Takeshi Nogami

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate thinning for a backside power distribution network
- Patent number 12,106,969
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal-insulator-metal (MIM) capacitors extending through b...
- Patent number 12,002,758
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having alternating selective metal and diel...
- Patent number 11,942,426
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect formation using graphene
- Patent number 11,908,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topological semi-metal interconnects
- Patent number 11,749,602
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for use in air gap formation
- Patent number 11,587,830
- Issue date Feb 21, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 11,348,872
- Issue date May 31, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects including dual-metal vias
- Patent number 11,302,637
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Balasubramanian S. Pranatharthi Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive RIE interconnect
- Patent number 11,189,528
- Issue date Nov 30, 2021
- International Business Machines Corporation
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic interconnect structure
- Patent number 11,164,776
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with self-forming wrap-all-around barrier layer
- Patent number 10,978,342
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 10,978,393
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 10,804,193
- Issue date Oct 13, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,770,347
- Issue date Sep 8, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for use in air gap formation
- Patent number 10,763,166
- Issue date Sep 1, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic alignment of a conductive line to a via
- Patent number 10,685,879
- Issue date Jun 16, 2020
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 10,643,890
- Issue date May 5, 2020
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure
- Patent number 10,593,591
- Issue date Mar 17, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 10,580,740
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect with filled void
- Patent number 10,529,663
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for cobalt interconnects
- Patent number 10,446,496
- Issue date Oct 15, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for cobalt interconnects
- Patent number 10,431,544
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 10,366,940
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing barrier in air gap technology
- Patent number 10,332,837
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES
- Publication number 20240222278
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPOLOGICAL SEMI-METAL INTERCONNECTS
- Publication number 20230361038
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20230335438
- Publication date Oct 19, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM DIELECTRIC ISOLATION INTEGRATION WITH BURIED POWER RAIL
- Publication number 20230154784
- Publication date May 18, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL-INSULATOR-METAL (MIM) CAPACITORS
- Publication number 20230133157
- Publication date May 4, 2023
- International Business Machines Corporation
- Ruilong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERCONNECT FORMATION USING GRAPHENE
- Publication number 20230106397
- Publication date Apr 6, 2023
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VERTICAL RESISTANCE SINGLE DAMASCENE INTERCONNECT
- Publication number 20230104164
- Publication date Apr 6, 2023
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTORS WITH BURIED POWER RAILS
- Publication number 20230094466
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ELECTRICAL CONTACTS TO BURIED POWER RAILS
- Publication number 20230093101
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Ruilong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL INTEGRATION
- Publication number 20220399224
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING CYCLIC DEPOSITION OF SELECTIVE METALS AND DIELECTRICS
- Publication number 20220359390
- Publication date Nov 10, 2022
- International Business Machines Corporation
- SON NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE THINNING FOR A BACKSIDE POWER DISTRIBUTION NETWORK
- Publication number 20220301878
- Publication date Sep 22, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPOLOGICAL SEMI-METAL INTERCONNECTS
- Publication number 20220157733
- Publication date May 19, 2022
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS INCLUDING DUAL-METAL VIAS
- Publication number 20220051976
- Publication date Feb 17, 2022
- International Business Machines Corporation
- Balasubramanian S. Pranatharthi Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE RIE INTERCONNECT
- Publication number 20210335665
- Publication date Oct 28, 2021
- International Business Machines Corporation
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC INTERCONNECT STRUCTURE
- Publication number 20210098292
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20210043563
- Publication date Feb 11, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200402848
- Publication date Dec 24, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20200402849
- Publication date Dec 24, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect with Self-Forming Wrap-All-Around Barrier Layer
- Publication number 20200243383
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...
- Publication number 20200091079
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200051854
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20190157146
- Publication date May 23, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20190148303
- Publication date May 16, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...
- Publication number 20190013278
- Publication date Jan 10, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20180374748
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Nogami

Person

Patents Grantslast 30 patents

Backside electrical contacts to buried power rails

Substrate thinning for a backside power distribution network

Semiconductor interconnect structure with double conductors

Backside metal-insulator-metal (MIM) capacitors extending through b...

Semiconductor structure having alternating selective metal and diel...

Backside power rail integration

Composite interconnect formation using graphene

Method of forming copper interconnect structure with manganese barr...

Topological semi-metal interconnects

Self-forming barrier for use in air gap formation

Hybrid dielectric scheme for varying liner thickness and manganese...

Interconnects including dual-metal vias

Copper interconnect structure with manganese barrier layer

Subtractive RIE interconnect

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Metallic interconnect structure

Interconnect with self-forming wrap-all-around barrier layer

Hybrid dielectric scheme for varying liner thickness and manganese...

Semiconductor interconnect structure with double conductors

Interconnect structure

Self-forming barrier for use in air gap formation

Lithographic alignment of a conductive line to a via

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Interconnect structure

Low-temperature diffusion doping of copper interconnects independen...

Copper interconnect with filled void

Self-forming barrier for cobalt interconnects

Self-forming barrier for cobalt interconnects

Air gap and air spacer pinch off

Enhancing barrier in air gap technology

Patents Applicationslast 30 patents

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

TOPOLOGICAL SEMI-METAL INTERCONNECTS

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

BOTTOM DIELECTRIC ISOLATION INTEGRATION WITH BURIED POWER RAIL

BACKSIDE METAL-INSULATOR-METAL (MIM) CAPACITORS

COMPOSITE INTERCONNECT FORMATION USING GRAPHENE

LOW VERTICAL RESISTANCE SINGLE DAMASCENE INTERCONNECT

NANOSHEET TRANSISTORS WITH BURIED POWER RAILS

BACKSIDE ELECTRICAL CONTACTS TO BURIED POWER RAILS

BACKSIDE POWER RAIL INTEGRATION

ALTERNATING CYCLIC DEPOSITION OF SELECTIVE METALS AND DIELECTRICS

SUBSTRATE THINNING FOR A BACKSIDE POWER DISTRIBUTION NETWORK

TOPOLOGICAL SEMI-METAL INTERCONNECTS

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

INTERCONNECTS INCLUDING DUAL-METAL VIAS

SUBTRACTIVE RIE INTERCONNECT

METALLIC INTERCONNECT STRUCTURE

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

INTERCONNECT STRUCTURE

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

Interconnect with Self-Forming Wrap-All-Around Barrier Layer

HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...

INTERCONNECT STRUCTURE

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...

INTERCONNECT STRUCTURE