Sunil Kumar SINGH

Person

Mechanicville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with fluorescent material, and related...
- Patent number 11,901,304
- Issue date Feb 13, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with capacitor electrodes in different...
- Patent number 11,699,650
- Issue date Jul 11, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Alamgir M. Arif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures for contacting a top electrode of an embedded...
- Patent number 11,515,205
- Issue date Nov 29, 2022
- GLOBALFOUNDRIES U.S. INC.
- Eswar Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and related structure to authenticate integrated circuit wit...
- Patent number 11,380,622
- Issue date Jul 5, 2022
- GLOBALFOUNDRIES U.S. INC.
- Vibhor Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,367,750
- Issue date Jun 21, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure for integrated circuit and related methods
- Patent number 11,348,867
- Issue date May 31, 2022
- GLOBALFOUNDRIES U.S. INC.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure with MIM layer over metal pillars
- Patent number 11,211,448
- Issue date Dec 28, 2021
- GLOBALFOUNDRIES U.S. INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure for integrated circuit, and related methods
- Patent number 11,107,880
- Issue date Aug 31, 2021
- GLOBALFOUNDRIES U.S. INC.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a conductive contact structure to a top electrod...
- Patent number 11,094,585
- Issue date Aug 17, 2021
- GLOBALFOUNDRIES U.S. INC.
- Xuan Anh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-time programmable (MTP) memory device with a wrap-around c...
- Patent number 10,886,287
- Issue date Jan 5, 2021
- GLOBALFOUNDRIES Inc.
- Xuan Anh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating inductor conductors with air gap using energy evaporatio...
- Patent number 10,832,842
- Issue date Nov 10, 2020
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure to reduce soft-fail incidence and meth...
- Patent number 10,818,557
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with non-mandrel cuts formed by early block patterning
- Patent number 10,777,413
- Issue date Sep 15, 2020
- GLOBALFOUNDRIES Inc.
- Yuping Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to reduce shorts and contact resistance in sem...
- Patent number 10,741,495
- Issue date Aug 11, 2020
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming smooth sidewall structures using spacer materials
- Patent number 10,714,380
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Ravi P. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with reduced capacitance
- Patent number 10,672,710
- Issue date Jun 2, 2020
- GLOBALFOUNDRIES Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures and via patterning using oblique angle deposition pr...
- Patent number 10,643,891
- Issue date May 5, 2020
- GLOBALFOUNDRIES Inc.
- Qanit Takmeel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned single diffusion break for fully depleted silicon-on-i...
- Patent number 10,580,684
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Jin Wallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic patterning to form fine pitch features
- Patent number 10,504,774
- Issue date Dec 10, 2019
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual photoresist approach to lithographic patterning for pitch redu...
- Patent number 10,497,610
- Issue date Dec 3, 2019
- GLOBALFOUNDRIES Inc.
- Ravi Srivastava
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Insulating inductor conductors with air gap using energy evaporatio...
- Patent number 10,453,605
- Issue date Oct 22, 2019
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Litho-litho-etch double patterning method
- Patent number 10,353,288
- Issue date Jul 16, 2019
- GLOBALFOUNDRIES Inc.
- Vineet Sharma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnect formation process using wire trench etch prior to via...
- Patent number 10,347,528
- Issue date Jul 9, 2019
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with method of forming the same
- Patent number 10,312,188
- Issue date Jun 4, 2019
- GLOBALFOUNDRIES Inc.
- Ravi P. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of air gaps with back-end-of-line structures
- Patent number 10,177,029
- Issue date Jan 8, 2019
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high performance vertical natural capacitor (VNCAP)
- Patent number 10,109,706
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance conductive contacts
- Patent number 10,084,093
- Issue date Sep 25, 2018
- GLOBALFOUNDRIES Inc.
- Shiv Kumar Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metholodogy for profile control and capacitance reduction
- Patent number 10,083,904
- Issue date Sep 25, 2018
- GLOBALFOUNDRIES Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate a high performance capacitor in a back end of l...
- Patent number 9,960,113
- Issue date May 1, 2018
- GLOBALFOUNDRIES Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects and improving reliability of BEOL metal fill
- Patent number 9,741,605
- Issue date Aug 22, 2017
- GLOBALFOUNDRIES Inc.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO FORM SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20230317526
