Ohkawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dry etching process for semiconductor
Patent number
5,522,966
Issue date
Jun 4, 1996
Nippondenso Co., Ltd.
Atsushi Komura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabrication of semiconductor device
Patent number
5,480,832
Issue date
Jan 2, 1996
Nippondenso Co., Ltd.
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device provided with isolation region
Patent number
5,449,946
Issue date
Sep 12, 1995
Nippondenso Co., Ltd.
Toshio Sakakibara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dry etching process for semiconductor
Patent number
5,423,941
Issue date
Jun 13, 1995
Nippondenso Co., Ltd.
Atsushi Komura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making semiconductor device using a trimmable thin-film r...
Patent number
5,284,794
Issue date
Feb 8, 1994
Nippondenso Co., Ltd.
Yoshihiko Isobe
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor device having tin-based solder layer and method for m...
Publication number
20070176293
Publication date
Aug 2, 2007
DENSO CORPORATION
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing mold type semiconductor device
Publication number
20070158850
Publication date
Jul 12, 2007
DENSO CORPORATION
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having aluminum electrode and metallic electrode
Publication number
20060081996
Publication date
Apr 20, 2006
DENSO CORPORATION
Keiji Shinyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor equipment having a pair of heat radiation plates
Publication number
20060055056
Publication date
Mar 16, 2006
DENSO Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having tin-based solder layer and method for m...
Publication number
20060049521
Publication date
Mar 9, 2006
DENSO CORPORATION
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor device including electrodes...
Publication number
20050170555
Publication date
Aug 4, 2005
DENSO Corporation
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package type semiconductor device
Publication number
20050077599
Publication date
Apr 14, 2005
DENSO Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having aluminum and metal electrodes and metho...
Publication number
20050006778
Publication date
Jan 13, 2005
DENSO Corporation
Keiji Shinyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mold type semiconductor device and method for manufacturing the same
Publication number
20040256730
Publication date
Dec 23, 2004
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device
Publication number
20040195649
Publication date
Oct 7, 2004
DENSO Corporation
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having controlled surface roughness and method...
Publication number
20040119088
Publication date
Jun 24, 2004
DENSO Corporation
Yutaka Fukuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor power device
Publication number
20030122232
Publication date
Jul 3, 2003
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Load drive circuit using flywheel diode
Publication number
20030107905
Publication date
Jun 12, 2003
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20030003692
Publication date
Jan 2, 2003
Mikimasa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal oxide semiconductor transistor and manufacturing method for t...
Publication number
20020195651
Publication date
Dec 26, 2002
Shoji Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power MOS transistor having capability for setting substrate potent...
Publication number
20020185681
Publication date
Dec 12, 2002
Takashi Nakano
H01 - BASIC ELECTRIC ELEMENTS