Stephan Stoeckl

Person

Schwandorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Stress relief die implementation
- Patent number 12,057,411
- Issue date Aug 6, 2024
- Intel Corporation
- Stephan Stoeckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
- Patent number 11,374,323
- Issue date Jun 28, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 10,403,602
- Issue date Sep 3, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bent-bridge semiconductive apparatus
- Patent number 10,141,265
- Issue date Nov 27, 2018
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for integrated circuit packages
- Patent number 9,368,461
- Issue date Jun 14, 2016
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for integrated circuit packages
- Patent number 9,299,672
- Issue date Mar 29, 2016
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with carrier element
- Patent number 7,709,936
- Issue date May 4, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for the production thereof
- Patent number 7,602,614
- Issue date Oct 13, 2009
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with a semiconductor chip which has flexible chip...
- Patent number 6,940,156
- Issue date Sep 6, 2005
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION
- Publication number 20240332251
- Publication date Oct 3, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROOVED PACKAGE
- Publication number 20230317536
- Publication date Oct 5, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
- Publication number 20230307313
- Publication date Sep 28, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
- Publication number 20230268286
- Publication date Aug 24, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
- Publication number 20230268291
- Publication date Aug 24, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF DIE IMPLEMENTATION
- Publication number 20210193594
- Publication date Jun 24, 2021
- Intel Corporation
- Stephan STOECKL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
- Publication number 20200144723
- Publication date May 7, 2020
- Intel IP Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...
- Publication number 20190341371
- Publication date Nov 7, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT ALIGNMENT DEVICE AND METHOD
- Publication number 20190103347
- Publication date Apr 4, 2019
- Georg Seidemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART ACCELEROMETER CANTILEVER
- Publication number 20190004083
- Publication date Jan 3, 2019
- Intell IP Corporation
- Sonja Koller
- G01 - MEASURING TESTING
Information Patent Application
MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...
- Publication number 20190006318
- Publication date Jan 3, 2019
- Intel Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20180277512
- Publication date Sep 27, 2018
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENT-BRIDGE SEMICONDUCTIVE APPARATUS
- Publication number 20180190589
- Publication date Jul 5, 2018
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20150333022
- Publication date Nov 19, 2015
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH CARRIER ELEMENT
- Publication number 20080112141
- Publication date May 15, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method for the production thereof
- Publication number 20060250781
- Publication date Nov 9, 2006
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component with cavity fillers made from thermoplast and...
- Publication number 20060088954
- Publication date Apr 27, 2006
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with a semiconductor chip which has flexible chip...
- Publication number 20040075172
- Publication date Apr 22, 2004
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Stephan Stoeckl

Person

Patents Grantslast 30 patents

Stress relief die implementation

Patch antennas stitched to systems in packages and methods of assem...

Monolithic silicon bridge stack including a hybrid baseband die sup...

Embedded-bridge substrate connectors and methods of assembling same

Monolithic silicon bridge stack including a hybrid baseband die sup...

Bent-bridge semiconductive apparatus

Contact pads for integrated circuit packages

Contact pads for integrated circuit packages

Module with carrier element

Electronic module and method for the production thereof

Electronic module with a semiconductor chip which has flexible chip...

Patents Applicationslast 30 patents

DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION

THIN CLIENT FORM FACTOR ASSEMBLY

GROOVED PACKAGE

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...

STRESS RELIEF DIE IMPLEMENTATION

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...

MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...

ELECTRONIC COMPONENT ALIGNMENT DEVICE AND METHOD

SMART ACCELEROMETER CANTILEVER

MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

BENT-BRIDGE SEMICONDUCTIVE APPARATUS

CONTACT PADS FOR INTEGRATED CIRCUIT PACKAGES

MODULE WITH CARRIER ELEMENT

Electronic module and method for the production thereof

Electronic component with cavity fillers made from thermoplast and...

Electronic module with a semiconductor chip which has flexible chip...