- Publication date Oct 5, 2023
- LIANG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE HAVING AN AIR SPACER AND METHOD FOR MAKING THE...
- Publication number 20230290855
- Publication date Sep 14, 2023
- HeFeChip Corporation Limited
- John H Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FLOURESCENT MATERIAL, AND RELATED...
- Publication number 20220375871
- Publication date Nov 24, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE STRUCTURE FOR OPTICAL ATTACK MITIGATION
- Publication number 20220320015
- Publication date Oct 6, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20220271090
- Publication date Aug 25, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH CAPACITOR ELECTRODES IN DIFFERENT...
- Publication number 20220230955
- Publication date Jul 21, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Alamgir M. Arif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND RELATED STRUCTURE TO AUTHENTICATE INTEGRATED CIRCUIT WIT...
- Publication number 20220165676
- Publication date May 26, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE FOR INTEGRATED CIRCUIT AND RELATED METHODS
- Publication number 20220139819
- Publication date May 5, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE WITH MIM LAYER OVER METAL PILLARS
- Publication number 20210175323
- Publication date Jun 10, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES FOR CONTACTING A TOP ELECTRODE OF AN EMBEDDED...
- Publication number 20210066126
- Publication date Mar 4, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Eswar Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A CONDUCTIVE CONTACT STRUCTURE TO A TOP ELECTROD...
- Publication number 20210013095
- Publication date Jan 14, 2021
- GLOBALFOUNDRIES INC.
- Xuan Anh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20200395541
- Publication date Dec 17, 2020
- GLOBALFOUNDRIES INC.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE FOR INTEGRATED CIRCUIT, AND RELATED METHODS
- Publication number 20200357880
- Publication date Nov 12, 2020
- GLOBALFOUNDRIES INC.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-TIME PROGRAMMABLE (MTP) MEMORY DEVICE WITH A WRAP-AROUND C...
- Publication number 20200227424
- Publication date Jul 16, 2020
- GLOBALFOUNDRIES INC.
- Xuan Anh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH SIDEWALL STRUCTURES
- Publication number 20200135545
- Publication date Apr 30, 2020
- GLOBALFOUNDRIES INC.
- Ravi P. SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES AND VIA PATTERNING USING OBLIQUE ANGLE DEPOSITION PR...
- Publication number 20200083099
- Publication date Mar 12, 2020
- GLOBALFOUNDRIES INC.
- Qanit TAKMEEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH NON-MANDREL CUTS FORMED BY EARLY BLOCK PATTERNING
- Publication number 20200020531
- Publication date Jan 16, 2020
- GLOBALFOUNDRIES INC.
- Yuping Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE TO REDUCE SOFT-FAIL INCIDENCE AND METH...
- Publication number 20200013678
- Publication date Jan 9, 2020
- GLOBALFOUNDRIES INC.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATIO...
- Publication number 20200013551
- Publication date Jan 9, 2020
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH REDUCED CAPACITANCE
- Publication number 20190371736
- Publication date Dec 5, 2019
- GLOBALFOUNDRIES INC.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SINGLE DIFFUSION BREAK FOR FULLY DEPLETED SILICON-ON-I...
- Publication number 20190318955
- Publication date Oct 17, 2019
- GLOBALFOUNDRIES INC.
- Jin WALLNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP FORMATION IN BACK-END-OF-LINE STRUCTURES
- Publication number 20190237356
- Publication date Aug 1, 2019
- GLOBALFOUNDRIES INC.
- Ravi Prakash Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO REDUCE SHORTS AND CONTACT RESISTANCE IN SEM...
- Publication number 20190221523
- Publication date Jul 18, 2019
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE STRUCTURES WITH AIR GAPS
- Publication number 20190206718
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHO-LITHO-ETCH DOUBLE PATTERNING METHOD
- Publication number 20190163054
- Publication date May 30, 2019
- GLOBALFOUNDRIES INC.
- Vineet Sharma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATIO...
- Publication number 20190108942
- Publication date Apr 11, 2019
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DEVELOPING METHODS FOR LITHOGRAPHY PATTERNING
- Publication number 20190079408
- Publication date Mar 14, 2019
- GLOBALFOUNDRIES INC.
- Sohan Singh Mehta
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL) REFLECTIVE MASK
- Publication number 20180299765
- Publication date Oct 18, 2018
- GLOBALFOUNDRIES INC.
- SherJang Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURES FOR A METAL-INSULATOR-METAL CAPACITOR
- Publication number 20180269273
- Publication date Sep 20, 2018
- GLOBALFOUNDRIES INC.
- Sunil Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE FORMATION USING AN ENERGY REMOVAL FILM
- Publication number 20180204929
- Publication date Jul 19, 2018
- GLOBALFOUNDRIES INC.
- Shiv K. Mishra
- H01 - BASIC ELECTRIC ELEMENTS

Sunil Kumar SINGH

Person

Patents Grantslast 30 patents

Integrated circuit structure with fluorescent material, and related...

