Stephan Grunow

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 10,229,875
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,893,011
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,685,404
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fuse structure for improved programming capability
- Patent number 9,425,144
- Issue date Aug 23, 2016
- GLOBALFOUNDRIES, INC.
- Griselda Bonilla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 9,360,525
- Issue date Jun 7, 2016
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
E-fuse structures and methods of manufacture
- Patent number 9,142,506
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundant via structure for metal fuse applications
- Patent number 9,093,164
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- G11 - INFORMATION STORAGE
Information Patent Grant
E-fuse structures and methods of manufacture
- Patent number 9,059,169
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fuse structure for improved programming capability
- Patent number 8,962,467
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Griselda Bonilla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fuse and integrated conductor
- Patent number 8,836,124
- Issue date Sep 16, 2014
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 8,742,766
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 8,633,707
- Issue date Jan 21, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- G01 - MEASURING TESTING
Information Patent Grant
Method for removing copper oxide layer
- Patent number 8,444,868
- Issue date May 21, 2013
- International Business Machines Corporation
- Tien-Jen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned patterned etch stop layers for semiconductor devices
- Patent number 8,367,544
- Issue date Feb 5, 2013
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping of copper interconnect lines in integrated circuit devices
- Patent number 8,298,948
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for integrated circuits having enhanced elec...
- Patent number 8,232,646
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Properties of metallic copper diffusion barriers through silicon su...
- Patent number 8,211,794
- Issue date Jul 3, 2012
- Texas Instruments Incorporated
- Valli Arunachalam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for integrated circuits having improved elec...
- Patent number 8,056,039
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures comprising capping layers with low dielectr...
- Patent number 8,026,166
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap free anchored conductor and dielectric structure and method for...
- Patent number 7,985,928
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact
- Patent number 7,888,252
- Issue date Feb 15, 2011
- International Business Machines Corporation
- Johnathan E. Faltermeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive structures
- Patent number 7,833,893
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Stephan Grunow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reduction of parasitic capacitances in s...
- Patent number 7,825,019
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabrication of on-chip heat pipes and ancillary heat tran...
- Patent number 7,781,884
- Issue date Aug 24, 2010
- Texas Instruments Incorporated
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability of wide interconnects
- Patent number 7,776,737
- Issue date Aug 17, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming electrically blown metal fuses for...
- Patent number 7,737,528
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable reliable diffusion-barrier
- Patent number 7,674,707
- Issue date Mar 9, 2010
- Texas Instruments Incorporated
- Noel M. Russell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Test structure for determining optimal seed and liner layer thickne...
- Patent number 7,671,362
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap in integrated circuit inductor fabrication
- Patent number 7,642,619
- Issue date Jan 5, 2010
- Texas Instruments Incorporated
- Phillip D. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for hybrid tungsten copper metal contact
- Patent number 7,629,264
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20160197039
- Publication date Jul 7, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END ELECTRICALLY PROGRAMMABLE FUSE
- Publication number 20160027733
- Publication date Jan 28, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20150235946
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY
- Publication number 20150137312
- Publication date May 21, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20140167772
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Application
E-FUSE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20140070362
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Griselda BONILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20140028325
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Application
Fuse and Integrated Conductor
- Publication number 20130234284
- Publication date Sep 12, 2013
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY
- Publication number 20130214894
- Publication date Aug 22, 2013
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END ELECTRICALLY PROGRAMMABLE FUSE
- Publication number 20130176073
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redundant Via Structure For Metal Fuse Applications
- Publication number 20130127584
- Publication date May 23, 2013
- International Business Machines Corporation
- Ronald G. Filippi
- G11 - INFORMATION STORAGE
Information Patent Application
E-FUSE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20120326269
- Publication date Dec 27, 2012
- International Business Machines Corporation
- GRISELDA BONILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Via Structure For Metal Fuse Applications
- Publication number 20120249159
- Publication date Oct 4, 2012
- International Business Machines Corporation
- Ronald G. Filippi
- G01 - MEASURING TESTING
Information Patent Application
Method for Removing Copper Oxide Layer
- Publication number 20110183520
- Publication date Jul 28, 2011
- International Business Machines Corporation
- Tien-Jen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING ENHANCED ELEC...
- Publication number 20110175226
- Publication date Jul 21, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping of Copper Interconnect Lines in Integrated Circuit Devices
- Publication number 20110108990
- Publication date May 12, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNED ETCH STOP LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20110092069
- Publication date Apr 21, 2011
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT
- Publication number 20100210098
- Publication date Aug 19, 2010
- International Business Machines Corporation
- Johnathan E. Faltermeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY OF WIDE INTERCONNECTS
- Publication number 20100038790
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...
- Publication number 20100038793
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...
- Publication number 20090294901
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...
- Publication number 20090294973
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP IN INTEGRATED CIRCUIT INDUCTOR FABRICATION
- Publication number 20090261453
- Publication date Oct 22, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Phillip D. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR HYBRID TUNGSTEN COPPER METAL CONTACT
- Publication number 20090256263
- Publication date Oct 15, 2009
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE RELIABLE DIFFUSION-BARRIER
- Publication number 20090166865
- Publication date Jul 2, 2009
- Noel M. RUSSELL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FREE ANCHORED CONDUCTOR AND DIELECTRIC STRUCTURE AND METHOD FOR...
- Publication number 20090151981
- Publication date Jun 18, 2009
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...
- Publication number 20090146143
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CU LINER FOR INTERCONNECTS USING A DOUBLE-BILAYER PROCESS...
- Publication number 20090098728
- Publication date Apr 16, 2009
- Stephan Grunow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCTION OF PARASITIC CAPACITANCES IN S...
- Publication number 20090085210
- Publication date Apr 2, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Tran...
- Publication number 20090085197
- Publication date Apr 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS

