Takaharu Mae

Person

Hirakata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component mounting method, component mounting apparatus, and ultras...
- Patent number 7,861,908
- Issue date Jan 4, 2011
- Panasonic Corporation
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,516,878
- Issue date Apr 14, 2009
- Panasonic Corporation
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 7,387,229
- Issue date Jun 17, 2008
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting electronic components
- Patent number 7,296,727
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shunji Onobori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and apparatus and ultrasonic b...
- Patent number 7,229,854
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,052,984
- Issue date May 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for correcting inclination of IC on semiconduc...
- Patent number 7,031,509
- Issue date Apr 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump forming apparatus for charge appearance semiconductor substrat...
- Patent number 7,014,092
- Issue date Mar 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...
- Patent number 7,005,368
- Issue date Feb 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...
- Patent number 6,818,975
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 6,787,391
- Issue date Sep 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Working method for holding a work object by suction
- Patent number 6,619,535
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,568,580
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,494,358
- Issue date Dec 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,392,202
- Issue date May 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,329,640
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,302,317
- Issue date Oct 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method and bump bonder
- Patent number 6,098,868
- Issue date Aug 8, 2000
- Masushita Electric Industrial Co., Ltd.
- Takaharu Mae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parts feeder
- Patent number 4,763,811
- Issue date Aug 16, 1988
- Matsushita Electric Industrial Co., Ltd.
- Takaharu Mae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20080179378
- Publication date Jul 31, 2008
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting method, component mounting apparatus, and ultras...
- Publication number 20070187457
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump formation method and bump forming apparatus for semiconductor...
- Publication number 20060102701
- Publication date May 18, 2006
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting method and apparatus and ultrasondic...
- Publication number 20050227429
- Publication date Oct 13, 2005
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic components
- Publication number 20050098610
- Publication date May 12, 2005
- Shunji Onobori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20040149803
- Publication date Aug 5, 2004
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump forming apparatus for charge appearance semiconductor substrat...
- Publication number 20040035849
- Publication date Feb 26, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and bump forming apparatus to semiconductor w...
- Publication number 20040020973
- Publication date Feb 5, 2004
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for correcting inclination of IC on semiconduc...
- Publication number 20020061129
- Publication date May 23, 2002
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Publication number 20020011479
- Publication date Jan 31, 2002
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042771
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042772
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS

Takaharu Mae

Person

Patents Grantslast 30 patents

Component mounting method, component mounting apparatus, and ultras...

Bump formation method and bump forming apparatus for semiconductor...

Method of forming bumps on a wafer utilizing a post-heating operati...

Apparatus and method for forming bump

Apparatus and method for mounting electronic components

Electronic component mounting method and apparatus and ultrasonic b...

Bump formation method and bump forming apparatus for semiconductor...

Method and apparatus for correcting inclination of IC on semiconduc...

Bump forming apparatus for charge appearance semiconductor substrat...

BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...

Device and method for forming bump

ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...

Method of forming bumps on a wafer utilizing a post-heating operati...

Working method for holding a work object by suction

Bump bonding apparatus and method

Bump bonding apparatus and method

Heating apparatus for bump bonding, bump bonding method and bump fo...

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Bump forming method and bump bonder

Parts feeder

Patents Applicationslast 30 patents

Method of forming bumps on a wafer utilizing a post-heating operati...

Component mounting method, component mounting apparatus, and ultras...

Bump formation method and bump forming apparatus for semiconductor...

Electronic component mounting method and apparatus and ultrasondic...

Apparatus and method for forming bump

Apparatus and method for mounting electronic components

Method of forming bumps on a wafer utilizing a post-heating operati...

Device and method for forming bump

Bump forming apparatus for charge appearance semiconductor substrat...

Bump formation method and bump forming apparatus to semiconductor w...

Method and apparatus for correcting inclination of IC on semiconduc...

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Bump bonding apparatus and method