Tadanori Shimoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate and semiconductor device
- Patent number 7,745,736
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 7,696,007
- Issue date Apr 13, 2010
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 7,585,699
- Issue date Sep 8, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,566,834
- Issue date Jul 28, 2009
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting board, method of manufacturing the sa...
- Patent number 7,474,538
- Issue date Jan 6, 2009
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,397,000
- Issue date Jul 8, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
- Patent number 7,338,884
- Issue date Mar 4, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet material and wiring board
- Patent number 7,294,393
- Issue date Nov 13, 2007
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,233,066
- Issue date Jun 19, 2007
- NEC Electronics Corporation
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,060,604
- Issue date Jun 13, 2006
- NGK Spark Plug Co., Ltd.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
- Patent number 6,861,757
- Issue date Mar 1, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package board using a metal base
- Patent number 6,841,862
- Issue date Jan 11, 2005
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assembly and a method of connecting electronic de...
- Patent number 6,798,070
- Issue date Sep 28, 2004
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assembly and a method of connecting electronic de...
- Patent number 6,576,499
- Issue date Jun 10, 2003
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin laminated wiring sheet, wiring structure using the same, and...
- Patent number 6,444,403
- Issue date Sep 3, 2002
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier film and process for producing the same
- Patent number 6,333,136
- Issue date Dec 25, 2001
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor formed in via
- Patent number 6,278,153
- Issue date Aug 21, 2001
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor carrier and method for manufacturing the same
- Patent number 6,204,565
- Issue date Mar 20, 2001
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier film and process for producing the same
- Patent number 6,156,414
- Issue date Dec 5, 2000
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrically conductive wiring pattern
- Patent number 6,150,074
- Issue date Nov 21, 2000
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring structure
- Patent number 5,889,233
- Issue date Mar 30, 1999
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structures and method of making same
- Patent number 5,830,563
- Issue date Nov 3, 1998
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with passivation layer of benzocyclobutene pol...
- Patent number 5,712,506
- Issue date Jan 27, 1998
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 5,483,101
- Issue date Jan 9, 1996
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal device with benzocyclobutene alignment layer and pro...
- Patent number 5,287,208
- Issue date Feb 15, 1994
- NEC Corporation
- Tadanori Shimoto
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE BOARD USING A METAL BASE
- Publication number 20090162974
- Publication date Jun 25, 2009
- NEC CORPORATION
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Method for Producing Same
- Publication number 20090001604
- Publication date Jan 1, 2009
- Daisuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20080258283
- Publication date Oct 23, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20060244137
- Publication date Nov 2, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate and semiconductor device
- Publication number 20060192287
- Publication date Aug 31, 2006
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20060189125
- Publication date Aug 24, 2006
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate for mounting semiconductors, method of manufacturi...
- Publication number 20060012048
- Publication date Jan 19, 2006
- NEC CORPORATION AND NEC ELECTRONICS CORPORATION
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sheet material and wiring board
- Publication number 20050281995
- Publication date Dec 22, 2005
- Hideya Murai
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring board and semiconductor package using the same
- Publication number 20050252682
- Publication date Nov 17, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate for carrying semiconductor device, method...
- Publication number 20050130413
- Publication date Jun 16, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20050098875
- Publication date May 12, 2005
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device mounting board, method of manufacturing the sa...
- Publication number 20050088833
- Publication date Apr 28, 2005
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board, semiconductor package, base insulating film,...
- Publication number 20040089470
- Publication date May 13, 2004
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20040053489
- Publication date Mar 18, 2004
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate for carrying semiconductor device, method...
- Publication number 20030045024
- Publication date Mar 6, 2003
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device assembly and a method of connecting electronic de...
- Publication number 20020042164
- Publication date Apr 11, 2002
- NEC Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board for high dense mounting and method of producing the same
- Publication number 20020024138
- Publication date Feb 28, 2002
- NEC Corporation
- Tadanori Shimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film capacitor avoiding short circuit between electrodes
- Publication number 20020020836
- Publication date Feb 21, 2002
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package board using a metal base
- Publication number 20020001937
- Publication date Jan 3, 2002
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device assembly and a method of connecting electronic de...
- Publication number 20010003656
- Publication date Jun 14, 2001
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS

Tadanori Shimoto

Person

Patents Grantslast 30 patents

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring substrate for mounting semiconductors, method of manufacturi...

Interconnecting substrate and semiconductor device

Semiconductor package board using a metal base

Semiconductor package board using a metal base

Wiring board and semiconductor package using the same

Semiconductor device mounting board, method of manufacturing the sa...

Wiring board and semiconductor package using the same

Interconnecting substrate for carrying semiconductor device, method...

Sheet material and wiring board

Multilayer wiring substrate, and method of producing same

Multilayer wiring substrate, and method of producing same

Interconnecting substrate for carrying semiconductor device, method...

Semiconductor package board using a metal base

Electronic device assembly and a method of connecting electronic de...

Electronic device assembly and a method of connecting electronic de...

Resin laminated wiring sheet, wiring structure using the same, and...

Carrier film and process for producing the same

Thin film capacitor formed in via

Semiconductor carrier and method for manufacturing the same

Carrier film and process for producing the same

Method of forming electrically conductive wiring pattern

Multilayer wiring structure

Interconnection structures and method of making same

Semiconductor device with passivation layer of benzocyclobutene pol...

Multilayer printed circuit board

Liquid crystal device with benzocyclobutene alignment layer and pro...

Patents Applicationslast 30 patents

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

SEMICONDUCTOR PACKAGE BOARD USING A METAL BASE

Semiconductor Package and Method for Producing Same

WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor package board using a metal base

Interconnecting substrate and semiconductor device

Multilayer wiring substrate, and method of producing same

Wiring substrate for mounting semiconductors, method of manufacturi...

Sheet material and wiring board

Wiring board and semiconductor package using the same

Interconnecting substrate for carrying semiconductor device, method...

Semiconductor package board using a metal base

Semiconductor device mounting board, method of manufacturing the sa...

Printed circuit board, semiconductor package, base insulating film,...

Multilayer wiring substrate, and method of producing same

Interconnecting substrate for carrying semiconductor device, method...

Electronic device assembly and a method of connecting electronic de...

Wiring board for high dense mounting and method of producing the same

Thin film capacitor avoiding short circuit between electrodes

Semiconductor package board using a metal base

Electronic device assembly and a method of connecting electronic de...