Taturou Yamashita

Person

Satsuma-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 6,347,037
- Issue date Feb 12, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly board with insulator filled through h...
- Patent number 6,184,133
- Issue date Feb 6, 2001
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 6,088,233
- Issue date Jul 11, 2000
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,978,222
- Issue date Nov 2, 1999
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing such
- Patent number 5,889,333
- Issue date Mar 30, 1999
- Fujitsu Limited
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,729,435
- Issue date Mar 17, 1998
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit having ball-grid...
- Patent number 5,726,493
- Issue date Mar 10, 1998
- Fujitsu Limited
- Taturou Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
- Publication number 20020001178
- Publication date Jan 3, 2002
- MAKOTO IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Taturou Yamashita

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming the same

Method of forming an assembly board with insulator filled through h...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and method for manufacturing such

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and semiconductor device unit having ball-grid...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.