Sukianto Rusli

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,848,214
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,094,560
- Issue date Aug 17, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an encapsulated semiconductor device
- Patent number 11,081,370
- Issue date Aug 3, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 10,811,277
- Issue date Oct 20, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 10,665,567
- Issue date May 26, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,586,746
- Issue date Mar 10, 2020
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 10,461,006
- Issue date Oct 29, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable carrier method
- Patent number 10,354,907
- Issue date Jul 16, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable carrier and method
- Patent number 10,332,775
- Issue date Jun 25, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,941,146
- Issue date Apr 10, 2018
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,922,949
- Issue date Mar 20, 2018
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 9,871,015
- Issue date Jan 16, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,847,244
- Issue date Dec 19, 2017
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,812,347
- Issue date Nov 7, 2017
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 9,812,386
- Issue date Nov 7, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buildup dielectric layer having metallization pattern semiconductor...
- Patent number 9,691,635
- Issue date Jun 27, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 9,406,645
- Issue date Aug 2, 2016
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded trace structure and fabrication method
- Patent number 9,060,430
- Issue date Jun 16, 2015
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package and fabrication method
- Patent number 9,054,117
- Issue date Jun 9, 2015
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 8,952,522
- Issue date Feb 10, 2015
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an integrated circuit substrate having laminated...
- Patent number 8,826,531
- Issue date Sep 9, 2014
- Amkor Technology, Inc.
- David Jon Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package and fabrication method
- Patent number 8,710,649
- Issue date Apr 29, 2014
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 8,691,632
- Issue date Apr 8, 2014
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method
- Patent number 8,486,764
- Issue date Jul 16, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etch stop fabrication method and structure
- Patent number 8,383,950
- Issue date Feb 26, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buildup dielectric layer having metallization pattern semiconductor...
- Patent number 8,341,835
- Issue date Jan 1, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit-on-foil process for manufacturing a laminated semiconductor...
- Patent number 8,322,030
- Issue date Dec 4, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Straight conductor blind via capture pad structure and fabrication...
- Patent number 8,323,771
- Issue date Dec 4, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package and fabrication method
- Patent number 8,298,866
- Issue date Oct 30, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding post substrate package structure and method
- Patent number 8,176,628
- Issue date May 15, 2012
- Amkor Technology, Inc.
- Sukianto Rusli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20210358770
- Publication date Nov 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20200105631
- Publication date Apr 2, 2020
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20200066547
- Publication date Feb 27, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR PACKAGING METHODOLOGY WITH RECONSTITUTION CONCEPT USI...
- Publication number 20190304949
- Publication date Oct 3, 2019
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20190287818
- Publication date Sep 19, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD WITH MULTIPLE REDISTRIBUTION LAYER...
- Publication number 20190189561
- Publication date Jun 20, 2019
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE CARRIER METHOD
- Publication number 20180261489
- Publication date Sep 13, 2018
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20180025955
- Publication date Jan 25, 2018
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170207184
- Publication date Jul 20, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170018475
- Publication date Jan 19, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE CARRIER AND METHOD
- Publication number 20170018449
- Publication date Jan 19, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170018448
- Publication date Jan 19, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170018526
- Publication date Jan 19, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having laser-embedded terminals
- Publication number 20080043447
- Publication date Feb 21, 2008
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate having stiffener fabrication method
- Publication number 20080020132
- Publication date Jan 24, 2008
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit substrate having embedded back-side access condu...
- Publication number 20050041398
- Publication date Feb 24, 2005
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sukianto Rusli

Person

Patents Grantslast 30 patents

Encapsulated semiconductor package

Encapsulated semiconductor package

Methods of manufacturing an encapsulated semiconductor device

Encapsulated semiconductor package

Wafer level package and fabrication method

Semiconductor device and method

Encapsulated semiconductor package

Releasable carrier method

Releasable carrier and method

Semiconductor device and method

Semiconductor device and method

Wafer level package and fabrication method

Semiconductor device and method

Semiconductor device and method

Encapsulated semiconductor package

Buildup dielectric layer having metallization pattern semiconductor...

Wafer level package and fabrication method

Shielded trace structure and fabrication method

Wafer level package and fabrication method

Wafer level package and fabrication method

Method for making an integrated circuit substrate having laminated...

Wafer level package and fabrication method

Wafer level package and fabrication method

Wafer level package and fabrication method

Metal etch stop fabrication method and structure

Buildup dielectric layer having metallization pattern semiconductor...

Circuit-on-foil process for manufacturing a laminated semiconductor...

Straight conductor blind via capture pad structure and fabrication...

Wafer level package and fabrication method

Protruding post substrate package structure and method

Patents Applicationslast 30 patents

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGING METHODOLOGY WITH RECONSTITUTION CONCEPT USI...

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD WITH MULTIPLE REDISTRIBUTION LAYER...

RELEASABLE CARRIER METHOD

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD

RELEASABLE CARRIER AND METHOD

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor package having laser-embedded terminals

Substrate having stiffener fabrication method

Integrated circuit substrate having embedded back-side access condu...