Stephen E. Lehman Jr.

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for forming plug and play metal catalysts
- Patent number 9,737,878
- Issue date Aug 22, 2017
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermoset polymides for microelectronic applications
- Patent number 9,646,903
- Issue date May 9, 2017
- Intel Corporation
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming plug and play metal compound catalysts
- Patent number 9,597,662
- Issue date Mar 21, 2017
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play oxide catalysts
- Patent number 9,592,492
- Issue date Mar 14, 2017
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play metal catalysts
- Patent number 9,302,260
- Issue date Apr 5, 2016
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play metal compound catalysts
- Patent number 9,186,663
- Issue date Nov 17, 2015
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
In situ oxide removal, dispersal and drying
- Patent number 9,119,309
- Issue date Aug 25, 2015
- SDCmaterials, Inc.
- Stephen Edward Lehman
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method and system for forming plug and play oxide catalysts
- Patent number 9,089,840
- Issue date Jul 28, 2015
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
In situ oxide removal, dispersal and drying for silicon SiO2
- Patent number 9,090,475
- Issue date Jul 28, 2015
- SDCmaterials, Inc.
- Stephen Edward Lehman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ oxide removal, dispersal and drying for copper copper-oxide
- Patent number 9,039,916
- Issue date May 26, 2015
- SDCmaterials, Inc.
- Stephen Edward Lehman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for forming plug and play metal catalysts
- Patent number 8,759,248
- Issue date Jun 24, 2014
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermoset polyimides for microelectronic applications
- Patent number 8,643,199
- Issue date Feb 4, 2014
- Intel Corporation
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming plug and play metal compound catalysts
- Patent number 8,575,059
- Issue date Nov 5, 2013
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play metal catalysts
- Patent number 8,507,401
- Issue date Aug 13, 2013
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play metal catalysts
- Patent number 8,507,402
- Issue date Aug 13, 2013
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and system for forming plug and play oxide catalysts
- Patent number 8,481,449
- Issue date Jul 9, 2013
- SDCmaterials, Inc.
- Maximilian A. Biberger
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,436,470
- Issue date May 7, 2013
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,291,548
- Issue date Nov 6, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,253,088
- Issue date Aug 7, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state metathesis chemistry
- Patent number 6,660,813
- Issue date Dec 9, 2003
- University of Florida
- Kenneth B. Wagener
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
OXYGEN SCAVENGING POLYMERS WITH IMPROVED HAZE CHARACTERISTICS
- Publication number 20250145821
- Publication date May 8, 2025
- AURIGA POLYMERS, INC.
- Stephen Edward Lehman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS
- Publication number 20170028393
- Publication date Feb 2, 2017
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL COMPOUND CATALYSTS
- Publication number 20160184802
- Publication date Jun 30, 2016
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY OXIDE CATALYSTS
- Publication number 20160144346
- Publication date May 26, 2016
- SDCMATERIALS, INC.
- Maximilian A. BIBERGER
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PARTICLE-BASED SYSTEMS FOR REMOVAL OF POLLUTANTS FROM GASES AND LIQ...
- Publication number 20140252270
- Publication date Sep 11, 2014
- Stephen Edward LEHMAN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS
- Publication number 20140148557
- Publication date May 29, 2014
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS
- Publication number 20140148331
- Publication date May 29, 2014
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL COMPOUND CATALYSTS
- Publication number 20130345047
- Publication date Dec 26, 2013
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY OXIDE CATALYSTS
- Publication number 20130281288
- Publication date Oct 24, 2013
- Maximilian A. BIBERGER
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS
- Publication number 20130079216
- Publication date Mar 28, 2013
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACK...
- Publication number 20080116497
- Publication date May 22, 2008
- Intel Corporation
- Stephen E. Lehman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder joint reliability in microelectronic packaging
- Publication number 20080115968
- Publication date May 22, 2008
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder flux composition
- Publication number 20070284412
- Publication date Dec 13, 2007
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermoset polyimides for microelectronic applications
- Publication number 20070262421
- Publication date Nov 15, 2007
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPE...
- Publication number 20070190772
- Publication date Aug 16, 2007
- Intel Corporation
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip-packaging compositions including bis-maleimides, packages made...
- Publication number 20070152311
- Publication date Jul 5, 2007
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level processing of chip-packaging compositions including bis...
- Publication number 20070155047
- Publication date Jul 5, 2007
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Smart curing with a catalyst-functionalized surface
- Publication number 20070154627
- Publication date Jul 5, 2007
- Stephen E. Lehman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Chip-packaging compositions including catalysts and hardeners, pack...
- Publication number 20070090532
- Publication date Apr 26, 2007
- Stephen E. Lehman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Application of autonomic self healing composites to integrated circ...
- Publication number 20070029653
- Publication date Feb 8, 2007
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Materials for integrated circuit packaging
- Publication number 20060267223
- Publication date Nov 30, 2006
- James C. Matayabas
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cyclic olefin polymers and catalyst for semiconductor applications
- Publication number 20060094258
- Publication date May 4, 2006
- Stephen E. Lehman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Stress-relief layers and stress-compensation collars with low-tempe...
- Publication number 20060068579
- Publication date Mar 30, 2006
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Linear functional copolymers of ethylene with precise and minimum r...
- Publication number 20050137369
- Publication date Jun 23, 2005
- Lisa S. Baugh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Solid state metathesis chemistry
- Publication number 20030027962
- Publication date Feb 6, 2003
- Kenneth B. Wagener
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Stephen E. Lehman Jr.

