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Srinivas V. Pietambaram
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Etch barrier for microelectronic packaging conductive structures
Patent number
11,948,898
Issue date
Apr 2, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
Patent number
11,935,857
Issue date
Mar 19, 2024
Intel Corporation
Kristof Darmawaikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to form high capacitance thin film capacitors (TFCs) as embe...
Patent number
11,929,212
Issue date
Mar 12, 2024
Intel Corporation
Sameer Paital
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patternable die attach materials and processes for patterning
Patent number
11,923,312
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die architecture and method of making
Patent number
11,901,248
Issue date
Feb 13, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patch accommodating embedded dies having different thicknesses
Patent number
11,862,619
Issue date
Jan 2, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitors with nanoislands on conductive plates
Patent number
11,855,125
Issue date
Dec 26, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package supports
Patent number
11,854,834
Issue date
Dec 26, 2023
Intel Corporation
Kristof Kuwawi Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
11,824,018
Issue date
Nov 21, 2023
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive route patterning for electronic substrates
Patent number
11,817,349
Issue date
Nov 14, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layered adhesion promotion films
Patent number
11,810,859
Issue date
Nov 7, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
Patent number
11,798,887
Issue date
Oct 24, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnect bridge
Patent number
11,791,269
Issue date
Oct 17, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass dielectric layer with patterning
Patent number
11,780,210
Issue date
Oct 10, 2023
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,769,735
Issue date
Sep 26, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
Patent number
11,756,890
Issue date
Sep 12, 2023
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetoresistive stacks with an unpinned, fixed synthetic anti-ferr...
Patent number
11,744,161
Issue date
Aug 29, 2023
EVERSPIN TECHNOLOGIES, INC.
Srinivas V. Pietambaram
G11 - INFORMATION STORAGE
Information
Patent Grant
Panel level packaging for multi-die products interconnected with ve...
Patent number
11,735,531
Issue date
Aug 22, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
11,735,533
Issue date
Aug 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
Patent number
11,728,265
Issue date
Aug 15, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromigration resistant and profile consistent contact arrays
Patent number
11,699,648
Issue date
Jul 11, 2023
Tahoe Research, LTD.
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sandwich-molded cores for high-inductance architectures
Patent number
11,622,448
Issue date
Apr 4, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded embedded bridge including routing layers for enhanced EMIB a...
Patent number
11,600,563
Issue date
Mar 7, 2023
Intel Corporation
Srinivas Venkata Ramanuja Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package architecture utilizing photoimageable dielectric (PID) for...
Patent number
11,574,874
Issue date
Feb 7, 2023
Intel Corporation
Robert A. May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package architecture with tunable magnetic properties for embedded...
Patent number
11,574,993
Issue date
Feb 7, 2023
Intel Corporation
Rengarajan Shanmugam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with high-density interconnect layer having pilla...
Patent number
11,532,584
Issue date
Dec 20, 2022
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Density-graded adhesion layer for conductors
Patent number
11,508,676
Issue date
Nov 22, 2022
Intel Corporation
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
Patent number
11,488,918
Issue date
Nov 1, 2022
Intel Corporation
Kristof Darmawaikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
Patent number
11,443,885
Issue date
Sep 13, 2022
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-permeability magnetic-dielectric film-based inductors
Patent number
11,380,472
Issue date
Jul 5, 2022
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
Publication number
20240128138
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240128205
Publication date
Apr 18, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...
Publication number
20240128247
Publication date
Apr 18, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Publication number
20240120305
Publication date
Apr 11, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
Publication number
20240114622
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Publication number
20240114623
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
Publication number
20240113048
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INT...
Publication number
20240111093
Publication date
Apr 4, 2024
Intel Corporation
Benjamin Duong
G02 - OPTICS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240113072
Publication date
Apr 4, 2024
Intel Corporation
Whitney Bryks
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
Publication number
20240113158
Publication date
Apr 4, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS
Publication number
20240112973
Publication date
Apr 4, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDIS...
Publication number
20240113075
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
Publication number
20240111090
Publication date
Apr 4, 2024
Intel Corporation
Robert A. May
G02 - OPTICS
Information
Patent Application
PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE
Publication number
20240111092
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. MARIN
G02 - OPTICS
Information
Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
Publication number
20240113046
Publication date
Apr 4, 2024
Intel Corporation
Jason Scott Steill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...
Publication number
20240113047
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112971
Publication date
Apr 4, 2024
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...
Publication number
20240113000
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
Publication number
20240114627
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER
Publication number
20240112972
Publication date
Apr 4, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...
Publication number
20240112999
Publication date
Apr 4, 2024
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
Publication number
20240113005
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES
Publication number
20240113007
Publication date
Apr 4, 2024
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BR...
Publication number
20240113029
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
Publication number
20240113087
Publication date
Apr 4, 2024
Intel Corporation
Brandon Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
Publication number
20240101413
Publication date
Mar 28, 2024
Intel Corporation
Jeremy D. Ecton
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS
Publication number
20240105625
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...
Publication number
20240105571
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS