Sudipta K. Ray

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating printed circuit boards
- Patent number 9,433,105
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional stacked package structure
- Patent number 8,466,543
- Issue date Jun 18, 2013
- International Business Machines Corporation
- Thomas J. Fleischman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust FBEOL and UBM structure of C4 interconnects
- Patent number 8,450,849
- Issue date May 28, 2013
- International Business Machines Corporation
- Minhua Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Overcoming laminate warpage and misalignment in flip-chip packages
- Patent number 8,304,290
- Issue date Nov 6, 2012
- International Business Machines Corporation
- Richard S. Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Robust FBEOL and UBM structure of C4 interconnects
- Patent number 8,227,918
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Minhua Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure for implementing secure multichip modules for encryption...
- Patent number 7,806,341
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,472,836
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,281,667
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,984,792
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparing MCM hat for removal
- Patent number 6,908,025
- Issue date Jun 21, 2005
- Internatioanl Business Machines Corporation
- Patrick A. Coico
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture of silicon based package
- Patent number 6,878,608
- Issue date Apr 12, 2005
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package structure and process for planar passive opt...
- Patent number 6,827,505
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder structure and method for high fatigue life
- Patent number 6,784,086
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Sudipta K. Ray
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preventing solder wetting in an optical device using diff...
- Patent number 6,762,119
- Issue date Jul 13, 2004
- International Bussiness Machines Corporation
- Sudipta K. Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for repairing electronic packages
- Patent number 6,713,686
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,657,313
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection process for module assembly and rework
- Patent number 6,574,859
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Shaji Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,559,527
- Issue date May 6, 2003
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,548,909
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-electronic transceiver module and hermetically sealed housing...
- Patent number 6,502,999
- Issue date Jan 7, 2003
- JDS Uniphase Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
High density column grid array connections and method thereof
- Patent number 6,429,388
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Column grid array substrate attachment with heat sink stress relief
- Patent number 6,395,991
- Issue date May 28, 2002
- International Business Machines Corporation
- Robert Charles Dockerty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,360,938
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic packaging submount arrangement providing 90 degree e...
- Patent number 6,350,625
- Issue date Feb 26, 2002
- International Business Machines Corporation
- Mitchell S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baseplate for chip burn-in and/of testing, and method thereof
- Patent number 6,335,210
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- G01 - MEASURING TESTING
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-axis compressible polymer with fine metal matrix suspension
- Patent number 6,270,363
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer enhanced column grid array
- Patent number 6,259,155
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Mario John Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,258,625
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Robust FEBOL and UBM Structure of C4 Interconnects
- Publication number 20120286433
- Publication date Nov 15, 2012
- International Business Machines Corporation
- Minhua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL STACKED PACKAGE STRUCTURE
- Publication number 20110291261
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Thomas J. Fleischman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
- Publication number 20110151627
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Richard S. Graf
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Robust FBEOL and UBM Structure of C4 Interconnects
- Publication number 20110063815
- Publication date Mar 17, 2011
- International Business Machines Corporation
- Minhua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIERS WITH SIDE TERMINALS
- Publication number 20110048790
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...
- Publication number 20090145973
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20080000988
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20060231633
- Publication date Oct 19, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PREPARING MCM HAT FOR REMOVAL
- Publication number 20040262371
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Patrick A. Coico
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic package structure and process for planar passive opt...
- Publication number 20040114884
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- G02 - OPTICS
Information Patent Application
Dielectric interposer for chip to substrate soldering
- Publication number 20030193093
- Publication date Oct 16, 2003
- International Business Machines Corporation
- Peter J. Brofman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and method for repairing electronic packages
- Publication number 20030136581
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure and process for silicon optical bench
- Publication number 20020196996
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Sudipta K. Ray
- G02 - OPTICS
Information Patent Application
Method of manufacture of silicon based package and device manufactu...
- Publication number 20020180013
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-free solder structure and method for high fatigue life
- Publication number 20020149113
- Publication date Oct 17, 2002
- International Business Machines Corporation
- Sudipta K. Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of interconnecting electronic components using a plurality o...
- Publication number 20010019178
- Publication date Sep 6, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming cone shaped solder for chip interconnection
- Publication number 20010015495
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus to remove closely spaced chips on a multi-chi...
- Publication number 20010006188
- Publication date Jul 5, 2001
- Stephen A. DeLaurentis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection process for module assembly and rework
- Publication number 20010005314
- Publication date Jun 28, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Sudipta K. Ray

Person

Patents Grantslast 30 patents

Method of fabricating printed circuit boards

Three dimensional stacked package structure

Robust FBEOL and UBM structure of C4 interconnects

Overcoming laminate warpage and misalignment in flip-chip packages

Robust FBEOL and UBM structure of C4 interconnects

Structure for implementing secure multichip modules for encryption...

Method and structure for implementing secure multichip modules for...

Method and structure for implementing secure multichip modules for...

Dielectric interposer for chip to substrate soldering

Preparing MCM hat for removal

Method of manufacture of silicon based package

Optoelectronic package structure and process for planar passive opt...

Lead-free solder structure and method for high fatigue life

Method of preventing solder wetting in an optical device using diff...

Apparatus and method for repairing electronic packages

Dielectric interposer for chip to substrate soldering

Interconnection process for module assembly and rework

Process for forming cone shaped solder for chip interconnection

Method of interconnecting electronic components using a plurality o...

Opto-electronic transceiver module and hermetically sealed housing...

High density column grid array connections and method thereof

Column grid array substrate attachment with heat sink stress relief

Process and apparatus to remove closely spaced chips on a multi-chi...

Optoelectronic packaging submount arrangement providing 90 degree e...

Baseplate for chip burn-in and/of testing, and method thereof

Electrical interconnection package and method thereof

Method for enhancing fatigue life of ball grid arrays

Z-axis compressible polymer with fine metal matrix suspension

Polymer enhanced column grid array

Method of interconnecting electronic components using a plurality o...

Patents Applicationslast 30 patents

Robust FEBOL and UBM Structure of C4 Interconnects

THREE DIMENSIONAL STACKED PACKAGE STRUCTURE

OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES

Robust FBEOL and UBM Structure of C4 Interconnects

CHIP CARRIERS WITH SIDE TERMINALS

STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

PREPARING MCM HAT FOR REMOVAL

Optoelectronic package structure and process for planar passive opt...

Dielectric interposer for chip to substrate soldering

Apparatus and method for repairing electronic packages

Interconnect structure and process for silicon optical bench

Method of manufacture of silicon based package and device manufactu...

Lead-free solder structure and method for high fatigue life

Method of interconnecting electronic components using a plurality o...

Process for forming cone shaped solder for chip interconnection

Process and apparatus to remove closely spaced chips on a multi-chi...

Interconnection process for module assembly and rework