Person

Patents Grantslast 30 patents

Method and system for forming plug and play metal catalysts

Thermoset polymides for microelectronic applications

Method and system for forming plug and play metal compound catalysts

Method and system for forming plug and play oxide catalysts

Method and system for forming plug and play metal catalysts

Method and system for forming plug and play metal compound catalysts

In situ oxide removal, dispersal and drying

Method and system for forming plug and play oxide catalysts

In situ oxide removal, dispersal and drying for silicon SiO2

In situ oxide removal, dispersal and drying for copper copper-oxide

Method and system for forming plug and play metal catalysts

Thermoset polyimides for microelectronic applications

Method and system for forming plug and play metal compound catalysts

Method and system for forming plug and play metal catalysts

Method and system for forming plug and play metal catalysts

Method and system for forming plug and play oxide catalysts

Solder joint reliability in microelectronic packaging

Stress-relief layers and stress-compensation collars with low-tempe...

Stress-relief layers and stress-compensation collars with low-tempe...

Solid state metathesis chemistry

Patents Applicationslast 30 patents

OXYGEN SCAVENGING POLYMERS WITH IMPROVED HAZE CHARACTERISTICS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL COMPOUND CATALYSTS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY OXIDE CATALYSTS

PARTICLE-BASED SYSTEMS FOR REMOVAL OF POLLUTANTS FROM GASES AND LIQ...

THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL COMPOUND CATALYSTS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY OXIDE CATALYSTS

METHOD AND SYSTEM FOR FORMING PLUG AND PLAY METAL CATALYSTS

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACK...

Solder joint reliability in microelectronic packaging

Solder flux composition

Thermoset polyimides for microelectronic applications

STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPE...

Chip-packaging compositions including bis-maleimides, packages made...

Wafer-level processing of chip-packaging compositions including bis...

Smart curing with a catalyst-functionalized surface

Chip-packaging compositions including catalysts and hardeners, pack...

Application of autonomic self healing composites to integrated circ...

Materials for integrated circuit packaging

Cyclic olefin polymers and catalyst for semiconductor applications

Stress-relief layers and stress-compensation collars with low-tempe...

Linear functional copolymers of ethylene with precise and minimum r...

Solid state metathesis chemistry