Membership
Tour
Register
Log in
Tarek A. Ibrahim
Follow
Person
Mesa, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
Patent number
12,068,172
Issue date
Aug 20, 2024
Intel Corporation
Tarek A. Ibrahim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic substrates having embedded inductors
Patent number
12,057,252
Issue date
Aug 6, 2024
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively roughened copper architectures for low insertion loss c...
Patent number
12,033,930
Issue date
Jul 9, 2024
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive route patterning for electronic substrates
Patent number
12,027,466
Issue date
Jul 2, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protruding SN substrate features for epoxy flow control
Patent number
12,009,271
Issue date
Jun 11, 2024
Intel Corporation
Edvin Cetegen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,923,307
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,817,390
Issue date
Nov 14, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
Patent number
11,798,887
Issue date
Oct 24, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corner guard for improved electroplated first level interconnect bu...
Patent number
11,776,864
Issue date
Oct 3, 2023
Intel Corporation
Jacob Vehonsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductors for package substrates
Patent number
11,764,150
Issue date
Sep 19, 2023
Intel Corporation
Sri Chaitra Jyotsna Chavali
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,640,942
Issue date
May 2, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sandwich-molded cores for high-inductance architectures
Patent number
11,622,448
Issue date
Apr 4, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,302,643
Issue date
Apr 12, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
Patent number
11,164,818
Issue date
Nov 2, 2021
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, system and method for providing MEMS structures of a semico...
Patent number
9,505,610
Issue date
Nov 29, 2016
Intel Corporation
Weng Hong Teh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...
Publication number
20240355758
Publication date
Oct 24, 2024
Intel Corporation
Steven Adam Klein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
Publication number
20240327201
Publication date
Oct 3, 2024
Intel Corporation
Numair Ahmed
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE
Publication number
20240329333
Publication date
Oct 3, 2024
Intel Corporation
Robert May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20240331921
Publication date
Oct 3, 2024
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
Publication number
20240258183
Publication date
Aug 1, 2024
Intel Corporation
Edvin CETEGEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240219660
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
G02 - OPTICS
Information
Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
Publication number
20240217216
Publication date
Jul 4, 2024
Intel Corporation
Kristof DARMAWIKARTA
B32 - LAYERED PRODUCTS
Information
Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
Publication number
20240222301
Publication date
Jul 4, 2024
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
Publication number
20240222283
Publication date
Jul 4, 2024
Intel Corporation
Hongxia Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
Publication number
20240213156
Publication date
Jun 27, 2024
Intel Corporation
Kristof DARMAWIKARTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic Assembly Including Interconnect Bridges with Throug...
Publication number
20240186250
Publication date
Jun 6, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
Publication number
20240114622
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
Publication number
20240113049
Publication date
Apr 4, 2024
Intel Corporation
Kristof Kuwawi Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
Publication number
20240111090
Publication date
Apr 4, 2024
Intel Corporation
Robert A. May
G02 - OPTICS
Information
Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING
Publication number
20240027706
Publication date
Jan 25, 2024
Intel Corporation
Pooya Tadayon
G02 - OPTICS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20240030142
Publication date
Jan 25, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES
Publication number
20240027697
Publication date
Jan 25, 2024
Intel Corporation
Wesley B. Morgan
G02 - OPTICS
Information
Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
Publication number
20240006297
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
Publication number
20230420375
Publication date
Dec 28, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
Publication number
20230395445
Publication date
Dec 7, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
Publication number
20230395467
Publication date
Dec 7, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
Publication number
20230343723
Publication date
Oct 26, 2023
Intel Corporation
Nicholas NEAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE WITH LOW-PERMITTIVITY CORE AND BUILDUP LAYERS
Publication number
20230317592
Publication date
Oct 5, 2023
Intel Corporation
Brandon Christian Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...
Publication number
20230317619
Publication date
Oct 5, 2023
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPA...
Publication number
20230197697
Publication date
Jun 22, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS
Publication number
20230187386
Publication date
Jun 15, 2023
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
Publication number
20230185033
Publication date
Jun 15, 2023
Intel Corporation
Kristof Kuwawi Darmawikarta
G02 - OPTICS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20230134770
Publication date
May 4, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE DIE TO FLOOR PLANNING WITH BUMP PITCH SCALE THROUGH GLASS...
Publication number
20230099632
Publication date
Mar 30, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE LAYER COUNT REDUCTION ENABLED WITH BUMP PITCH SCALE THROU...
Publication number
20230097236
Publication date
Mar 30, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS