Telesphor Kamgaing

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for conductively coating millimeter waveguides
- Patent number 12,183,961
- Issue date Dec 31, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,166,261
- Issue date Dec 10, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-filter die
- Patent number 12,155,372
- Issue date Nov 26, 2024
- Intel Corporation
- Georgios Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide bundle including first and sec...
- Patent number 12,126,068
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide including an opening of varyin...
- Patent number 12,126,067
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic support for millimeter-wave communication including...
- Patent number 12,107,314
- Issue date Oct 1, 2024
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersive waveguide crosstalk mitigation
- Patent number 12,088,360
- Issue date Sep 10, 2024
- Intel Corporation
- Henning Braunisch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated radio frequency (RF) front-end module (FEM)
- Patent number 12,040,776
- Issue date Jul 16, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 11,955,684
- Issue date Apr 9, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion compensation for electromagnetic waveguides
- Patent number 11,916,604
- Issue date Feb 27, 2024
- Intel Corporation
- Diego Correas-Serrano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with antennas
- Patent number 11,887,946
- Issue date Jan 30, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a modular side radiating waveguide...
- Patent number 11,830,831
- Issue date Nov 28, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,784,108
- Issue date Oct 10, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
- Patent number 11,764,452
- Issue date Sep 19, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide fan-out
- Patent number 11,728,290
- Issue date Aug 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 11,716,826
- Issue date Aug 1, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
- Patent number 11,715,693
- Issue date Aug 1, 2023
- Intel Corporation
- Georgios Dogiamis
- G02 - OPTICS
Information Patent Grant
Microelectronic package with mold-integrated components
- Patent number 11,694,962
- Issue date Jul 4, 2023
- Intel Corporation
- Georgios Dogiamis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bridge for radio frequency (RF) multi-chip modules
- Patent number 11,688,660
- Issue date Jun 27, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 11,658,418
- Issue date May 23, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS
- Publication number 20250007145
- Publication date Jan 2, 2025
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN MODULES FOR ELECTRONIC DEVICES
- Publication number 20250008685
- Publication date Jan 2, 2025
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...
- Publication number 20240429588
- Publication date Dec 26, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...
- Publication number 20240421465
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20240405433
- Publication date Dec 5, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...
- Publication number 20240364002
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...
- Publication number 20240364023
- Publication date Oct 31, 2024
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH CAPACITIVE COUPLING
- Publication number 20240364000
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE
- Publication number 20240355752
- Publication date Oct 24, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL POWER COMBINERS
- Publication number 20240322775
- Publication date Sep 26, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240312869
- Publication date Sep 19, 2024
- Intel Corporation
- Tongyan Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20240266745
- Publication date Aug 8, 2024
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240234234
- Publication date Jul 11, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Publication number 20240234303
- Publication date Jul 11, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240136243
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Publication number 20240136279
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ANTENNAS
- Publication number 20240113052
- Publication date Apr 4, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE
- Publication number 20240006336
- Publication date Jan 4, 2024
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
- Publication number 20230420354
- Publication date Dec 28, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...
- Publication number 20230420350
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
- Publication number 20230420384
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
- Publication number 20230420342
- Publication date Dec 28, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
- Publication number 20230420345
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM
- Publication number 20230420396
- Publication date Dec 28, 2023
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY DIE WITH A GROUND PLANE FOR STRIP LINE ROUTING
- Publication number 20230411350
- Publication date Dec 21, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS

Telesphor Kamgaing

Person

Patents Grantslast 30 patents

Methods for conductively coating millimeter waveguides

Components for millimeter-wave communication

Radio frequency antennas and waveguides for communication between i...

Microelectronic devices designed with mold patterning to create pac...

Multi-filter die

Platforms including microelectronic packages therein coupled to a c...

Millimeter-wave dielectric waveguide bundle including first and sec...

Millimeter-wave dielectric waveguide including an opening of varyin...

Microelectronic support for millimeter-wave communication including...

Dispersive waveguide crosstalk mitigation

Integrated radio frequency (RF) front-end module (FEM)

Components for millimeter-wave communication

Thermal management in integrated circuit packages

High performance integrated RF passives using dual lithography process

Components for millimeter-wave communication

Dispersion compensation for electromagnetic waveguides

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Semiconductor packages with antennas

Semiconductor package including a modular side radiating waveguide...

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

Integrated circuit including a dielectric waveguide with a cavity t...

Patch on interposer package with wireless communication interface

Waveguide fan-out

Platforms including microelectronic packages therein coupled to a c...

Dielectric waveguide channel for interconnecting dies in a semicond...

Microelectronic package with mold-integrated components

Bridge for radio frequency (RF) multi-chip modules

Microelectronic devices designed with mold patterning to create pac...

Disaggregated die interconnection with on-silicon cavity bridge

Patents Applicationslast 30 patents

STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS

FAN MODULES FOR ELECTRONIC DEVICES

MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...

WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

ANTENNA MODULES AND COMMUNICATION DEVICES

MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...

SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...

ANTENNA MODULE WITH CAPACITIVE COUPLING

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE

THREE-DIMENSIONAL POWER COMBINERS

MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

INTEGRATED INDUCTOR OVER TRANSISTOR LAYER

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

INTEGRATED INDUCTOR OVER TRANSISTOR LAYER

SEMICONDUCTOR PACKAGES WITH ANTENNAS

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE

ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE

HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...

SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE

COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES

DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM

SECONDARY DIE WITH A GROUND PLANE FOR STRIP LINE ROUTING