Integrated circuit structure with capacitor electrodes in different...

Conductive structures for contacting a top electrode of an embedded...

Method and related structure to authenticate integrated circuit wit...

Vertical memory devices

Capacitor structure for integrated circuit and related methods

Capacitor structure with MIM layer over metal pillars

Capacitor structure for integrated circuit, and related methods

Methods of forming a conductive contact structure to a top electrod...

Multiple-time programmable (MTP) memory device with a wrap-around c...

Insulating inductor conductors with air gap using energy evaporatio...

Integrated circuit structure to reduce soft-fail incidence and meth...

Interconnects with non-mandrel cuts formed by early block patterning

Structure and method to reduce shorts and contact resistance in sem...

Method of forming smooth sidewall structures using spacer materials

Interconnect structures with reduced capacitance

Via structures and via patterning using oblique angle deposition pr...

Self-aligned single diffusion break for fully depleted silicon-on-i...

Lithographic patterning to form fine pitch features

Dual photoresist approach to lithographic patterning for pitch redu...

Insulating inductor conductors with air gap using energy evaporatio...

Litho-litho-etch double patterning method

Interconnect formation process using wire trench etch prior to via...

Interconnect structure with method of forming the same

Integration of air gaps with back-end-of-line structures

Method of forming high performance vertical natural capacitor (VNCAP)

Low resistance conductive contacts

Metholodogy for profile control and capacitance reduction

Method to fabricate a high performance capacitor in a back end of l...

Reducing defects and improving reliability of BEOL metal fill

Patents Applicationslast 30 patents

METHOD TO FORM SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF

TRANSISTOR STRUCTURE HAVING AN AIR SPACER AND METHOD FOR MAKING THE...

INTEGRATED CIRCUIT STRUCTURE WITH FLOURESCENT MATERIAL, AND RELATED...

BACKSIDE STRUCTURE FOR OPTICAL ATTACK MITIGATION

VERTICAL MEMORY DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH CAPACITOR ELECTRODES IN DIFFERENT...

METHOD AND RELATED STRUCTURE TO AUTHENTICATE INTEGRATED CIRCUIT WIT...

CAPACITOR STRUCTURE FOR INTEGRATED CIRCUIT AND RELATED METHODS

CAPACITOR STRUCTURE WITH MIM LAYER OVER METAL PILLARS

CONDUCTIVE STRUCTURES FOR CONTACTING A TOP ELECTRODE OF AN EMBEDDED...

METHODS OF FORMING A CONDUCTIVE CONTACT STRUCTURE TO A TOP ELECTROD...

VERTICAL MEMORY DEVICES

CAPACITOR STRUCTURE FOR INTEGRATED CIRCUIT, AND RELATED METHODS

MULTIPLE-TIME PROGRAMMABLE (MTP) MEMORY DEVICE WITH A WRAP-AROUND C...

SMOOTH SIDEWALL STRUCTURES

VIA STRUCTURES AND VIA PATTERNING USING OBLIQUE ANGLE DEPOSITION PR...

INTERCONNECTS WITH NON-MANDREL CUTS FORMED BY EARLY BLOCK PATTERNING

INTEGRATED CIRCUIT STRUCTURE TO REDUCE SOFT-FAIL INCIDENCE AND METH...

INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATIO...

INTERCONNECT STRUCTURES WITH REDUCED CAPACITANCE

SELF-ALIGNED SINGLE DIFFUSION BREAK FOR FULLY DEPLETED SILICON-ON-I...

AIR GAP FORMATION IN BACK-END-OF-LINE STRUCTURES

STRUCTURE AND METHOD TO REDUCE SHORTS AND CONTACT RESISTANCE IN SEM...

BACK-END-OF-LINE STRUCTURES WITH AIR GAPS

LITHO-LITHO-ETCH DOUBLE PATTERNING METHOD

INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATIO...

DUAL DEVELOPING METHODS FOR LITHOGRAPHY PATTERNING

EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL) REFLECTIVE MASK

INTERCONNECT STRUCTURES FOR A METAL-INSULATOR-METAL CAPACITOR

METAL GATE FORMATION USING AN ENERGY REMOVAL FILM