Shoriki Narita

Person

Hirakata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Receiver for component feed plates and component feeder
- Patent number 7,806,642
- Issue date Oct 5, 2010
- Panasonic Corporation
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 7,797,820
- Issue date Sep 21, 2010
- Panasonic Corporation
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component feeder
- Patent number 7,731,469
- Issue date Jun 8, 2010
- Panasonic Corporation
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component supply head device and component mounting head device
- Patent number 7,650,691
- Issue date Jan 26, 2010
- Panasonic Corporation
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer expanding device, component feeder, and expanding method for...
- Patent number 7,552,528
- Issue date Jun 30, 2009
- Panasonic Corporation
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,516,878
- Issue date Apr 14, 2009
- Panasonic Corporation
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool exchange device and tool
- Patent number 7,452,315
- Issue date Nov 18, 2008
- Panasonic Corporation
- Kanji Hata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 7,387,229
- Issue date Jun 17, 2008
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 7,353,596
- Issue date Apr 8, 2008
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component feeding head apparatus, for holding a component arrayed
- Patent number 7,350,289
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool exchange device and tool
- Patent number 7,306,551
- Issue date Dec 11, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kanji Hata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,052,984
- Issue date May 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for correcting inclination of IC on semiconduc...
- Patent number 7,031,509
- Issue date Apr 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump forming apparatus for charge appearance semiconductor substrat...
- Patent number 7,014,092
- Issue date Mar 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...
- Patent number 7,005,368
- Issue date Feb 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...
- Patent number 6,818,975
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 6,787,391
- Issue date Sep 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,568,580
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,494,358
- Issue date Dec 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,392,202
- Issue date May 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,329,640
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,302,317
- Issue date Oct 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method and bump bonder
- Patent number 6,098,868
- Issue date Aug 8, 2000
- Masushita Electric Industrial Co., Ltd.
- Takaharu Mae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board positioning apparatus
- Patent number 5,955,876
- Issue date Sep 21, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- G01 - MEASURING TESTING
Information Patent Grant
Component collective and component collective feeding apparatus
- Patent number 5,769,236
- Issue date Jun 23, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshio Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board positioning method and apparatus of the methods
- Patent number 5,648,729
- Issue date Jul 15, 1997
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE
- Publication number 20100064510
- Publication date Mar 18, 2010
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20080179378
- Publication date Jul 31, 2008
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting apparatus and component mounting method
- Publication number 20080163481
- Publication date Jul 10, 2008
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for moving a mounting head unit
- Publication number 20080141526
- Publication date Jun 19, 2008
- Shoriki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL EXCHANGE DEVICE AND TOOL
- Publication number 20080058186
- Publication date Mar 6, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kanji Hata
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Component Supply Head Device And Component Mounting Head Device
- Publication number 20080040917
- Publication date Feb 21, 2008
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Expanding Device, Component Feeder, and Expanding Method for...
- Publication number 20080010818
- Publication date Jan 17, 2008
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Receiver for Component Feed Plates and Component Feeder
- Publication number 20070227941
- Publication date Oct 4, 2007
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tool exchange device and tool
- Publication number 20060270539
- Publication date Nov 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kanji Hata
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Parts packaging device and parts packaging method
- Publication number 20060185157
- Publication date Aug 24, 2006
- Satoshi Shida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component feeding head apparatus, component feeding apparatus, comp...
- Publication number 20060104754
- Publication date May 18, 2006
- Shoriki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump formation method and bump forming apparatus for semiconductor...
- Publication number 20060102701
- Publication date May 18, 2006
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parts feeder
- Publication number 20060054656
- Publication date Mar 16, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20040149803
- Publication date Aug 5, 2004
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump forming apparatus for charge appearance semiconductor substrat...
- Publication number 20040035849
- Publication date Feb 26, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and bump forming apparatus to semiconductor w...
- Publication number 20040020973
- Publication date Feb 5, 2004
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for correcting inclination of IC on semiconduc...
- Publication number 20020061129
- Publication date May 23, 2002
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Publication number 20020011479
- Publication date Jan 31, 2002
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042771
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042772
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS

Shoriki Narita

Person

Patents Grantslast 30 patents

Receiver for component feed plates and component feeder

Component mounting apparatus

Component feeder

Component supply head device and component mounting head device

Wafer expanding device, component feeder, and expanding method for...

Bump formation method and bump forming apparatus for semiconductor...

Tool exchange device and tool

Method of forming bumps on a wafer utilizing a post-heating operati...

Component mounting method

Apparatus and method for forming bump

Component feeding head apparatus, for holding a component arrayed

Tool exchange device and tool

Bump formation method and bump forming apparatus for semiconductor...

Method and apparatus for correcting inclination of IC on semiconduc...

Bump forming apparatus for charge appearance semiconductor substrat...

BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...

Device and method for forming bump

ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...

Method of forming bumps on a wafer utilizing a post-heating operati...

Bump bonding apparatus and method

Bump bonding apparatus and method

Heating apparatus for bump bonding, bump bonding method and bump fo...

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Bump forming method and bump bonder

Board positioning apparatus

Component collective and component collective feeding apparatus

Board positioning method and apparatus of the methods

Patents Applicationslast 30 patents

COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE

Method of forming bumps on a wafer utilizing a post-heating operati...

Component mounting apparatus and component mounting method

Method for moving a mounting head unit

TOOL EXCHANGE DEVICE AND TOOL

Component Supply Head Device And Component Mounting Head Device

Wafer Expanding Device, Component Feeder, and Expanding Method for...

Receiver for Component Feed Plates and Component Feeder

Tool exchange device and tool

Parts packaging device and parts packaging method

Component feeding head apparatus, component feeding apparatus, comp...

Bump formation method and bump forming apparatus for semiconductor...

Parts feeder

Apparatus and method for forming bump

Method of forming bumps on a wafer utilizing a post-heating operati...

Device and method for forming bump

Bump forming apparatus for charge appearance semiconductor substrat...

Bump formation method and bump forming apparatus to semiconductor w...

Method and apparatus for correcting inclination of IC on semiconduc...

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Bump bonding apparatus and method