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Tadahiro Ishizaka
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Waterlivet, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Post deposition plasma cleaning system and method
Patent number
8,974,868
Issue date
Mar 10, 2015
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Radiation-assisted selective deposition of metal-containing cap layers
Patent number
8,716,132
Issue date
May 6, 2014
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Diffusion barrier for integrated circuits formed from a layer of re...
Patent number
8,372,739
Issue date
Feb 12, 2013
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diffusion barrier and adhesion layer for an interconnect structure
Patent number
8,058,728
Issue date
Nov 15, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated substrate processing in a vacuum processing tool
Patent number
8,034,406
Issue date
Oct 11, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device containing an aluminum tantalum carbonitride b...
Patent number
8,026,168
Issue date
Sep 27, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for in-situ refurbishing a ceramic substrate holder
Patent number
7,989,353
Issue date
Aug 2, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device with metal-containi...
Patent number
7,977,235
Issue date
Jul 12, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of integrating PEALD Ta-containing films into Cu metallization
Patent number
7,959,985
Issue date
Jun 14, 2011
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Void-free copper filling of recessed features for semiconductor dev...
Patent number
7,884,012
Issue date
Feb 8, 2011
Tokyo Electron Limited
Kenji Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming cobalt nitride cap layers
Patent number
7,846,841
Issue date
Dec 7, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for depositing a barrier layer on a low dielectric constant...
Patent number
7,829,158
Issue date
Nov 9, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming a ruthenium metal cap layer
Patent number
7,799,681
Issue date
Sep 21, 2010
Tokyo Electron Limited
Kenji Suzuki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing method and fabrication process of a semiconduc...
Patent number
7,772,111
Issue date
Aug 10, 2010
Tokyo Electron Limited
Taro Ikeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of light enhanced atomic layer deposition
Patent number
7,727,912
Issue date
Jun 1, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of forming a diffusion barrier and adhesion layer for an int...
Patent number
7,727,883
Issue date
Jun 1, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming cobalt tungsten cap layers
Patent number
7,718,527
Issue date
May 18, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film precursor tray for use in a film precursor evaporation system...
Patent number
7,708,835
Issue date
May 4, 2010
Tokyo Electron Limited
Kenji Suzuki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Plasma enhanced atomic layer deposition system
Patent number
7,651,568
Issue date
Jan 26, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of forming a metal carbide or metal carbonitride film having...
Patent number
7,645,484
Issue date
Jan 12, 2010
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor contact structure containing an oxidation-resistant d...
Patent number
7,592,257
Issue date
Sep 22, 2009
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Deposition method for forming a film including metal, nitrogen and...
Patent number
7,491,430
Issue date
Feb 17, 2009
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Plasma enhanced atomic layer deposition system having reduced conta...
Patent number
7,422,636
Issue date
Sep 9, 2008
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of plasma enhanced atomic layer deposition of TaC and TaCN f...
Patent number
7,407,876
Issue date
Aug 5, 2008
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of preparing a film layer-by-layer using plasma enhanced ato...
Patent number
7,338,901
Issue date
Mar 4, 2008
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing method and fabrication process of a semiconduc...
Patent number
7,332,426
Issue date
Feb 19, 2008
Tokyo Electron Limited
Taro Ikeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma enhanced atomic layer deposition system and method
Patent number
7,314,835
Issue date
Jan 1, 2008
Tokyo Electron Limited
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS FOR THERMAL AND PLASMA ENHANCED VAPOR DEPOSITION AND METH...
Publication number
20120315404
Publication date
Dec 13, 2012
TOKYO ELECTRON LIMITED
Yicheng Li
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
RADIATION-ASSISTED SELECTIVE DEPOSITION OF METAL-CONTAINING CAP LAYERS
Publication number
20100210108
Publication date
Aug 19, 2010
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE WITH METAL-CONTAINI...
