TAKESHI KAWABATA

Person

OSAKA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,189,549
- Issue date Nov 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,847,702
- Issue date Nov 24, 2020
- PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,305,008
- Issue date May 28, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked chips, a re-distribution layer,...
- Patent number 9,917,066
- Issue date Mar 13, 2018
- Panasonic Corporation
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,793
- Issue date Sep 13, 2016
- Panasonic Corporation
- Hiroki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,105,463
- Issue date Aug 11, 2015
- Panasonic Corporation
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chip-on-chip structure
- Patent number 9,093,338
- Issue date Jul 28, 2015
- Panasonic Corporation
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,035,442
- Issue date May 19, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting semiconductor light-emitting element
- Patent number 8,893,377
- Issue date Nov 25, 2014
- Panasonic Corporation
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,890,335
- Issue date Nov 18, 2014
- Panasonic Corporation
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for stacking and stacked semiconductor module
- Patent number 8,716,868
- Issue date May 6, 2014
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and inspection method thereof
- Patent number 8,552,549
- Issue date Oct 8, 2013
- Panasonic Corporation
- Masatoshi Shinagawa
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor module
- Patent number 8,159,061
- Issue date Apr 17, 2012
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and inspection method thereof
- Patent number 8,148,810
- Issue date Apr 3, 2012
- Panasonic Corporation
- Masatoshi Shinagawa
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for wiring, semiconductor device for stacking using the s...
- Patent number 8,125,792
- Issue date Feb 28, 2012
- Panasonic Corporation
- Takeshi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor module
- Patent number 8,008,766
- Issue date Aug 30, 2011
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin wiring substrate, and semiconductor device and laminated semi...
- Patent number 7,816,783
- Issue date Oct 19, 2010
- Panasonic Corporation
- Takeshi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor module
- Patent number 7,667,313
- Issue date Feb 23, 2010
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel semiconductor module and method for fabricating the same
- Patent number 7,586,183
- Issue date Sep 8, 2009
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and lower module of stacked semiconduc...
- Patent number 7,498,668
- Issue date Mar 3, 2009
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module and method for forming the same
- Patent number 7,443,028
- Issue date Oct 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Motoaki Satou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-level semiconductor module and method for fabricating the same
- Patent number 7,365,416
- Issue date Apr 29, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level semiconductor module
- Patent number 7,327,021
- Issue date Feb 5, 2008
- Matsushita Electric Industrial Co., Ltd.
- Motoaki Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,164,196
- Issue date Jan 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,154,189
- Issue date Dec 26, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,905,912
- Issue date Jun 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,582,991
- Issue date Jun 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210183747
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190221503
- Publication date Jul 18, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20190189881
- Publication date Jun 20, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Takeshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180040792
- Publication date Feb 8, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Takeshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, AND SOLID-STATE IMAGE ELEMENT FOR USE THEREIN
- Publication number 20160322410
- Publication date Nov 3, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- HIROKI YAMASHITA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150371971
- Publication date Dec 24, 2015
- PANASONIC CORPORATION
- KENJI YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140327157
- Publication date Nov 6, 2014
- NOBUO AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103536
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103502
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103504
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- HIROKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103544
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- KENJI YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND INSPECTION METHOD THEREOF
- Publication number 20120161313
- Publication date Jun 28, 2012
- PANASONIC CORPORATION
- MASATOSHI SHINAGAWA
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT
- Publication number 20120070917
- Publication date Mar 22, 2012
- PANASONIC CORPORATION
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20110156271
- Publication date Jun 30, 2011
- PANASONIC CORPORATION
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE FOR STACKING AND STACKED SEMICONDUCTOR MODULE
- Publication number 20100295186
- Publication date Nov 25, 2010
- PANASONIC CORPORATION
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR MODULE
- Publication number 20100148342
- Publication date Jun 17, 2010
- PANASONIC CORPORATION
- TAKESHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR MODULE
- Publication number 20100096739
- Publication date Apr 22, 2010
- PANASONIC CORPORATION
- TAKESHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR WIRING, SEMICONDUCTOR DEVICE FOR STACKING USING THE S...
- Publication number 20090147490
- Publication date Jun 11, 2009
- Panasonic Corporation
- Takeshi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin wiring substrate, and semiconductor device and laminated semi...
- Publication number 20080067661
- Publication date Mar 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, and inspection method thereof
- Publication number 20070138619
- Publication date Jun 21, 2007
- Matsushita Electric Industrial Co., Ltd.
- Masatoshi Shinagawa
- G01 - MEASURING TESTING
Information Patent Application
Stacked semiconductor device and lower module of stacked semiconduc...
- Publication number 20070096291
- Publication date May 3, 2007
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor module
- Publication number 20070096334
- Publication date May 3, 2007
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level semiconductor module
- Publication number 20070057358
- Publication date Mar 15, 2007
- Matsushita Electric Industrial Co., Ltd.
- Motoaki Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilevel semiconductor module and method for fabricating the same
- Publication number 20060231939
- Publication date Oct 19, 2006
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging module and method for forming the same
- Publication number 20060202318
- Publication date Sep 14, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Motoaki Satou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-level semiconductor module and method for fabricating the same
- Publication number 20060131740
- Publication date Jun 22, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level semiconductor module
- Publication number 20060131715
- Publication date Jun 22, 2006
- Motoaki Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level semiconductor module and method for fabricating the same
- Publication number 20060118934
- Publication date Jun 8, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takahito Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050121761
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030207492
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

TAKESHI KAWABATA

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor module

Semiconductor module and method for manufacturing the same

Semiconductor device having stacked chips, a re-distribution layer,...

Semiconductor device

Semiconductor device

Semiconductor device having chip-on-chip structure

Semiconductor module

Apparatus and method for mounting semiconductor light-emitting element

Semiconductor device

Semiconductor module for stacking and stacked semiconductor module

Semiconductor device, and inspection method thereof

Stacked semiconductor module

Semiconductor device, and inspection method thereof

Substrate for wiring, semiconductor device for stacking using the s...

Stacked semiconductor module

Resin wiring substrate, and semiconductor device and laminated semi...

Stacked semiconductor module

Multilevel semiconductor module and method for fabricating the same

Stacked semiconductor device and lower module of stacked semiconduc...

Imaging module and method for forming the same

Multi-level semiconductor module and method for fabricating the same

Multi-level semiconductor module

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

IMAGING DEVICE, AND SOLID-STATE IMAGE ELEMENT FOR USE THEREIN

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND INSPECTION METHOD THEREOF

APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE FOR STACKING AND STACKED SEMICONDUCTOR MODULE

STACKED SEMICONDUCTOR MODULE

STACKED SEMICONDUCTOR MODULE

SUBSTRATE FOR WIRING, SEMICONDUCTOR DEVICE FOR STACKING USING THE S...

Resin wiring substrate, and semiconductor device and laminated semi...

Semiconductor device, and inspection method thereof

Stacked semiconductor device and lower module of stacked semiconduc...

Stacked semiconductor module

Multi-level semiconductor module

Multilevel semiconductor module and method for fabricating the same

Imaging module and method for forming the same

Multi-level semiconductor module and method for fabricating the same

Multi-level semiconductor module

Multi-level semiconductor module and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same