Stephen J. Gaul

Person

Merrimack, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit air bridge structures and methods of fabricating...
- Patent number 6,492,705
- Issue date Dec 10, 2002
- Intersil Corporation
- Patrick A. Begley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit air bridge structures and methods of fabricating...
- Patent number 6,211,056
- Issue date Apr 3, 2001
- Intersil Corporation
- Patrick A. Begley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount die by handle replacement
- Patent number 6,114,768
- Issue date Sep 5, 2000
- Intersil Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-bond cavity air bridge
- Patent number 5,949,144
- Issue date Sep 7, 1999
- Harris Corporation
- Jose Avelino Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with an air bridge having a lid
- Patent number 5,825,092
- Issue date Oct 20, 1998
- Harris Corporation
- Jose Avelino Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intergrated circuit with coaxial isolation and method
- Patent number 5,814,889
- Issue date Sep 29, 1998
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount die by handle replacement
- Patent number 5,807,783
- Issue date Sep 15, 1998
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit method for and structure with narrow line widths
- Patent number 5,773,891
- Issue date Jun 30, 1998
- Harris Corporation
- Jose Avelino Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation stress relief
- Patent number 5,683,075
- Issue date Nov 4, 1997
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for interconnecting stacked integrated circuits
- Patent number 5,682,062
- Issue date Oct 28, 1997
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with edge connections and method
- Patent number 5,668,409
- Issue date Sep 16, 1997
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding wafers having vias including conductive material
- Patent number 5,646,067
- Issue date Jul 8, 1997
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit structure with narrow line widths
- Patent number 5,639,688
- Issue date Jun 17, 1997
- Harris Corporation
- Jose Avelino Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of surface mountable integrated circuits
- Patent number 5,618,752
- Issue date Apr 8, 1997
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit with conductive vias
- Patent number 5,608,264
- Issue date Mar 4, 1997
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on diamond circuit structure
- Patent number 5,561,303
- Issue date Oct 1, 1996
- Harris Corporation
- Gregory A. Schrantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die separation method for silicon on diamond circuit structures
- Patent number 5,552,345
- Issue date Sep 3, 1996
- Harris Corporation
- Gregory A. Schrantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct etch for thin film resistor using a hard mask
- Patent number 5,547,896
- Issue date Aug 20, 1996
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation stress relief
- Patent number 5,448,102
- Issue date Sep 5, 1995
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief technique of removing oxide from surface of trench-pa...
- Patent number 5,270,265
- Issue date Dec 14, 1993
- Harris Corporation
- Donald F. Hemmenway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer with SiGe as an etchback film in a...
- Patent number 5,240,876
- Issue date Aug 31, 1993
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer with sige
- Patent number 5,218,213
- Issue date Jun 8, 1993
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming island with polysilicon-filled trench isolation
- Patent number 5,217,919
- Issue date Jun 8, 1993
- Harris Corporation
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin circuit fabrication by controlled wafer debonding
- Patent number 5,091,331
- Issue date Feb 25, 1992
- Harris Corporation
- Jose A. Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including photo-optical devices and pressure tr...
- Patent number 5,070,596
- Issue date Dec 10, 1991
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS
Information Patent Grant
Method of fabricating integrated circuits including photo optical d...
- Patent number 5,037,765
- Issue date Aug 6, 1991
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS
Information Patent Grant
Method of fabricating back diffused bonded oxide substrates
- Patent number 4,968,628
- Issue date Nov 6, 1990
- Harris Corporation
- Jose A. Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including photo-optical devices and pressure tr...
- Patent number 4,916,497
- Issue date Apr 10, 1990
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS

Stephen J. Gaul

Person

Patents Grantslast 30 patents

Integrated circuit air bridge structures and methods of fabricating...

Integrated circuit air bridge structures and methods of fabricating...

Surface mount die by handle replacement

Pre-bond cavity air bridge

Integrated circuit with an air bridge having a lid

Intergrated circuit with coaxial isolation and method

Surface mount die by handle replacement

Integrated circuit method for and structure with narrow line widths

Trench isolation stress relief

System for interconnecting stacked integrated circuits

Integrated circuit with edge connections and method

Method of bonding wafers having vias including conductive material

Method of making integrated circuit structure with narrow line widths

Method of fabrication of surface mountable integrated circuits

Surface mountable integrated circuit with conductive vias

Silicon on diamond circuit structure

Die separation method for silicon on diamond circuit structures

Direct etch for thin film resistor using a hard mask

Trench isolation stress relief

Stress relief technique of removing oxide from surface of trench-pa...

Method of fabricating SOI wafer with SiGe as an etchback film in a...

SOI wafer with sige

Method of forming island with polysilicon-filled trench isolation

Ultra-thin circuit fabrication by controlled wafer debonding

Integrated circuits including photo-optical devices and pressure tr...

Method of fabricating integrated circuits including photo optical d...

Method of fabricating back diffused bonded oxide substrates

Integrated circuits including photo-optical devices and pressure tr...