Sung-Yi Hsiao

Person

Miaoli County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a conductive substrate structure with cond...
- Patent number 8,555,492
- Issue date Oct 15, 2013
- Harvatek Corporation
- Bily Wang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Conductive substrate structure with conductive channels formed by u...
- Patent number 8,263,876
- Issue date Sep 11, 2012
- Harvatek Corporation
- Bily Wang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Wafer level vertical diode package structure and method for making...
- Patent number 8,053,885
- Issue date Nov 8, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED base
- Patent number D645421
- Issue date Sep 20, 2011
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Wafer level LED package structure and method for making the same
- Patent number 7,923,747
- Issue date Apr 12, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METH...
- Publication number 20120119231
- Publication date May 17, 2012
- HARVATEK CORPORATION
- BILY WANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAG...
- Publication number 20120122254
- Publication date May 17, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20120106171
- Publication date May 3, 2012
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...
- Publication number 20120096710
- Publication date Apr 26, 2012
- HARVATEK CORPORATION
- BILY WANG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20120037937
- Publication date Feb 16, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFIC...
- Publication number 20120009699
- Publication date Jan 12, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DIODE PACKAGE STRUCTURE
- Publication number 20110304020
- Publication date Dec 15, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110215357
- Publication date Sep 8, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...
- Publication number 20110155436
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- BILY WANG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20110147774
- Publication date Jun 23, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRIC...
- Publication number 20110003434
- Publication date Jan 6, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
White light-emitting diode package structure for simplifying packag...
- Publication number 20100264435
- Publication date Oct 21, 2010
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level vertical diode package structure and method for making...
- Publication number 20100176502
- Publication date Jul 15, 2010
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level led package structure for increasing light-emitting eff...
- Publication number 20100127292
- Publication date May 27, 2010
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AN...
- Publication number 20100032706
- Publication date Feb 11, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTR...
- Publication number 20090283881
- Publication date Nov 19, 2009
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE WITHOUT SUBSTRATES FOR ACHIEVI...
- Publication number 20090278159
- Publication date Nov 12, 2009
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRIC...
- Publication number 20090230538
- Publication date Sep 17, 2009
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS

Sung-Yi Hsiao

Person

Patents Grantslast 30 patents

Method for manufacturing a conductive substrate structure with cond...

Conductive substrate structure with conductive channels formed by u...

Wafer level vertical diode package structure and method for making...

LED base

Wafer level LED package structure and method for making the same

Patents Applicationslast 30 patents

LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METH...

WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAG...

LED PACKAGE STRUCTURE

CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...

LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFIC...

WAFER LEVEL DIODE PACKAGE STRUCTURE

LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRIC...

White light-emitting diode package structure for simplifying packag...

Wafer level vertical diode package structure and method for making...

Wafer level led package structure for increasing light-emitting eff...

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AN...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTR...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE WITHOUT SUBSTRATES FOR ACHIEVI...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRIC...