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Stefan Hau-Riege
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Area X-ray or UV camera system for high-intensity beams
Patent number
7,672,430
Issue date
Mar 2, 2010
Lawrence Livermore National Security, LLC
Henry N. Chapman
G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information
Patent Grant
Method of doping a conductive layer near a via
Patent number
7,300,871
Issue date
Nov 27, 2007
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tamper to delay motion and decrease ionization of a sample during s...
Patent number
7,236,565
Issue date
Jun 26, 2007
The Regents of the University of California
Richard A. London
G01 - MEASURING TESTING
Information
Patent Grant
Method for characterizing mask defects using image reconstruction f...
Patent number
7,212,282
Issue date
May 1, 2007
The Regents of the University of California
Stefan Peter Hau-Riege
G01 - MEASURING TESTING
Information
Patent Grant
Method of making a semiconductor device that has copper damascene i...
Patent number
7,153,774
Issue date
Dec 26, 2006
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromigration-reliability improvement of dual damascene intercon...
Patent number
7,087,516
Issue date
Aug 8, 2006
Intel Corporation
Stefan P. Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct-patterned optical waveguides on amorphous silicon films
Patent number
6,925,216
Issue date
Aug 2, 2005
The Regents of the University of California
Steve Vernon
G02 - OPTICS
Information
Patent Grant
Wafer-bonding using solder and method of making the same
Patent number
6,870,262
Issue date
Mar 22, 2005
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor device that has copper damascene i...
Patent number
6,833,321
Issue date
Dec 21, 2004
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Determination of permeability of layer material within interconnect
Patent number
6,822,473
Issue date
Nov 23, 2004
Advanced Micro Devices, Inc.
Christine Hau-Riege
G01 - MEASURING TESTING
Information
Patent Grant
System and method for determining location of extrusion in intercon...
Patent number
6,768,323
Issue date
Jul 27, 2004
Advanced Micro Devices, Inc.
Christine Hau-Riege
G01 - MEASURING TESTING
Information
Patent Grant
Structure, system, and method for assessing electromigration permea...
Patent number
6,762,597
Issue date
Jul 13, 2004
Advanced Micro Devices, Inc.
Christine Hau-Riege
G01 - MEASURING TESTING
Information
Patent Grant
Electromigration-reliability improvement of dual damascene intercon...
Patent number
6,717,268
Issue date
Apr 6, 2004
Intel Corporation
Stefan P. Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-bonding using solder and method of making the same
Patent number
6,667,225
Issue date
Dec 23, 2003
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor device that has copper damascene i...
Patent number
6,579,795
Issue date
Jun 17, 2003
Intel Corporation
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Area x-ray or UV camera system for high-intensity beams
Publication number
20090116619
Publication date
May 7, 2009
Henry N. Chapman
G01 - MEASURING TESTING
Information
Patent Application
Method for repairing mask-blank defects using repair-zone compensation
Publication number
20060234135
Publication date
Oct 19, 2006
The Regents of the University of CA
Stefan P. Hau-Riege
B82 - NANO-TECHNOLOGY
Information
Patent Application
Tamper to delay motion and decrease ionization of a sample during s...
Publication number
20050276370
Publication date
Dec 15, 2005
The Regents of the University of California.
Richard A. London
G01 - MEASURING TESTING
Information
Patent Application
Method for characterizing mask defects using image reconstruction f...
Publication number
20050185173
Publication date
Aug 25, 2005
The Regents of the University of California.
Stefan Peter Hau-Riege
G01 - MEASURING TESTING
Information
Patent Application
Method of making a semiconductor device that has copper damascene i...
Publication number
20050095751
Publication date
May 5, 2005
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Direct-patterned optical waveguides on amorphous silicon films
Publication number
20040240821
Publication date
Dec 2, 2004
The Regents of the University of California.
Steve Vernon
G02 - OPTICS
Information
Patent Application
Electromigration-reliability improvement of dual damascene intercon...
Publication number
20040067638
Publication date
Apr 8, 2004
Stefan P. Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-bonding using solder and method of making the same
Publication number
20040056073
Publication date
Mar 25, 2004
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a semiconductor device that has copper damascene i...
Publication number
20030228753
Publication date
Dec 11, 2003
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a semiconductor device that has copper damascene i...
Publication number
20030194857
Publication date
Oct 16, 2003
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-bonding using solder and method of making the same
Publication number
20030113976
Publication date
Jun 19, 2003
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a semiconductor device that has copper damascene i...
Publication number
20030104692
Publication date
Jun 5, 2003
Stefan Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electromigration-reliability improvement of dual damascene intercon...
Publication number
20030089996
Publication date
May 15, 2003
Stefan P. Hau-Riege
H01 - BASIC ELECTRIC ELEMENTS