Tasao Soga

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor power module
- Patent number 8,125,090
- Issue date Feb 28, 2012
- Hitachi, Ltd.
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor power module including epoxy resin coating
- Patent number 8,004,075
- Issue date Aug 23, 2011
- Hitachi, Ltd.
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder foil, semiconductor device and electronic device
- Patent number 7,722,962
- Issue date May 25, 2010
- Renesas Technology Corp.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 7,709,746
- Issue date May 4, 2010
- Renesas Technology Corp.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 7,671,465
- Issue date Mar 2, 2010
- Hitachi, Ltd.
- Sunao Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 7,547,966
- Issue date Jun 16, 2009
- Hitachi, Ltd.
- Sunao Funakoshi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device with lead-free solder
- Patent number 7,259,465
- Issue date Aug 21, 2007
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device having solder bumps reliably reflow solderable
- Patent number 7,145,236
- Issue date Dec 5, 2006
- Renesas Technology Corp.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,075,183
- Issue date Jul 11, 2006
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing an electronic device having a PB free solder co...
- Patent number 7,013,564
- Issue date Mar 21, 2006
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 6,960,396
- Issue date Nov 1, 2005
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder
- Patent number 6,872,465
- Issue date Mar 29, 2005
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,774,490
- Issue date Aug 10, 2004
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Product using Zn-Al alloy solder
- Patent number 6,563,225
- Issue date May 13, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electron device and semiconductor device
- Patent number 6,555,052
- Issue date Apr 29, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module having solder bumps and solder portions with d...
- Patent number 6,486,411
- Issue date Nov 26, 2002
- Hitachi, Ltd.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of manufacturing an electronic circuit board
- Patent number 6,204,490
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder used for connecting electronic parts on organic su...
- Patent number 5,942,185
- Issue date Aug 24, 1999
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric appliance, printed circuit board, remained life estimation...
- Patent number 5,867,809
- Issue date Feb 2, 1999
- Hitachi, Ltd.
- Tasao Soga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic multilayer circuit board and semiconductor module
- Patent number RE34887
- Issue date Mar 28, 1995
- Hitachi, Ltd.
- Nobuyuki Ushifusa
- 361 - Electricity: electrical systems and devices
Information Patent Grant
Semiconductor chip module
- Patent number 4,970,577
- Issue date Nov 13, 1990
- Hitachi, Ltd.
- Satoru Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,970,575
- Issue date Nov 13, 1990
- Hitachi, Ltd.
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus and semiconductor device employing the same
- Patent number 4,908,695
- Issue date Mar 13, 1990
- Hitachi, Ltd.
- Atsushi Morihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder carrier, manufacturing method thereof and method of mounting...
- Patent number 4,906,823
- Issue date Mar 6, 1990
- Hitachi, Ltd.
- Tadao Kushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor resin package structure
- Patent number 4,825,284
- Issue date Apr 25, 1989
- Hitachi, Ltd.
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic multilayer circuit board and semiconductor module
- Patent number 4,821,142
- Issue date Apr 11, 1989
- Hitachi, Ltd.
- Nobuyuki Ushifusa
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Heat-conducting cooling module
- Patent number 4,649,990
- Issue date Mar 17, 1987
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20100289148
- Publication date Nov 18, 2010
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, P...
- Publication number 20090116197
- Publication date May 7, 2009
- Sunao Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20080224303
- Publication date Sep 18, 2008
- Sunao Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20070246833
- Publication date Oct 25, 2007
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor module
- Publication number 20070216013
- Publication date Sep 20, 2007
- Sunao Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder composition for electronic devices
- Publication number 20070031279
- Publication date Feb 8, 2007
- Renesas Technology Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20060145352
- Publication date Jul 6, 2006
- Hitachi, Ltd
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20060115994
- Publication date Jun 1, 2006
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder foil semiconductor device and electronic device
- Publication number 20060061974
- Publication date Mar 23, 2006
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus
- Publication number 20040177997
- Publication date Sep 16, 2004
- Hanae Hata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20040007384
- Publication date Jan 15, 2004
- Hitachi, Ltd
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder
- Publication number 20030224197
- Publication date Dec 4, 2003
- Hitachi, Ltd
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and electronic device, and method of manufacturing same
- Publication number 20030184986
- Publication date Oct 2, 2003
- Hitachi, Ltd
- Tasao Soga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electron device and semiconductor device
- Publication number 20030186072
- Publication date Oct 2, 2003
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having solder bumps reliably reflow solderable
- Publication number 20030030149
- Publication date Feb 13, 2003
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20020171157
- Publication date Nov 21, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020163085
- Publication date Nov 7, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Product using Zn-Al alloy solder
- Publication number 20020149114
- Publication date Oct 17, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020114726
- Publication date Aug 22, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020100986
- Publication date Aug 1, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electron device and semiconductor device
- Publication number 20020066583
- Publication date Jun 6, 2002
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020019077
- Publication date Feb 14, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technical field
- Publication number 20020009610
- Publication date Jan 24, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and circuit substrate
- Publication number 20010050181
- Publication date Dec 13, 2001
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Pb-free solder-connected structure

Pb-free solder-connected structure and electronic device

Semiconductor power module

Solder composition for electronic devices

Semiconductor power module including epoxy resin coating

Solder foil, semiconductor device and electronic device

Pb-free solder-connected structure and electronic device

Power semiconductor module

Power semiconductor module

Semiconductor device with lead-free solder

Semiconductor device having solder bumps reliably reflow solderable

Electronic device

Method of producing an electronic device having a PB free solder co...

Pb-free solder-connected structure and electronic device

Solder

Electronic device

Product using Zn-Al alloy solder

Electron device and semiconductor device

Semiconductor module having solder bumps and solder portions with d...

Method and apparatus of manufacturing an electronic circuit board

Lead-free solder used for connecting electronic parts on organic su...

Electric appliance, printed circuit board, remained life estimation...

Ceramic multilayer circuit board and semiconductor module

Semiconductor chip module

Semiconductor device

Cooling apparatus and semiconductor device employing the same

Solder carrier, manufacturing method thereof and method of mounting...

Semiconductor resin package structure

Ceramic multilayer circuit board and semiconductor module

Heat-conducting cooling module

Patents Applicationslast 30 patents

Pb-FREE SOLDER-CONNECTED STRUCTURE

SEMICONDUCTOR POWER MODULE

Pb-free solder-connected structure and electronic device

METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, P...

Power Semiconductor Module

SEMICONDUCTOR POWER MODULE

Power semiconductor module

Solder composition for electronic devices

Electronic device

Pb-free solder-connected structure and electronic device

Solder foil semiconductor device and electronic device

Electronic apparatus

Electronic device

Solder

Circuit board and electronic device, and method of manufacturing same

Electron device and semiconductor device

Semiconductor device having solder bumps reliably reflow solderable

Electronic device

Pb-free solder-connected structure and electronic device

Product using Zn-Al alloy solder

Electronic device

Electronic device

Electron device and semiconductor device

Pb-free solder-connected structure and electronic device

Technical field

Semiconductor module and circuit substrate