Takao Ochi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus including a heat dissipating member
- Patent number 9,437,517
- Issue date Sep 6, 2016
- Panasonic Corporation
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor device, apparatus for producing the same, and...
- Patent number 8,125,079
- Issue date Feb 28, 2012
- Panasonic Corporation
- Tetsuo Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board, lead frame, semiconductor device, and method for fab...
- Patent number 8,039,941
- Issue date Oct 18, 2011
- Panasonic Corporation
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storing tray and storing device
- Patent number 7,882,957
- Issue date Feb 8, 2011
- Panasonic Corporation
- Takao Ochi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Production equipment of resin molding semiconductor device, method...
- Patent number 7,482,701
- Issue date Jan 27, 2009
- Panasonic Corporation
- Tetsuo Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Card-type circuit device
- Patent number 7,268,417
- Issue date Sep 11, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,154,189
- Issue date Dec 26, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device
- Patent number 7,149,091
- Issue date Dec 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information storage semiconductor element
- Patent number D525214
- Issue date Jul 18, 2006
- Matsushita Electrical Industrial Co., Ltd.
- Takao Ochi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Information storage semiconductor element
- Patent number D522978
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,905,912
- Issue date Jun 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory element
- Patent number D487430
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Nobuyoshi Asaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,582,991
- Issue date Jun 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a lead clamping arrangement
- Patent number 5,998,866
- Issue date Dec 7, 1999
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 5,776,802
- Issue date Jul 7, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of mounting semiconductor chip
- Patent number 5,708,293
- Issue date Jan 13, 1998
- Matsushita Electronics Corporation
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING HEAT DISSIPATION STRUCTURE AND LAMINATE...
- Publication number 20160035647
- Publication date Feb 4, 2016
- PANASONIC CORPORATION
- TAKAO OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS INCLUDING A HEAT DISSIPATING MEMBER
- Publication number 20150303125
- Publication date Oct 22, 2015
- PANASONIC CORPORATION
- TAKAO OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20120175788
- Publication date Jul 12, 2012
- PANASONIC CORPORATION
- Takao OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR FAB...
- Publication number 20090289347
- Publication date Nov 26, 2009
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production equipment of resin molding semiconductor device, method...
- Publication number 20080036069
- Publication date Feb 14, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Production equipment of resin molding semiconductor device, method...
- Publication number 20080029930
- Publication date Feb 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Storing tray and storing device
- Publication number 20060054532
- Publication date Mar 16, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050121761
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic circuit device
- Publication number 20040212061
- Publication date Oct 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic circuit device
- Publication number 20030227025
- Publication date Dec 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030207492
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Semiconductor apparatus including a heat dissipating member

Molded semiconductor device, apparatus for producing the same, and...

Circuit board, lead frame, semiconductor device, and method for fab...

Storing tray and storing device

Production equipment of resin molding semiconductor device, method...

Card-type circuit device

Semiconductor device and method for fabricating the same

Electronic circuit device

Information storage semiconductor element

Information storage semiconductor element

Semiconductor device and method for fabricating the same

Semiconductor memory element

Semiconductor device and method for fabricating the same

Semiconductor device having a lead clamping arrangement

Semiconductor device and manufacturing method of the same

Lead frame and method of mounting semiconductor chip

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING HEAT DISSIPATION STRUCTURE AND LAMINATE...

SEMICONDUCTOR APPARATUS INCLUDING A HEAT DISSIPATING MEMBER

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR FAB...

Production equipment of resin molding semiconductor device, method...

Production equipment of resin molding semiconductor device, method...

Storing tray and storing device

Semiconductor device and method for fabricating the same

Electronic circuit device

Electronic circuit device

Semiconductor device and method for fabricating the same