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Kaohsiung, TW
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last 30 patents
Information
Patent Grant
Wire-bonding method for wire-bonding apparatus
Patent number
7,581,666
Issue date
Sep 1, 2009
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
Patent number
7,547,575
Issue date
Jun 16, 2009
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate and manufacturing method thereof
Patent number
7,445,944
Issue date
Nov 4, 2008
ASE (Shanghai) Inc.
Ho-Ming Tong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Packaging substrate and manufacturing method thereof
Publication number
20080124836
Publication date
May 29, 2008
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire-bonding method for wire-bonding apparatus
Publication number
20080102539
Publication date
May 1, 2008
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
Publication number
20080085571
Publication date
Apr 10, 2008
Advanced Semiconductor Engeneering, Inc.
Ho-Ming Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging substrate and method of manufacturing the same
Publication number
20080044931
Publication date
Feb 21, 2008
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire-bonding apparatus and wire-bonding method thereof
Publication number
20080035706
Publication date
Feb 14, 2008
Advanced Semiconductor Engineering, Inc.
Ho-Ming Tong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR