Tay Wuu Yean

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming and assembling pre-encapsulated assemblies and o...
- Patent number 8,399,297
- Issue date Mar 19, 2013
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated cavity interposer
- Patent number 8,072,082
- Issue date Dec 6, 2011
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with leadframes, including leadframe-b...
- Patent number 7,947,529
- Issue date May 24, 2011
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 7,573,136
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling multiple semiconductor devices
- Patent number 7,198,980
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices
- Patent number 7,145,228
- Issue date Dec 5, 2006
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and other carriers including a slot with laterally rece...
- Patent number 7,112,876
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,951,777
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for packaging microelectronic devices
- Patent number 6,946,325
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary, conformable contacts for microelectronic components
- Patent number 6,913,476
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Tay Wuu Yean
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 6,906,415
- Issue date Jun 14, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer with a lateral recess in a slot to facilitate connection...
- Patent number 6,870,247
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,773,960
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20120034740
- Publication date Feb 9, 2012
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...
- Publication number 20110215453
- Publication date Sep 8, 2011
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20090267171
- Publication date Oct 29, 2009
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...
- Publication number 20090045489
- Publication date Feb 19, 2009
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices and methods for packaging microelectronic d...
- Publication number 20070128737
- Publication date Jun 7, 2007
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposers and other carriers including a slot with laterally rece...
- Publication number 20060006513
- Publication date Jan 12, 2006
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic devices and methods for packaging microelectronic d...
- Publication number 20060006534
- Publication date Jan 12, 2006
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20050218518
- Publication date Oct 6, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20040203191
- Publication date Oct 14, 2004
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic devices and methods for packaging microelectronic d...
- Publication number 20040178495
- Publication date Sep 16, 2004
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling multiple semiconductor devices
- Publication number 20040106229
- Publication date Jun 3, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY, CONFORMABLE CONTACTS FOR MICROELECTRONIC COMPONENTS
- Publication number 20040029425
- Publication date Feb 12, 2004
- Tay Wuu Yean
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20030230801
- Publication date Dec 18, 2003
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20030176045
- Publication date Sep 18, 2003
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer, packages including the interposer, and methods
- Publication number 20020167092
- Publication date Nov 14, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Tay Wuu Yean

Person

Patents Grantslast 30 patents

Methods of forming and assembling pre-encapsulated assemblies and o...

Pre-encapsulated cavity interposer

Microelectronic die packages with leadframes, including leadframe-b...

Semiconductor device assemblies and packages including multiple sem...

Methods for assembling multiple semiconductor devices

Microelectronic devices

Interposers and other carriers including a slot with laterally rece...

Methods for forming a slot with a laterally recessed area at an end...

Methods for packaging microelectronic devices

Temporary, conformable contacts for microelectronic components

Semiconductor device assemblies and packages including multiple sem...

Interposer with a lateral recess in a slot to facilitate connection...

Methods for forming a slot with a laterally recessed area at an end...

Patents Applicationslast 30 patents

PRE-ENCAPSULATED CAVITY INTERPOSER

MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...

PRE-ENCAPSULATED CAVITY INTERPOSER

MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...

Microelectronic devices and methods for packaging microelectronic d...

Interposers and other carriers including a slot with laterally rece...

Microelectronic devices and methods for packaging microelectronic d...

Semiconductor device assemblies and packages including multiple sem...

Methods for forming a slot with a laterally recessed area at an end...

Microelectronic devices and methods for packaging microelectronic d...

Methods for assembling multiple semiconductor devices

TEMPORARY, CONFORMABLE CONTACTS FOR MICROELECTRONIC COMPONENTS

Semiconductor device assemblies and packages including multiple sem...

Methods for forming a slot with a laterally recessed area at an end...

Interposer, packages including the interposer, and methods