Steven W. Taatjes

Person

West Linn, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer chuck for use in edge bevel removal of copper from silicon wa...
- Patent number 6,967,174
- Issue date Nov 22, 2005
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating process chamber and method with pre-wetting and rins...
- Patent number 6,716,334
- Issue date Apr 6, 2004
- Novellus Systems, Inc.
- Jonathan D. Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for use in edge bevel removal of copper from silicon wa...
- Patent number 6,537,416
- Issue date Mar 25, 2003
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for uniform electroplating of integrated circu...
- Patent number 6,402,923
- Issue date Jun 11, 2002
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process including pre-wetting and rinsing
- Patent number 6,214,193
- Issue date Apr 10, 2001
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric potential shaping apparatus for holding a semiconductor wa...
- Patent number 6,193,859
- Issue date Feb 27, 2001
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for treating surface including virtual anode
- Patent number 6,179,983
- Issue date Jan 30, 2001
- Novellus Systems, Inc.
- Jonathan David Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic chuck for semiconductor wafer or other substrate
- Patent number 6,167,893
- Issue date Jan 2, 2001
- Novellus Systems, Inc.
- Steven W. Taatjes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric potential shaping method for electroplating
- Patent number 6,159,354
- Issue date Dec 12, 2000
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating chamber with rotatable wafer holder and pre-wetting...
- Patent number 6,099,702
- Issue date Aug 8, 2000
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Steven W. Taatjes

Person

Patents Grantslast 30 patents

Wafer chuck for use in edge bevel removal of copper from silicon wa...

Electroplating process chamber and method with pre-wetting and rins...

Wafer chuck for use in edge bevel removal of copper from silicon wa...

Method and apparatus for uniform electroplating of integrated circu...

Electroplating process including pre-wetting and rinsing

Electric potential shaping apparatus for holding a semiconductor wa...

Method and apparatus for treating surface including virtual anode

Dynamic chuck for semiconductor wafer or other substrate

Electric potential shaping method for electroplating

Electroplating chamber with rotatable wafer holder and pre-wetting...