Stan Tsai

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing pad edge extension
- Patent number 9,238,293
- Issue date Jan 19, 2016
- Applied Materials, Inc.
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Closed-loop control for improved polishing pad profiles
- Patent number 9,138,860
- Issue date Sep 22, 2015
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Method for compensation of variability in chemical mechanical polis...
- Patent number 8,758,085
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Closed-loop control for effective pad conditioning
- Patent number 8,337,279
- Issue date Dec 25, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Closed loop control of pad profile based on metrology feedback
- Patent number 8,221,193
- Issue date Jul 17, 2012
- Applied Materials, Inc.
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ performance prediction of pad conditioning disk by closed l...
- Patent number 8,096,852
- Issue date Jan 17, 2012
- Applied Materials, Inc.
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition for electrochemically polishing a conductive...
- Patent number 7,879,255
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Huyen Karen Tran
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for local polishing control
- Patent number 7,842,169
- Issue date Nov 30, 2010
- Applied Materials, Inc.
- Stan Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for evaluating polishing pad conditioning
- Patent number 7,699,972
- Issue date Apr 20, 2010
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrochemical mechanical processing
- Patent number 7,678,245
- Issue date Mar 16, 2010
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer polishing pad
- Patent number 7,654,885
- Issue date Feb 2, 2010
- Applied Materials, Inc.
- Stan D. Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and composition for conductive material removal by electroc...
- Patent number 7,582,564
- Issue date Sep 1, 2009
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrochemically mechanically polishing a conductive ma...
- Patent number 7,576,007
- Issue date Aug 18, 2009
- Applied Materials, Inc.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacts for electrochemical processing
- Patent number 7,569,134
- Issue date Aug 4, 2009
- Applied Materials, Inc.
- Paul Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical method for Ecmp polishing pad conditioning
- Patent number 7,504,018
- Issue date Mar 17, 2009
- Applied Materials, Inc.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full sequence metal and barrier layer electrochemical mechanical pr...
- Patent number 7,446,041
- Issue date Nov 4, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electroprocessing a substrate with edge pr...
- Patent number 7,422,982
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,422,516
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,390,744
- Issue date Jun 24, 2008
- Applied Materials, Inc.
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolyte with good planarization capability, high removal rate a...
- Patent number 7,384,534
- Issue date Jun 10, 2008
- Applied Materials, Inc.
- Lizhong Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,374,644
- Issue date May 20, 2008
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for chemical mechanical polishing of semicondu...
- Patent number 7,375,023
- Issue date May 20, 2008
- Applied Materials, Inc.
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive pad with ion exchange membrane for electrochemical mecha...
- Patent number 7,344,432
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Liang-Yun Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Pad assembly for electrochemical mechanical processing
- Patent number 7,344,431
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,323,416
- Issue date Jan 29, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,311,592
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Contacts for electrochemical processing
- Patent number 7,303,662
- Issue date Dec 4, 2007
- Applied Materials, Inc.
- Rashid Mavliev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad assembly for electrochemical mechanical polishing
- Patent number 7,285,036
- Issue date Oct 23, 2007
- Applied Materials, Inc.
- Shou-Sung Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,278,911
- Issue date Oct 9, 2007
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,232,514
- Issue date Jun 19, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE
- Publication number 20130122783
- Publication date May 16, 2013
- Applied Materials, Inc.
- Gregory E. Menk
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL ME...
- Publication number 20120100779
- Publication date Apr 26, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
CLOSED-LOOP CONTROL OF CMP SLURRY FLOW
- Publication number 20120009847
- Publication date Jan 12, 2012
- Applied Materials, Inc.
- Gregory E. Menk
- B24 - GRINDING POLISHING
Information Patent Application
CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES
- Publication number 20110256812
- Publication date Oct 20, 2011
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL
- Publication number 20110053465
- Publication date Mar 3, 2011
- STAN TSAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLISHING PAD EDGE EXTENSION
- Publication number 20100099339
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- HUNG Cih CHEN
- B24 - GRINDING POLISHING
Information Patent Application
IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED L...
- Publication number 20100035525
- Publication date Feb 11, 2010
- SAMEER Deshpande
- B24 - GRINDING POLISHING
Information Patent Application
CLOSED LOOP CONTROL OF PAD PROFILE BASED ON METROLOGY FEEDBACK
- Publication number 20100035518
- Publication date Feb 11, 2010
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Application
CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING
- Publication number 20090318060
- Publication date Dec 24, 2009
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
PAD PROPERTIES USING NANOPARTICLE ADDITIVES
- Publication number 20090278081
- Publication date Nov 12, 2009
- Applied Materials, Inc.
- Hichem M'Saad
- B24 - GRINDING POLISHING
Information Patent Application
Pad for electrochemical processing
- Publication number 20090120803
- Publication date May 14, 2009
- Paul Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE CONTROL FOR ECMP PROCESS
- Publication number 20090036032
- Publication date Feb 5, 2009
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20090008600
- Publication date Jan 8, 2009
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING
- Publication number 20080293343
- Publication date Nov 27, 2008
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20080156657
- Publication date Jul 3, 2008
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Polishing Article for Electrochemical Mechanical Polishing
- Publication number 20080108288
- Publication date May 8, 2008
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...
- Publication number 20080045021
- Publication date Feb 21, 2008
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20080035882
- Publication date Feb 14, 2008
- Junzi Zhao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL
- Publication number 20080035474
- Publication date Feb 14, 2008
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20080026681
- Publication date Jan 31, 2008
- PAUL D. BUTTERFIELD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS CONTROL IN ELECTRO-CHEMICAL MECHANICAL POLISHING
- Publication number 20080017521
- Publication date Jan 24, 2008
- ANTOINE P. MANENS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for conditioning a polishing pad
- Publication number 20080020682
- Publication date Jan 24, 2008
- Applied Materilas, Inc.
- Renhe Jia
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for electroprocessing a substrate with edge pr...
- Publication number 20080014709
- Publication date Jan 17, 2008
- APPLIED MATERIALS, INC.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20070295611
- Publication date Dec 27, 2007
- FENG Q. LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20070254485
- Publication date Nov 1, 2007
- Daxin Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for high copper removal rate with good planarization and su...
- Publication number 20070235344
- Publication date Oct 11, 2007
- APPLIED MATERIALS, INC.
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature control for ECMP process
- Publication number 20070227901
- Publication date Oct 4, 2007
- APPLIED MATERIALS, INC.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for evaluating polishing pad conditioning
- Publication number 20070209946
- Publication date Sep 13, 2007
- APPLIED MATERIALS, INC.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for foam removal in an electrochemical mechani...
- Publication number 20070181442
- Publication date Aug 9, 2007
- APPLIED MATERIALS, INC.
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for electrochemical processing with pre-biased cells
- Publication number 20070158207
- Publication date Jul 12, 2007
- APPLIED MATERIALS, INC.
- Jie Diao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Polishing pad edge extension

