Shwang-Min Jeng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 12,154,822
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 11,664,268
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 11,069,558
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 10,510,580
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming interconnect structure using plasma treated metal hard mask
- Patent number 10,312,107
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polisher, polishing tool, and polishing method
- Patent number 10,144,109
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Chun Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Automatically adjusting baking process for low-k dielectric material
- Patent number 9,589,856
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal conductor chemical mechanical polish
- Patent number 9,368,452
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Soon-Kang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatically adjusting baking process for low-k dielectric material
- Patent number 9,196,551
- Issue date Nov 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k interconnect structures with reduced RC delay
- Patent number 9,087,877
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for active energy assist baking
- Patent number 9,004,914
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k Cu barriers in damascene interconnect structures
- Patent number 8,993,435
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment in the formation of interconnect structure
- Patent number 8,877,083
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing low-k dielectrics for improving mechanical strength
- Patent number 8,853,858
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming contact plugs
- Patent number 8,703,612
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal conductor chemical mechanical polish
- Patent number 8,673,783
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huang Soon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for active energy assist baking
- Patent number 8,481,412
- Issue date Jul 9, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 8,324,731
- Issue date Dec 4, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Curing low-k dielectrics for improving mechanical strength
- Patent number 8,258,629
- Issue date Sep 4, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post etch dielectric film re-capping layer
- Patent number 8,105,947
- Issue date Jan 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shwang-Ming Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extreme low-K dielectric film scheme for advanced interconnects
- Patent number RE42514
- Issue date Jul 5, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Wen Tsai
- 257 - Active solid-state devices
Information Patent Grant
Method for preventing low-k dielectric layer cracking in multi-laye...
- Patent number RE41935
- Issue date Nov 16, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chyang Pan
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Method for local hot spot fixing
- Patent number 7,805,692
- Issue date Sep 28, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shwang-Ming Jeng
- G01 - MEASURING TESTING
Information Patent Grant
Interconnects containing bilayer porous low-k dielectrics using dif...
- Patent number 7,723,226
- Issue date May 25, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads and methods for fabricating the same
- Patent number 7,646,097
- Issue date Jan 12, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Extreme low-k dielectric film scheme for advanced interconnect
- Patent number 7,626,245
- Issue date Dec 1, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,485,949
- Issue date Feb 3, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dielectric film to improve adhesion of low-k film
- Patent number 7,465,676
- Issue date Dec 16, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CxHy sacrificial layer for cu/low-k interconnects
- Patent number 7,365,026
- Issue date Apr 29, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shwang-Ming Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite etching stop in semiconductor process integration
- Patent number 7,042,049
- Issue date May 9, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lain-Jong Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20240387240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20230253240
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20210375667
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY FIN STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20200118867
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY FIN STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190103304
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHER, POLISHING TOOL, AND POLISHING METHOD
- Publication number 20170190017
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Chun TSAI
- B24 - GRINDING POLISHING
Information Patent Application
Automatically Adjusting Baking Process for Low-k Dielectric Material
- Publication number 20160086865
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Conductor Chemical Mechanical Polish
- Publication number 20140159243
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Soon-Kang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment in the Formation of Interconnect Structure
- Publication number 20140141611
- Publication date May 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND APPARATUS FOR ACTIVE ENERGY ASSIST BAKING
- Publication number 20130273732
- Publication date Oct 17, 2013
- Chung-Chi KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Contact Plugs
- Publication number 20130065394
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming the Same
- Publication number 20130062774
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automatically adjusting baking process for low-k dielectric material
- Publication number 20130052755
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curing Low-k Dielectrics for Improving Mechanical Strength
- Publication number 20120306098
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND APPARATUS FOR ACTIVE ENERGY ASSIST BAKING
- Publication number 20120077339
- Publication date Mar 29, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CONDUCTOR CHEMICAL MECHANICAL POLISH
- Publication number 20120001262
- Publication date Jan 5, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huang Soon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k Cu Barriers in Damascene Interconnect Structures
- Publication number 20110223759
- Publication date Sep 15, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post Etch Dielectric Film Re-Capping Layer
- Publication number 20100120253
- Publication date May 13, 2010
- Shwang-Ming Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20100065969
- Publication date Mar 18, 2010
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for Improving the Reliability of Low-k Dielectric Materials
- Publication number 20090258487
- Publication date Oct 15, 2009
- Keng-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curing Low-k Dielectrics for Improving Mechanical Strength
- Publication number 20090250792
- Publication date Oct 8, 2009
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME LOW-K DIELECTRIC FILM SCHEME FOR ADVANCED INTERCONNECTS
- Publication number 20090166817
- Publication date Jul 2, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang-Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080272493
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peeling-free porous capping material
- Publication number 20080188074
- Publication date Aug 7, 2008
- I-I Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects containing bilayer porous low-k dielectrics using dif...
- Publication number 20080171431
- Publication date Jul 17, 2008
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Initiation layer for reducing stress transition due to curing
- Publication number 20080116578
- Publication date May 22, 2008
- Kuan-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k interconnect structures with reduced RC delay
- Publication number 20080096380
- Publication date Apr 24, 2008
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Local Hot Spot Fixing
- Publication number 20070264731
- Publication date Nov 15, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shwang-Ming Jeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for forming dielectric film to improve adhesion of low-k film
- Publication number 20070249159
- Publication date Oct 25, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pads and methods for fabricating the same
- Publication number 20070080460
- Publication date Apr 12, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Shwang-Min Jeng

