Srinivas V. Pietambaram

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optimization for raster scanning
- Patent number 12,354,931
- Issue date Jul 8, 2025
- Intel Corporation
- Vinith Bejugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass interposer optical switching device and method
- Patent number 12,353,070
- Issue date Jul 8, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Die last and waveguide last architecture for silicon photonic packa...
- Patent number 12,345,932
- Issue date Jul 1, 2025
- Intel Corporation
- Bai Nie
- G02 - OPTICS
Information Patent Grant
Optical circuit with optical port in sidewall
- Patent number 12,345,931
- Issue date Jul 1, 2025
- Intel Corporation
- Eric J. M. Moret
- G02 - OPTICS
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrates having signal shielding for use with semiconductor...
- Patent number 12,347,788
- Issue date Jul 1, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
- Patent number 12,334,422
- Issue date Jun 17, 2025
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-plane inductors in IC packages
- Patent number 12,336,197
- Issue date Jun 17, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including glass cores
- Patent number 12,327,797
- Issue date Jun 10, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass interposer optical resonator device and method
- Patent number 12,306,480
- Issue date May 20, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless electronic substrates having embedded inductors
- Patent number 12,272,484
- Issue date Apr 8, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive vias for electronic substrates
- Patent number 12,243,825
- Issue date Mar 4, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled inductor with small form factor
- Patent number 12,224,103
- Issue date Feb 11, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel level packaging for multi-die products interconnected with ve...
- Patent number 12,218,071
- Issue date Feb 4, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested interposer with through-silicon via bridge die
- Patent number 12,218,040
- Issue date Feb 4, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 12,176,223
- Issue date Dec 24, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,990,427
- Issue date May 21, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
- Publication number 20250219002
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
- Publication number 20250218905
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...
- Publication number 20250216636
- Publication date Jul 3, 2025
- Intel Corporation
- Vinod ADIVARAHAN
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...
- Publication number 20250218911
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
- Publication number 20250218915
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS

Srinivas V. Pietambaram

Person

Patents Grantslast 30 patents

Optimization for raster scanning

Glass interposer optical switching device and method

Die last and waveguide last architecture for silicon photonic packa...

Optical circuit with optical port in sidewall

Capacitors in through glass vias

Glass substrates having signal shielding for use with semiconductor...

Methods and apparatus to reduce defects in interconnects between se...

In-plane inductors in IC packages

Microelectronic structures including glass cores

Glass interposer optical resonator device and method

Chiplet first architecture for die tiling applications

Inorganic-based embedded-die layers for modular semiconductive devices

Heterogeneous nested interposer package for IC chips

Coreless electronic substrates having embedded inductors

Electronic substrate having an embedded etch stop to control cavity...

Microelectronic assemblies having integrated magnetic core inductors

Hybrid conductive vias for electronic substrates

Substrate embedded magnetic core inductors and method of making

Angled inductor with small form factor

Panel level packaging for multi-die products interconnected with ve...

Nested interposer with through-silicon via bridge die

Heterogeneous nested interposer package for IC chips

Hybrid glass core for wafer level and panel level packaging applica...

Integrated circuit package supports

Radio frequency antennas and waveguides for communication between i...

Electrical interconnect bridge

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Embedded die microelectronic device with molded component

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Chiplet first architecture for die tiling applications

Patents Applicationslast 30 patents

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

Technologies for Components Embedded in a Substrate Core

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...