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Sudarshan V. Rangaraj
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Embedded capacitors for reducing package cracking
Patent number
7,719,109
Issue date
May 18, 2010
Intel Corporation
Mitul Modi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compliant structure for an electronic device, method of manufacturi...
Patent number
7,692,307
Issue date
Apr 6, 2010
Intel Corporation
Sudarshan Rangaraj
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of forming stepped bumps and structures formed thereby
Patent number
7,659,192
Issue date
Feb 9, 2010
Intel Corporation
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a microelectronic package using control of die an...
Patent number
7,585,693
Issue date
Sep 8, 2009
Intel Corporation
Kristopher J. Frutschy
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and system for performing die attach using a flame
Patent number
7,288,472
Issue date
Oct 30, 2007
Intel Corporation
Kris J. Frutschy
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF
Publication number
20090065931
Publication date
Mar 12, 2009
Intel Corporation
Sudarshan V. Rangaraj
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY
Publication number
20080157392
Publication date
Jul 3, 2008
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of forming stepped bumps and structures formed thereby
Publication number
20080157356
Publication date
Jul 3, 2008
Andrew Yeohi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Compliant structure for an electronic device, method of manufacturi...
Publication number
20080137318
Publication date
Jun 12, 2008
Sudarshan Rangaraj
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Embedded capacitors for reducing package cracking
Publication number
20080096310
Publication date
Apr 24, 2008
Mitul Modi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Microelectronic assembly having a periphery seal around a thermal i...
Publication number
20080001282
Publication date
Jan 3, 2008
Mitul Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a microelectronic package using control of die an...
Publication number
20070231952
Publication date
Oct 4, 2007
Kristopher J. Frutschy
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and system for performing die attach using a flame
Publication number
20060134830
Publication date
Jun 22, 2006
Kris J. Frutschy
H01 - BASIC ELECTRIC ELEMENTS