Taizo Tomioka

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for joining dissimilar metals, joined body, and joining appa...
- Patent number 11,897,050
- Issue date Feb 13, 2024
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Distance measuring device, friction stir welding apparatus, and fri...
- Patent number 11,331,745
- Issue date May 17, 2022
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Friction stir welding equipment
- Patent number 10,994,367
- Issue date May 4, 2021
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Friction stir welding method and joined body
- Patent number 10,549,379
- Issue date Feb 4, 2020
- Kabushiki Kaisha Toshiba
- Takashi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor chip, semiconductor chip, and...
- Patent number 10,410,976
- Issue date Sep 10, 2019
- Kabushiki Kaisha Toshiba
- Yusaku Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery and ultrasonic bonding method for battery
- Patent number 9,853,279
- Issue date Dec 26, 2017
- Kabushiki Kaisha Toshiba
- Takahiro Aizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor chip, semiconductor chip, and...
- Patent number 9,460,967
- Issue date Oct 4, 2016
- Kabushiki Kaisha Toshiba
- Yusaku Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Luminescent device and method for manufacturing the same
- Patent number 7,947,999
- Issue date May 24, 2011
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method for manufacturing optical s...
- Patent number 7,683,394
- Issue date Mar 23, 2010
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method of manufacturing the same
- Patent number 7,510,911
- Issue date Mar 31, 2009
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer and method of manufactu...
- Patent number 7,205,239
- Issue date Apr 17, 2007
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor relay apparatus and wiring board fabrication method
- Patent number 7,189,962
- Issue date Mar 13, 2007
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number D521952
- Issue date May 30, 2006
- Kabushiki Kaisha Toshiba
- Tatsuya Yamada
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device
- Patent number D508682
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Tatsuya Yamada
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Optically coupled semiconductor device and method for manufacturing...
- Patent number 6,861,675
- Issue date Mar 1, 2005
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISTANCE MEASURING DEVICE, FRICTION STIR WELDING APPARATUS, AND FRI...
- Publication number 20200246908
- Publication date Aug 6, 2020
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL STRUCTURE AND COIL ASSEMBLING METHOD
- Publication number 20200067389
- Publication date Feb 27, 2020
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
FRICTION STIR WELDING TOOL, FRICTION STIR WELDING APPARATUS, AND FR...
- Publication number 20190275607
- Publication date Sep 12, 2019
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRICTION STIR WELDING EQUIPMENT
- Publication number 20180297146
- Publication date Oct 18, 2018
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLUGGING ORIFICE
- Publication number 20170361395
- Publication date Dec 21, 2017
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRICTION STIR WELDING METHOD AND JOINED BODY
- Publication number 20170225265
- Publication date Aug 10, 2017
- KABUSHIKI KAISHA TOSHIBA
- Takashi ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...
- Publication number 20160358863
- Publication date Dec 8, 2016
- KABUSHIKI KAISHA TOSHIBA
- Yusaku ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRICTION STIR WELDING DEVICE
- Publication number 20160059344
- Publication date Mar 3, 2016
- KABUSHIKI KAISHA TOSHIBA
- Takashi ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20160035657
- Publication date Feb 4, 2016
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...
- Publication number 20150130028
- Publication date May 14, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yusaku ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTION MOTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20150084473
- Publication date Mar 26, 2015
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY AND ULTRASONIC BONDING METHOD FOR BATTERY
- Publication number 20120070720
- Publication date Mar 22, 2012
- Kabushiki Kaisha Toshiba
- Takahiro AIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100195291
- Publication date Aug 5, 2010
- Kabushiki Kaisha Toshiba
- Akiya KIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CELLULAR PHONE
- Publication number 20100075719
- Publication date Mar 25, 2010
- Taizo TOMIOKA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE APPARATUS
- Publication number 20090197653
- Publication date Aug 6, 2009
- Kabushiki Kaisha Toshiba
- Satoshi Mizoguch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE TERMINAL AND SOUND INPUT/OUTPUT CONTROL METHOD FOR MOBILE T...
- Publication number 20090147970
- Publication date Jun 11, 2009
- Kabushiki Kaisha Toshiba
- Hiroshi SHIMASAKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PORTABLE ELECTRONIC DEVICE
- Publication number 20090103260
- Publication date Apr 23, 2009
- Taizo TOMIOKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OPTICAL S...
- Publication number 20080210964
- Publication date Sep 4, 2008
- Kabushiki Kaisha Toshiba
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20080179751
- Publication date Jul 31, 2008
- Kabushiki Kaisha Toshiba
- Tomoyuki Kitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LUMINESCENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070145403
- Publication date Jun 28, 2007
- Kabushiki Kaisha Toshiba
- Taizo TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor wafer and method of manufactu...
- Publication number 20060032834
- Publication date Feb 16, 2006
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor relay apparatus and wiring board fabrication method
- Publication number 20050189474
- Publication date Sep 1, 2005
- Taizo Tomioka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor apparatus and method of manufacturing the same
- Publication number 20050029651
- Publication date Feb 10, 2005
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optically coupled semiconductor device and method for manufacturing...
- Publication number 20040000674
- Publication date Jan 1, 2004
- Taizo Tomioka
- H01 - BASIC ELECTRIC ELEMENTS

Taizo Tomioka

Person

Patents Grantslast 30 patents

Method for joining dissimilar metals, joined body, and joining appa...

Distance measuring device, friction stir welding apparatus, and fri...

Friction stir welding equipment

Friction stir welding method and joined body

Method of manufacturing semiconductor chip, semiconductor chip, and...

Battery and ultrasonic bonding method for battery

Method of manufacturing semiconductor chip, semiconductor chip, and...

Luminescent device and method for manufacturing the same

Optical semiconductor device and method for manufacturing optical s...

Semiconductor apparatus and method of manufacturing the same

Method of manufacturing semiconductor wafer and method of manufactu...

Semiconductor relay apparatus and wiring board fabrication method

Semiconductor device

Semiconductor device

Optically coupled semiconductor device and method for manufacturing...

Patents Applicationslast 30 patents

DISTANCE MEASURING DEVICE, FRICTION STIR WELDING APPARATUS, AND FRI...

COIL STRUCTURE AND COIL ASSEMBLING METHOD

FRICTION STIR WELDING TOOL, FRICTION STIR WELDING APPARATUS, AND FR...

FRICTION STIR WELDING EQUIPMENT

METHOD FOR PLUGGING ORIFICE

FRICTION STIR WELDING METHOD AND JOINED BODY

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...

FRICTION STIR WELDING DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...

INDUCTION MOTOR AND MANUFACTURING METHOD THEREOF

BATTERY AND ULTRASONIC BONDING METHOD FOR BATTERY

ELECTRONIC CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

CELLULAR PHONE

MOBILE APPARATUS

MOBILE TERMINAL AND SOUND INPUT/OUTPUT CONTROL METHOD FOR MOBILE T...

PORTABLE ELECTRONIC DEVICE

OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OPTICAL S...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

LUMINESCENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing semiconductor wafer and method of manufactu...

Semiconductor relay apparatus and wiring board fabrication method

Semiconductor apparatus and method of manufacturing the same

Optically coupled semiconductor device and method for manufacturing...