Stephan A. Cohen

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low-resistivity metallic interconnect structures
- Patent number 10,224,242
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing robustness of SOI substrate containing a buried N+ silico...
- Patent number 10,204,823
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing robustness of SOI substrate containing a buried N+ silico...
- Patent number 9,922,866
- Issue date Mar 20, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation for semiconductor devices
- Patent number 9,698,043
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect structure
- Patent number 9,613,900
- Issue date Apr 4, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect structure
- Patent number 9,281,211
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures containing nitrided metallic residues
- Patent number 9,006,895
- Issue date Apr 14, 2015
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures containing nitrided metallic residues
- Patent number 8,962,479
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered low k cap with conformal gap fill and UV stable compre...
- Patent number 8,536,069
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Mihaela Balseanu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multilayered low k cap with conformal gap fill and UV stable compre...
- Patent number 8,492,880
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Mihaela Balseanu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Engineered interconnect dielectric caps having compressive stress a...
- Patent number 8,362,596
- Issue date Jan 29, 2013
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a ceramic diffusion barrier layer
- Patent number 7,256,146
- Issue date Aug 14, 2007
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier with low dielectric constant and semiconductor de...
- Patent number 7,252,875
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DUV laser annealing and stabilization of SiCOH films
- Patent number 7,223,670
- Issue date May 29, 2007
- International Business Machines Corporation
- Alessandro C. Callegari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin, single phase, diffusion barrier for metal conductors
- Patent number 7,172,968
- Issue date Feb 6, 2007
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures incorporating low-k dielectric barrier films
- Patent number 6,940,173
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer and semiconductor device containing same
- Patent number 6,784,485
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low k dielectric materials with inherent copper ion migration barrier
- Patent number 6,730,618
- Issue date May 4, 2004
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated diffusion barrier
- Patent number 6,726,996
- Issue date Apr 27, 2004
- International Business Machines Corporation
- Edward Paul Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,577,011
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulator for integrated circuits and process
- Patent number 6,559,046
- Issue date May 6, 2003
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin, single phase, diffusion barrier for metal conductors
- Patent number 6,452,276
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low k dielectric materials with inherent copper ion migration barrier
- Patent number 6,414,377
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,184,121
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric TiO.sub.2 -SiN composite films for memory applications
- Patent number 6,014,310
- Issue date Jan 11, 2000
- International Business Machines Corporation
- Gary Bela Bronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric TiO.sub.2 -SiN composite films for memory applications
- Patent number 5,876,788
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Gary Bela Bronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond-like carbon for use in VLSI and ULSI interconnect systems
- Patent number 5,679,269
- Issue date Oct 21, 1997
- International Business Machines, Corp.
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond-like carbon for use in VLSI and ULSI interconnect systems
- Patent number 5,674,355
- Issue date Oct 7, 1997
- International Business Machines Corp.
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-free hydrogen silsesquioxane with dielectric constant less t...
- Patent number 5,530,293
- Issue date Jun 25, 1996
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCING ROBUSTNESS OF SOI SUBSTRATE CONTAINING A BURIED N+ SILICO...
- Publication number 20180122688
- Publication date May 3, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING ROBUSTNESS OF SOI SUBSTRATE CONTAINING A BURIED N+ SILICO...
- Publication number 20170033001
- Publication date Feb 2, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT STRUCTURE
- Publication number 20160148867
- Publication date May 26, 2016
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT STRUCTURE
- Publication number 20150228572
- Publication date Aug 13, 2015
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES CONTAINING NITRIDED METALLIC RESIDUES
- Publication number 20140332964
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES CONTAINING NITRIDED METALLIC RESIDUES
- Publication number 20140332960
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM FOR COMBINED METAL DEPOSITION AND REFLOW ANNEAL F...
- Publication number 20140216342
- Publication date Aug 7, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM FOR COMBINED METAL DEPOSITION AND REFLOW ANNEAL F...
- Publication number 20140220777
- Publication date Aug 7, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN...
- Publication number 20130333923
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTIPLE STEP ANNEAL METHOD AND SEMICONDUCTOR FORMED BY MULTIPLE ST...
- Publication number 20130049207
- Publication date Feb 28, 2013
- International Business Machines Corporation
- Eric G. Liniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRE...
- Publication number 20130005146
- Publication date Jan 3, 2013
- Applied Materials, Inc.
- Mihaela Balseanu
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SWITCHING DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20120313194
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRE...
- Publication number 20120248617
- Publication date Oct 4, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- B82 - NANO-TECHNOLOGY
Information Patent Application
ENGINEERED INTERCONNECT DIELECTRIC CAPS HAVING COMPRESSIVE STRESS A...
- Publication number 20110012238
- Publication date Jan 20, 2011
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS
- Publication number 20080230875
- Publication date Sep 25, 2008
- International Business Machines Corporation
- Alessandro C. Callegari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER WITH LOW DIELECTRIC CONSTANT AND SEMICONDUCTOR DE...
- Publication number 20070237970
- Publication date Oct 11, 2007
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUV laser annealing and stabilization of SiCOH films
- Publication number 20060040513
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Alessandro C. Callegari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures incorporating low-k dielectric barrier films
- Publication number 20050206004
- Publication date Sep 22, 2005
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures incorporating low-k dielectric barrier films
- Publication number 20050087876
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion barrier with low dielectric constant and semiconductor de...
- Publication number 20040115407
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for forming uniformly thick anodized films on...
- Publication number 20040077140
- Publication date Apr 22, 2004
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Integrated circuit over voltage protection
- Publication number 20020196594
- Publication date Dec 26, 2002
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra thin, single phase, diffusion barrier for metal conductors
- Publication number 20020175418
- Publication date Nov 28, 2002
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated diffusion barrier
- Publication number 20020172811
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Edward Paul Barth
- B32 - LAYERED PRODUCTS
Information Patent Application
Low k dielectric materials with inherent copper ion migration barrier
- Publication number 20020125549
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW K DIELECTRIC MATERIALS WITH INHERENT COPPER ION MIGRATION BARRIER
- Publication number 20020033534
- Publication date Mar 21, 2002
- STEPHAN ALAN COHEN
- H01 - BASIC ELECTRIC ELEMENTS