Publication number
20100197135
Publication date
Aug 5, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING RUTHENIUM METAL CAP LAYERS
Publication number
20100081274
Publication date
Apr 1, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD FOR FORMING COBALT NITRIDE CAP LAYERS
Publication number
20100081275
Publication date
Apr 1, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING COBALT TUNGSTEN CAP LAYERS
Publication number
20100081276
Publication date
Apr 1, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A DIFFUSION BARRIER AND ADHESION LAYER FOR AN INT...
Publication number
20100081271
Publication date
Apr 1, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION BARRIER AND ADHESION LAYER FOR AN INTERCONNECT STRUCTURE
Publication number
20100078818
Publication date
Apr 1, 2010
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A RUTHENIUM METAL CAP LAYER
Publication number
20100015798
Publication date
Jan 21, 2010
TOKYO ELECTRON LIMITED
Kenji Suzuki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD OF FORMING A COBALT METAL NITRIDE BARRIER FILM
Publication number
20090246952
Publication date
Oct 1, 2009
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD FOR IN-SITU REFURBISHING A CERAMIC SUBSTRATE HOLDER
Publication number
20090166327
Publication date
Jul 2, 2009
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VOID-FREE COPPER FILLING OF RECESSED FEATURES FOR SEMICONDUCTOR DEV...
Publication number
20090087981
Publication date
Apr 2, 2009
TOKYO ELECTRON LIMITED
Kenji Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE CONTAINING AN ALUMINUM TANTALUM CARBONITRIDE B...
Publication number
20090045514
Publication date
Feb 19, 2009
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR CONTACT STRUCTURE CONTAINING AN OXIDATION-RESISTANT D...
Publication number
20080284020
Publication date
Nov 20, 2008
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTERCONNECT STRUCTURES CONTAINING A RUTHENIUM BARRIER FILM AND MET...
Publication number
20080237860
Publication date
Oct 2, 2008
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION BARRIER FOR INTEGRATED CIRCUITS FORMED FROM A LAYER OF RE...
Publication number
20080237859
Publication date
Oct 2, 2008
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Film-Forming Method and Recording Medium
Publication number
20080107825
Publication date
May 8, 2008
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Integrated substrate processing in a vacuum processing tool
Publication number
20080075835
Publication date
Mar 27, 2008
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method for Depositing a Barrier Layer on a Low Dielectric Constant...
Publication number
20070251445
Publication date
Nov 1, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of forming a metal carbide or metal carbonitride film having...
Publication number
20070231487
Publication date
Oct 4, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of plasma enhanced atomic layer deposition of TaC and TaCN f...
Publication number
20070218670
Publication date
Sep 20, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of integrating PEALD Ta- containing films into Cu metallization
Publication number
20070218683
Publication date
Sep 20, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of light enhanced atomic layer deposition
Publication number
20070218704
Publication date
Sep 20, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND FABRICATION PROCESS OF A SEMICONDUC...
Publication number
20070134907
Publication date
Jun 14, 2007
TOKYO ELECTRON LIMITED
Taro Ikeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus for thermal and plasma enhanced vapor deposition and meth...
Publication number
20070116873
Publication date
May 24, 2007
TOKYO ELECTRON LIMITED
Yicheng Li
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Apparatus for thermal and plasma enhanced vapor deposition and meth...
Publication number
20070116872
Publication date
May 24, 2007
TOKYO ELECTRON LIMITED
Yicheng Li
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of forming a tantalum-containing layer from a metalorganic p...
Publication number
20070054047
Publication date
Mar 8, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of forming a tantalum-containing layer from a metalorganic p...
Publication number
20070054046
Publication date
Mar 8, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of preparing a film layer-by-layer using plasma enhanced ato...
Publication number
20070042577
Publication date
Feb 22, 2007
TOKYO ELECTRON LIMITED
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Plasma enhanced atomic layer deposition system having reduced conta...
Publication number
20060213439
Publication date
Sep 28, 2006
Tadahiro Ishizaka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...