Closed-loop control for improved polishing pad profiles

Method for compensation of variability in chemical mechanical polis...

Closed-loop control for effective pad conditioning

Closed loop control of pad profile based on metrology feedback

In-situ performance prediction of pad conditioning disk by closed l...

Method and composition for electrochemically polishing a conductive...

Method and apparatus for local polishing control

Method and apparatus for evaluating polishing pad conditioning

Method and apparatus for electrochemical mechanical processing

Multi-layer polishing pad

Process and composition for conductive material removal by electroc...

Method for electrochemically mechanically polishing a conductive ma...

Contacts for electrochemical processing

Electrochemical method for Ecmp polishing pad conditioning

Full sequence metal and barrier layer electrochemical mechanical pr...

Method and apparatus for electroprocessing a substrate with edge pr...

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Electrolyte with good planarization capability, high removal rate a...

Conductive polishing article for electrochemical mechanical polishing

Method and apparatus for chemical mechanical polishing of semicondu...

Conductive pad with ion exchange membrane for electrochemical mecha...

Pad assembly for electrochemical mechanical processing

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Contacts for electrochemical processing

Pad assembly for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Patents Applicationslast 30 patents

PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE

APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL ME...

CLOSED-LOOP CONTROL OF CMP SLURRY FLOW

CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES

METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL

POLISHING PAD EDGE EXTENSION

IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED L...

CLOSED LOOP CONTROL OF PAD PROFILE BASED ON METROLOGY FEEDBACK

CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING

PAD PROPERTIES USING NANOPARTICLE ADDITIVES

Pad for electrochemical processing

TEMPERATURE CONTROL FOR ECMP PROCESS

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

Conductive Polishing Article for Electrochemical Mechanical Polishing

DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...

COMPOSITION FOR POLISHING A SUBSTRATE

APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

PROCESS CONTROL IN ELECTRO-CHEMICAL MECHANICAL POLISHING

Method for conditioning a polishing pad

Method and apparatus for electroprocessing a substrate with edge pr...

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING

Process for high copper removal rate with good planarization and su...

Temperature control for ECMP process

Method and apparatus for evaluating polishing pad conditioning

Method and apparatus for foam removal in an electrochemical mechani...

Methods for electrochemical processing with pre-biased cells