Stephan A. Cohen

Person

Patents Grantslast 30 patents

Low-resistivity metallic interconnect structures

Enhancing robustness of SOI substrate containing a buried N+ silico...

Enhancing robustness of SOI substrate containing a buried N+ silico...

Shallow trench isolation for semiconductor devices

Nanoscale interconnect structure

Nanoscale interconnect structure

Interconnect structures containing nitrided metallic residues

Interconnect structures containing nitrided metallic residues

Multilayered low k cap with conformal gap fill and UV stable compre...

Multilayered low k cap with conformal gap fill and UV stable compre...

Engineered interconnect dielectric caps having compressive stress a...

Method of forming a ceramic diffusion barrier layer

Diffusion barrier with low dielectric constant and semiconductor de...

DUV laser annealing and stabilization of SiCOH films

Ultra thin, single phase, diffusion barrier for metal conductors

Interconnect structures incorporating low-k dielectric barrier films

Diffusion barrier layer and semiconductor device containing same

Low k dielectric materials with inherent copper ion migration barrier

Laminated diffusion barrier

Chip interconnect wiring structure with low dielectric constant ins...

Insulator for integrated circuits and process

Ultra thin, single phase, diffusion barrier for metal conductors

Low k dielectric materials with inherent copper ion migration barrier

Chip interconnect wiring structure with low dielectric constant ins...

High dielectric TiO.sub.2 -SiN composite films for memory applications

High dielectric TiO.sub.2 -SiN composite films for memory applications

Diamond-like carbon for use in VLSI and ULSI interconnect systems

Diamond-like carbon for use in VLSI and ULSI interconnect systems

Carbon-free hydrogen silsesquioxane with dielectric constant less t...

Patents Applicationslast 30 patents

ENHANCING ROBUSTNESS OF SOI SUBSTRATE CONTAINING A BURIED N+ SILICO...

ENHANCING ROBUSTNESS OF SOI SUBSTRATE CONTAINING A BURIED N+ SILICO...

NANOSCALE INTERCONNECT STRUCTURE

NANOSCALE INTERCONNECT STRUCTURE

INTERCONNECT STRUCTURES CONTAINING NITRIDED METALLIC RESIDUES

INTERCONNECT STRUCTURES CONTAINING NITRIDED METALLIC RESIDUES

PROCESSING SYSTEM FOR COMBINED METAL DEPOSITION AND REFLOW ANNEAL F...

PROCESSING SYSTEM FOR COMBINED METAL DEPOSITION AND REFLOW ANNEAL F...

MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN...

MULTIPLE STEP ANNEAL METHOD AND SEMICONDUCTOR FORMED BY MULTIPLE ST...

MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRE...

SEMICONDUCTOR SWITCHING DEVICE AND METHOD OF MAKING THE SAME

MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRE...

ENGINEERED INTERCONNECT DIELECTRIC CAPS HAVING COMPRESSIVE STRESS A...

DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS

DIFFUSION BARRIER WITH LOW DIELECTRIC CONSTANT AND SEMICONDUCTOR DE...

DUV laser annealing and stabilization of SiCOH films

Interconnect structures incorporating low-k dielectric barrier films

Interconnect structures incorporating low-k dielectric barrier films

Diffusion barrier with low dielectric constant and semiconductor de...

Apparatus and method for forming uniformly thick anodized films on...

Integrated circuit over voltage protection

Ultra thin, single phase, diffusion barrier for metal conductors

Laminated diffusion barrier

Low k dielectric materials with inherent copper ion migration barrier

LOW K DIELECTRIC MATERIALS WITH INHERENT COPPER ION MIGRATION BARRIER