Stephen R. Hooper

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress isolated device package and method of manufacture
- Patent number 12,012,328
- Issue date Jun 18, 2024
- NXP USA, INC.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package having stress isolation and method the...
- Patent number 11,823,968
- Issue date Nov 21, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,760,623
- Issue date Sep 19, 2023
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,498,829
- Issue date Nov 15, 2022
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shielded electronic package and method of fabrication
- Patent number 11,482,478
- Issue date Oct 25, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system, and apparatus for forming three-dimensional semicon...
- Patent number 11,335,652
- Issue date May 17, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding lids in integrated circuit devices
- Patent number 11,127,645
- Issue date Sep 21, 2021
- NXP USA, INC.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated waveguide
- Patent number 11,031,681
- Issue date Jun 8, 2021
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Media shield with EMI capability for pressure sensor
- Patent number 10,892,229
- Issue date Jan 12, 2021
- NXP USA, INC.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit semiconductor device
- Patent number 10,790,220
- Issue date Sep 29, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio connection for EMI shielding
- Patent number 10,658,303
- Issue date May 19, 2020
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having hermetic cavities and methods for t...
- Patent number 10,442,685
- Issue date Oct 15, 2019
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module with blade insert
- Patent number 10,340,211
- Issue date Jul 2, 2019
- NXP B.V.
- Chanon Suwankasab
- G01 - MEASURING TESTING
Information Patent Grant
Sensing field effect transistor devices, systems in which they are...
- Patent number 10,107,779
- Issue date Oct 23, 2018
- NXP USA, INC.
- Raymond M. Roop
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic packages having axially-partitioned hermetic caviti...
- Patent number 10,053,359
- Issue date Aug 21, 2018
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing field effect transistor devices, systems in which they are...
- Patent number 9,927,392
- Issue date Mar 27, 2018
- NXP USA, INC.
- Raymond M. Roop
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic packages having split gyroscope structures and meth...
- Patent number 9,891,244
- Issue date Feb 13, 2018
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Devices and methods for testing integrated circuit devices
- Patent number 9,818,656
- Issue date Nov 14, 2017
- NXP USA, INC.
- Mark Edward Schlarmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS sensor with side port and method of fabricating same
- Patent number 9,790,089
- Issue date Oct 17, 2017
- NXP USA, INC.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device packages and related fabrication methods
- Patent number 9,676,611
- Issue date Jun 13, 2017
- NXP USA, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolated differential pressure sensor
- Patent number 9,663,350
- Issue date May 30, 2017
- NXP USA, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Differential pressure sensor assembly
- Patent number 9,638,597
- Issue date May 2, 2017
- NXP USA, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Sequential wafer bonding
- Patent number 9,604,844
- Issue date Mar 28, 2017
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Environmental sensor structure
- Patent number 9,598,280
- Issue date Mar 21, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic devices with cavity-type, permeable material filled pack...
- Patent number 9,510,495
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having axially-partitioned hermetic caviti...
- Patent number 9,499,397
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing field effect transistor devices and method of their manufac...
- Patent number 9,470,652
- Issue date Oct 18, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,455,216
- Issue date Sep 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stress isolation for MEMS device
- Patent number 9,446,940
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor protective coating
- Patent number 9,425,382
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dubravka Bilic
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES
- Publication number 20250210479
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS
- Publication number 20250085182
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Chayathorn Saklang
- G01 - MEASURING TESTING
Information Patent Application
VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20250079335
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR
- Publication number 20240178111
- Publication date May 30, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
- Publication number 20230343683
- Publication date Oct 26, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20230059566
- Publication date Feb 23, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220348456
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...
- Publication number 20220068738
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20220028766
- Publication date Jan 27, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20210221671
- Publication date Jul 22, 2021
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method, System, and Apparatus for Forming Three-Dimensional Semicon...
- Publication number 20210035927
- Publication date Feb 4, 2021
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATED WAVEGUIDE
- Publication number 20200403298
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING LIDS IN INTEGRATED CIRCUIT DEVICES
- Publication number 20200402878
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEDIA SHIELD WITH EMI CAPABILITY FOR PRESSURE SENSOR
- Publication number 20200321286
- Publication date Oct 8, 2020
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CONNECTION FOR EMI SHIELDING
- Publication number 20200152579
- Publication date May 14, 2020
- NXP USA, Inc.
- Michael B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT SEMICONDCUTOR DEVICE
- Publication number 20200126895
- Publication date Apr 23, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...
- Publication number 20180188203
- Publication date Jul 5, 2018
- NXP USA, Inc.
- Raymond M. ROOP
- G01 - MEASURING TESTING
Information Patent Application
MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME
- Publication number 20170174509
- Publication date Jun 22, 2017
- NXP USA, Inc.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20170084519
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- THOMAS C. SPEIGHT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
- Publication number 20170081178
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- THOMAS C. SPEIGHT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME
- Publication number 20170081179
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- CHAD S. DAWSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...
- Publication number 20170044005
- Publication date Feb 16, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METH...
- Publication number 20170038209
- Publication date Feb 9, 2017
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED DIFFERENTIAL PRESSURE SENSOR
- Publication number 20160169758
- Publication date Jun 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- STEPHEN R. HOOPER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR T...
- Publication number 20160167952
- Publication date Jun 16, 2016
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED MEMS DEVICE WITH ASIC AS CAP
- Publication number 20160159642
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- STEPHEN R. HOOPER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Stephen R. Hooper

