Tao-Chih Chang

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 12,068,433
- Issue date Aug 20, 2024
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of fabricating the same and chip packa...
- Patent number 11,854,961
- Issue date Dec 26, 2023
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with housing having bending sections
- Patent number 11,756,858
- Issue date Sep 12, 2023
- Industrial Technology Research Institute
- Wei-Kuo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structures
- Patent number 11,538,842
- Issue date Dec 27, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,387,159
- Issue date Jul 12, 2022
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a curved portion between a plurality of co...
- Patent number 11,239,211
- Issue date Feb 1, 2022
- Industrial Technology Research Institute
- Wei-Kuo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,239,168
- Issue date Feb 1, 2022
- Industrial Technology Research Institute
- Hsin-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 11,158,762
- Issue date Oct 26, 2021
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-integrated structure
- Patent number 11,004,816
- Issue date May 11, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,790,412
- Issue date Sep 29, 2020
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structures
- Patent number 10,784,297
- Issue date Sep 22, 2020
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate component/assembly with raised thermal metal pad,...
- Patent number 10,743,411
- Issue date Aug 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,714,657
- Issue date Jul 14, 2020
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,672,677
- Issue date Jun 2, 2020
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 10,622,274
- Issue date Apr 14, 2020
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging and composite system board
- Patent number 10,490,478
- Issue date Nov 26, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package module and circuit board structure comprising the same
- Patent number 10,490,473
- Issue date Nov 26, 2019
- Industrial Technology Research Institute
- Shin-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,236,413
- Issue date Mar 19, 2019
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,069,037
- Issue date Sep 4, 2018
- Epistar Corporation
- Yen-Tai Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of a semiconductor light emitting device
- Patent number 10,037,980
- Issue date Jul 31, 2018
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and fabricating method thereof
- Patent number 9,721,931
- Issue date Aug 1, 2017
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission board and method for manufacturing the same
- Patent number 9,706,656
- Issue date Jul 11, 2017
- Industrial Technology Research Institute
- Chien-Min Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device and manufacturing method of a display
- Patent number 9,647,029
- Issue date May 9, 2017
- Industrial Technology Research Institute
- Wei-Chung Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked type power device module
- Patent number 9,142,473
- Issue date Sep 22, 2015
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for high/low voltage insulation
- Patent number 9,143,243
- Issue date Sep 22, 2015
- Industrial Technology Research Institute
- Shin-Yi Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bump structure and electronic packaging solder joint structure and...
- Patent number 9,024,441
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE
- Publication number 20220310473
- Publication date Sep 29, 2022
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220029055
- Publication date Jan 27, 2022
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20210210409
- Publication date Jul 8, 2021
- Industrial Technology Research Institute
- Wei-Kuo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKA...
- Publication number 20210082810
- Publication date Mar 18, 2021
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE STRUCTURE
- Publication number 20210066257
- Publication date Mar 4, 2021
- Industrial Technology Research Institute
- Wei-Kuo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210035914
- Publication date Feb 4, 2021
- Industrial Technology Research Institute
- Hsin-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURES
- Publication number 20210013256
- Publication date Jan 14, 2021
- Yu-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303587
- Publication date Sep 24, 2020
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...
- Publication number 20200245456
- Publication date Jul 30, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE
- Publication number 20200203246
- Publication date Jun 25, 2020
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200083332
- Publication date Mar 12, 2020
- Industrial Technology Research Institute
- Heng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME
- Publication number 20200075519
- Publication date Mar 5, 2020
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE AND CIRCUIT BOARD STRUCTURE COMPRISING THE SAME
- Publication number 20190237373
- Publication date Aug 1, 2019
- Industrial Technology Research Institute
- Shin-Yi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURES
- Publication number 20190206916
- Publication date Jul 4, 2019
- Industrial Technology Research Institute
- Yu-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190157507
- Publication date May 23, 2019
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20190109064
- Publication date Apr 11, 2019
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180374990
- Publication date Dec 27, 2018
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180358307
- Publication date Dec 13, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180261519
- Publication date Sep 13, 2018
- Industrial Technology Research Institute
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180233477
- Publication date Aug 16, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR LIGHT EMITTING DEVICE
- Publication number 20180145236
- Publication date May 24, 2018
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING AND COMPOSITE SYSTEM BOARD
- Publication number 20180019178
- Publication date Jan 18, 2018
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20170294421
- Publication date Oct 12, 2017
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170179341
- Publication date Jun 22, 2017
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF A DISPLAY
- Publication number 20170104027
- Publication date Apr 13, 2017
- Industrial Technology Research Institute
- Wei-Chung Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20170084521
- Publication date Mar 23, 2017
- Industrial Technology Research Institute
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170040491
- Publication date Feb 9, 2017
- EPISTAR CORPORATION
- Yen-Tai CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20160211415
- Publication date Jul 21, 2016
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160174360
- Publication date Jun 16, 2016
- Industrial Technology Research Institute
- Chien-Min HSU
- H01 - BASIC ELECTRIC ELEMENTS

Tao-Chih Chang

Person

Patents Grantslast 30 patents

Light-emitting device and manufacturing method thereof

Package substrate and method of fabricating the same and chip packa...

Chip package

Power module with housing having bending sections

Chip scale package structures

Chip package

Package structure and method for connecting components

Electronic device having a curved portion between a plurality of co...

Chip package structure

Light-emitting device and manufacturing method thereof

Electronic packaging structure

Hetero-integrated structure

Light-emitting device and manufacturing method thereof

Chip scale package structures

Ceramic substrate component/assembly with raised thermal metal pad,...

Light-emitting device and manufacturing method thereof

Semiconductor package structure

Chip package

Chip packaging and composite system board

Chip package module and circuit board structure comprising the same

Light-emitting device and manufacturing method thereof

Light-emitting device and manufacturing method thereof

Fabricating method of a semiconductor light emitting device

Semiconductor light emitting device and fabricating method thereof

Signal transmission board and method for manufacturing the same

Light-emitting device and manufacturing method of a display

Solder, solder joint structure and method of forming solder joint s...

Stacked type power device module

Power module for high/low voltage insulation

Bump structure and electronic packaging solder joint structure and...

Patents Applicationslast 30 patents

CHIP PACKAGE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKA...

ELECTRONIC DEVICE PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE

CHIP SCALE PACKAGE STRUCTURES

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...

CHIP PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

CHIP PACKAGE MODULE AND CIRCUIT BOARD STRUCTURE COMPRISING THE SAME

CHIP SCALE PACKAGE STRUCTURES

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGING STRUCTURE

PACKAGE STRUCTURE FOR LIGHT EMITTING DEVICE

CHIP PACKAGING AND COMPOSITE SYSTEM BOARD

FABRICATING METHOD OF A SEMICONDUCTOR LIGHT EMITTING DEVICE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF A DISPLAY

SEMICONDUCTOR PACKAGE STRUCTURE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF

SIGNAL TRANSMISSION BOARD AND METHOD FOR MANUFACTURING THE SAME