Stephan Grunow

Person

Patents Grantslast 30 patents

Stacked via structure for metal fuse applications

Back-end electrically programmable fuse

Back-end electrically programmable fuse

Metal fuse structure for improved programming capability

Stacked via structure for metal fuse applications

E-fuse structures and methods of manufacture

Redundant via structure for metal fuse applications

E-fuse structures and methods of manufacture

Metal fuse structure for improved programming capability

Fuse and integrated conductor

Stacked via structure for metal fuse applications

Stacked via structure for metal fuse applications

Method for removing copper oxide layer

Self-aligned patterned etch stop layers for semiconductor devices

Capping of copper interconnect lines in integrated circuit devices

Interconnect structure for integrated circuits having enhanced elec...

Properties of metallic copper diffusion barriers through silicon su...

Interconnect structure for integrated circuits having improved elec...

Interconnect structures comprising capping layers with low dielectr...

Gap free anchored conductor and dielectric structure and method for...

Self-aligned contact

Method for forming conductive structures

Structures and methods for reduction of parasitic capacitances in s...

Method of fabrication of on-chip heat pipes and ancillary heat tran...

Reliability of wide interconnects

Structure and method of forming electrically blown metal fuses for...

Manufacturable reliable diffusion-barrier

Test structure for determining optimal seed and liner layer thickne...

Air gap in integrated circuit inductor fabrication

Structure and method for hybrid tungsten copper metal contact

Patents Applicationslast 30 patents

STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS

BACK-END ELECTRICALLY PROGRAMMABLE FUSE

REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS

METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY

STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS

E-FUSE STRUCTURES AND METHODS OF MANUFACTURE

STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS

Fuse and Integrated Conductor

METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY

BACK-END ELECTRICALLY PROGRAMMABLE FUSE

Redundant Via Structure For Metal Fuse Applications

E-FUSE STRUCTURES AND METHODS OF MANUFACTURE

Stacked Via Structure For Metal Fuse Applications

Method for Removing Copper Oxide Layer

INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING ENHANCED ELEC...

Capping of Copper Interconnect Lines in Integrated Circuit Devices

SELF-ALIGNED PATTERNED ETCH STOP LAYERS FOR SEMICONDUCTOR DEVICES

SELF-ALIGNED CONTACT

RELIABILITY OF WIDE INTERCONNECTS

INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...

STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...

INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...

AIR GAP IN INTEGRATED CIRCUIT INDUCTOR FABRICATION

STRUCTURE AND METHOD FOR HYBRID TUNGSTEN COPPER METAL CONTACT

MANUFACTURABLE RELIABLE DIFFUSION-BARRIER

GAP FREE ANCHORED CONDUCTOR AND DIELECTRIC STRUCTURE AND METHOD FOR...

TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...

STRUCTURE CU LINER FOR INTERCONNECTS USING A DOUBLE-BILAYER PROCESS...

STRUCTURES AND METHODS FOR REDUCTION OF PARASITIC CAPACITANCES IN S...

Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Tran...