Takatoshi Masuda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Segment-core coupled body and method of manufacturing armature
- Patent number 11,616,407
- Issue date Mar 28, 2023
- Mitsubishi Electric Corporation
- Tatsuro Hino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stator for rotating electric machine, and rotating electric machine
- Patent number 11,095,173
- Issue date Aug 17, 2021
- Mitsubishi Electric Corporation
- Koji Kawamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stator for rotary electric machine, rotary electric machine, and me...
- Patent number 10,886,823
- Issue date Jan 5, 2021
- Mitsubishi Electric Corporation
- Koji Kawamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stator for rotary electric machine
- Patent number 10,756,588
- Issue date Aug 25, 2020
- Mitsubishi Electric Corporation
- Koji Kawamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Dividing method for wafer
- Patent number 9,159,622
- Issue date Oct 13, 2015
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stator of vehicle AC generator and method for manufacturing the same
- Patent number 8,716,914
- Issue date May 6, 2014
- Mitsubishi Electric Corporation
- Kazunori Tanaka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Dividing method for wafer having die bonding film attached to the b...
- Patent number 8,415,232
- Issue date Apr 9, 2013
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method for wafer having crystal orientation
- Patent number 8,100,742
- Issue date Jan 24, 2012
- Disco Corporation
- Takatoshi Masuda
- B24 - GRINDING POLISHING
Information Patent Grant
Method of grinding wafer
- Patent number 8,025,556
- Issue date Sep 27, 2011
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method for wafer and processing apparatus therefor
- Patent number 7,858,530
- Issue date Dec 28, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer
- Patent number 7,718,511
- Issue date May 18, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method for wafer
- Patent number 7,677,955
- Issue date Mar 16, 2010
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method of wafer
- Patent number 7,622,328
- Issue date Nov 24, 2009
- Disco Corporation
- Takatoshi Masuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for producing semiconductor package
- Patent number 7,608,481
- Issue date Oct 27, 2009
- Disco Corporation
- Takatoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing wafer into individual devices after forming a re...
- Patent number 7,439,162
- Issue date Oct 21, 2008
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer and processing apparatus therefor
- Patent number 7,278,903
- Issue date Oct 9, 2007
- Disco Corporation
- Takatoshi Masuda
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEGMENT-CORE COUPLED BODY AND METHOD OF MANUFACTURING ARMATURE
- Publication number 20200251968
- Publication date Aug 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Tatsuro HINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STATOR FOR ROTARY ELECTRIC MACHINE
- Publication number 20190260251
- Publication date Aug 22, 2019
- Mitsubishi Electric Corporation
- Koji KAWAMURA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STATOR FOR ROTARY ELECTRIC MACHINE, ROTARY ELECTRIC MACHINE, AND ME...
- Publication number 20190097502
- Publication date Mar 28, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Koji KAWAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STATOR FOR ROTATING ELECTRIC MACHINE, AND ROTATING ELECTRIC MACHINE
- Publication number 20190036390
- Publication date Jan 31, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Koji Kawamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COIL FORMING DEVICE AND COIL FORMING METHOD
- Publication number 20180331605
- Publication date Nov 15, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Naohiro MOTOISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ARMATURE AND ROTATING ELECTRIC MACHINE
- Publication number 20180006512
- Publication date Jan 4, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Hironori TSUIKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DIVIDING METHOD FOR WAFER
- Publication number 20150044857
- Publication date Feb 12, 2015
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PROCESSING APPARATUS
- Publication number 20140209240
- Publication date Jul 31, 2014
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIVIDING METHOD FOR WAFER HAVING DIE BONDING FILM ATTACHED TO THE B...
- Publication number 20120100694
- Publication date Apr 26, 2012
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STATOR OF VEHICLE AC GENERATOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120062065
- Publication date Mar 15, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Kazunori Tanaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
GRINDING METHOD FOR WAFER HAVING CRYSTAL ORIENTATION
- Publication number 20090247056
- Publication date Oct 1, 2009
- Disco Corporation
- Takatoshi Masuda
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20090186562
- Publication date Jul 23, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD FOR WAFER
- Publication number 20090098808
- Publication date Apr 16, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Protective tape applying method
- Publication number 20070249146
- Publication date Oct 25, 2007
- DISCO CORPORATION
- Takatoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing method for wafer
- Publication number 20070231929
- Publication date Oct 4, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing method for wafer and processing apparatus therefor
- Publication number 20070227655
- Publication date Oct 4, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing semiconductor package
- Publication number 20070218593
- Publication date Sep 20, 2007
- DISCO CORPORATION
- Takatoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing method for wafer and processing apparatus therefor
- Publication number 20070141955
- Publication date Jun 21, 2007
- DISCO CORPORATION
- Takatoshi Masuda
- B24 - GRINDING POLISHING
Information Patent Application
Wafer dividing method
- Publication number 20070123002
- Publication date May 31, 2007
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing method of wafer
- Publication number 20070077731
- Publication date Apr 5, 2007
- DISCO CORPORATION
- Takatoshi Masuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wafer processing method
- Publication number 20070004177
- Publication date Jan 4, 2007
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Takatoshi Masuda

Person

Patents Grantslast 30 patents

Segment-core coupled body and method of manufacturing armature

Stator for rotating electric machine, and rotating electric machine

Stator for rotary electric machine, rotary electric machine, and me...

Stator for rotary electric machine

Dividing method for wafer

Stator of vehicle AC generator and method for manufacturing the same

Dividing method for wafer having die bonding film attached to the b...

Grinding method for wafer having crystal orientation

Method of grinding wafer

Processing method for wafer and processing apparatus therefor

Processing method for wafer

Grinding method for wafer

Processing method of wafer

Method for producing semiconductor package

Method of dividing wafer into individual devices after forming a re...

Processing method for wafer and processing apparatus therefor

Patents Applicationslast 30 patents

SEGMENT-CORE COUPLED BODY AND METHOD OF MANUFACTURING ARMATURE

STATOR FOR ROTARY ELECTRIC MACHINE

STATOR FOR ROTARY ELECTRIC MACHINE, ROTARY ELECTRIC MACHINE, AND ME...

STATOR FOR ROTATING ELECTRIC MACHINE, AND ROTATING ELECTRIC MACHINE

COIL FORMING DEVICE AND COIL FORMING METHOD

ARMATURE AND ROTATING ELECTRIC MACHINE

DIVIDING METHOD FOR WAFER

VACUUM PROCESSING APPARATUS

DIVIDING METHOD FOR WAFER HAVING DIE BONDING FILM ATTACHED TO THE B...

STATOR OF VEHICLE AC GENERATOR AND METHOD FOR MANUFACTURING THE SAME

GRINDING METHOD FOR WAFER HAVING CRYSTAL ORIENTATION

METHOD OF GRINDING WAFER

GRINDING METHOD FOR WAFER

Protective tape applying method

Processing method for wafer

Processing method for wafer and processing apparatus therefor

Method for producing semiconductor package

Processing method for wafer and processing apparatus therefor

Wafer dividing method

Processing method of wafer

Wafer processing method