Person

Patents Grantslast 30 patents

Dummy fin structures and methods of forming same

Dummy fin structures and methods of forming same

Dummy fin structures and methods of forming same

Dummy fin structures and methods of forming same

Forming interconnect structure using plasma treated metal hard mask

Polisher, polishing tool, and polishing method

Automatically adjusting baking process for low-k dielectric material

Metal conductor chemical mechanical polish

Automatically adjusting baking process for low-k dielectric material

Low-k interconnect structures with reduced RC delay

Method of and apparatus for active energy assist baking

Low-k Cu barriers in damascene interconnect structures

Surface treatment in the formation of interconnect structure

Curing low-k dielectrics for improving mechanical strength

Process for forming contact plugs

Metal conductor chemical mechanical polish

Method of and apparatus for active energy assist baking

Integrated circuit device

Curing low-k dielectrics for improving mechanical strength

Post etch dielectric film re-capping layer

Extreme low-K dielectric film scheme for advanced interconnects

Method for preventing low-k dielectric layer cracking in multi-laye...

Method for local hot spot fixing

Interconnects containing bilayer porous low-k dielectrics using dif...

Bond pads and methods for fabricating the same

Extreme low-k dielectric film scheme for advanced interconnect

Semiconductor device

Method for forming dielectric film to improve adhesion of low-k film

CxHy sacrificial layer for cu/low-k interconnects

Composite etching stop in semiconductor process integration

Patents Applicationslast 30 patents

Dummy Fin Structures and Methods of Forming Same

Dummy Fin Structures and Methods of Forming Same

Dummy Fin Structures and Methods of Forming Same

DUMMY FIN STRUCTURES AND METHODS OF FORMING SAME

DUMMY FIN STRUCTURES AND METHODS OF FORMING SAME

POLISHER, POLISHING TOOL, AND POLISHING METHOD

Automatically Adjusting Baking Process for Low-k Dielectric Material

Metal Conductor Chemical Mechanical Polish

Surface Treatment in the Formation of Interconnect Structure

METHOD OF AND APPARATUS FOR ACTIVE ENERGY ASSIST BAKING

Process for Forming Contact Plugs

Semiconductor Device and Method for Forming the Same

Automatically adjusting baking process for low-k dielectric material

Curing Low-k Dielectrics for Improving Mechanical Strength

METHOD OF AND APPARATUS FOR ACTIVE ENERGY ASSIST BAKING

METAL CONDUCTOR CHEMICAL MECHANICAL POLISH

Low-k Cu Barriers in Damascene Interconnect Structures

Post Etch Dielectric Film Re-Capping Layer

Integrated circuit device

Method for Improving the Reliability of Low-k Dielectric Materials

Curing Low-k Dielectrics for Improving Mechanical Strength

EXTREME LOW-K DIELECTRIC FILM SCHEME FOR ADVANCED INTERCONNECTS

Semiconductor device

Peeling-free porous capping material

Interconnects containing bilayer porous low-k dielectrics using dif...

Initiation layer for reducing stress transition due to curing

Low-k interconnect structures with reduced RC delay

Method for Local Hot Spot Fixing

Method for forming dielectric film to improve adhesion of low-k film

Bond pads and methods for fabricating the same