Person

Patents Grantslast 30 patents

Stress isolated device package and method of manufacture

Semiconductor device package having stress isolation and method the...

No-gel pressure sensor package

No-gel pressure sensor package

Shielded electronic package and method of fabrication

Method, system, and apparatus for forming three-dimensional semicon...

Grounding lids in integrated circuit devices

Package integrated waveguide

Media shield with EMI capability for pressure sensor

Press-fit semiconductor device

High aspect ratio connection for EMI shielding

Microelectronic packages having hermetic cavities and methods for t...

Sensor module with blade insert

Sensing field effect transistor devices, systems in which they are...

Microelectronic packages having axially-partitioned hermetic caviti...

Sensing field effect transistor devices, systems in which they are...

Microelectronic packages having split gyroscope structures and meth...

Devices and methods for testing integrated circuit devices

MEMS sensor with side port and method of fabricating same

Sensor device packages and related fabrication methods

Stress isolated differential pressure sensor

Differential pressure sensor assembly

Sequential wafer bonding

Environmental sensor structure

Electronic devices with cavity-type, permeable material filled pack...

Microelectronic packages having axially-partitioned hermetic caviti...

Sensing field effect transistor devices and method of their manufac...

Semiconductor device package and method of manufacture

Stress isolation for MEMS device

Sensor protective coating

Patents Applicationslast 30 patents

METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS

VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR

NO-GEL PRESSURE SENSOR PACKAGE

STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...

SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

NO-GEL PRESSURE SENSOR PACKAGE

Method, System, and Apparatus for Forming Three-Dimensional Semicon...

PACKAGE INTEGRATED WAVEGUIDE

GROUNDING LIDS IN INTEGRATED CIRCUIT DEVICES

MEDIA SHIELD WITH EMI CAPABILITY FOR PRESSURE SENSOR

HIGH ASPECT RATIO CONNECTION FOR EMI SHIELDING

PRESS-FIT SEMICONDCUTOR DEVICE

SENSING FIELD EFFECT TRANSISTOR DEVICES, SYSTEMS IN WHICH THEY ARE...

MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE

MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME

MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...

MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METH...

STRESS ISOLATED DIFFERENTIAL PRESSURE SENSOR

MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR T...

STRESS ISOLATED MEMS DEVICE WITH ASIC AS CAP