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Telesphor Kamgaing
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Components for millimeter-wave communication
Patent number
11,955,684
Issue date
Apr 9, 2024
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dispersion compensation for electromagnetic waveguides
Patent number
11,916,604
Issue date
Feb 27, 2024
Intel Corporation
Diego Correas-Serrano
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
Patent number
11,894,324
Issue date
Feb 6, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with antennas
Patent number
11,887,946
Issue date
Jan 30, 2024
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a modular side radiating waveguide...
Patent number
11,830,831
Issue date
Nov 28, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,830,787
Issue date
Nov 28, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,784,108
Issue date
Oct 10, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
Patent number
11,764,452
Issue date
Sep 19, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patch on interposer package with wireless communication interface
Patent number
11,737,154
Issue date
Aug 22, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide fan-out
Patent number
11,728,290
Issue date
Aug 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
11,716,826
Issue date
Aug 1, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
Patent number
11,715,693
Issue date
Aug 1, 2023
Intel Corporation
Georgios Dogiamis
G02 - OPTICS
Information
Patent Grant
Microelectronic package with mold-integrated components
Patent number
11,694,962
Issue date
Jul 4, 2023
Intel Corporation
Georgios Dogiamis
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bridge for radio frequency (RF) multi-chip modules
Patent number
11,688,660
Issue date
Jun 27, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices designed with mold patterning to create pac...
Patent number
11,658,418
Issue date
May 23, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
Patent number
11,652,057
Issue date
May 16, 2023
Intel Corporation
Khang Choong Yong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with substrate-integrated components
Patent number
11,641,711
Issue date
May 2, 2023
Intel Corporation
Georgios Dogiamis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inorganic dies with organic interconnect layers and related structures
Patent number
11,621,192
Issue date
Apr 4, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with radio frequency (RF) chiplet
Patent number
11,605,603
Issue date
Mar 14, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mmwave dielectric waveguide interconnect topology for automotive ap...
Patent number
11,594,801
Issue date
Feb 28, 2023
Intel Corporation
Georgios Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Contactless high-frequency interconnect
Patent number
11,581,272
Issue date
Feb 14, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-weight single mm-wave dielectric waveguide interconnect archite...
Patent number
11,575,749
Issue date
Feb 7, 2023
Intel Corporation
Georgios C. Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Semiconductor packages with antennas
Patent number
11,562,971
Issue date
Jan 24, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration of III-V transistors in a silicon CMOS stack
Patent number
11,538,803
Issue date
Dec 27, 2022
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate waveguide
Patent number
11,532,574
Issue date
Dec 20, 2022
Intel Coropration
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package communication using radio interfaces connec...
Patent number
11,525,970
Issue date
Dec 13, 2022
Intel Corporation
Shawna Liff
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Distributed on-package millimeter-wave radio
Patent number
11,509,069
Issue date
Nov 22, 2022
Intel Corporation
Telesphor Kamgaing
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Mmwave waveguide to waveguide connectors for automotive applications
Patent number
11,476,554
Issue date
Oct 18, 2022
Intel Corporation
Georgios Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Multiplexer and combiner structures embedded in a mmwave connector...
Patent number
11,462,810
Issue date
Oct 4, 2022
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF front end module including hybrid filter and active circuits in...
Patent number
11,456,721
Issue date
Sep 27, 2022
Intel Corporation
Feras Eid
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
Publication number
20240136279
Publication date
Apr 25, 2024
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH ANTENNAS
Publication number
20240113052
Publication date
Apr 4, 2024
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
Publication number
20240021522
Publication date
Jan 18, 2024
Intel Corporation
Tolga ACIKALIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE
Publication number
20240006336
Publication date
Jan 4, 2024
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
Publication number
20230420354
Publication date
Dec 28, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...
Publication number
20230420350
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
Publication number
20230420384
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
Publication number
20230420342
Publication date
Dec 28, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
Publication number
20230420345
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM
Publication number
20230420396
Publication date
Dec 28, 2023
Intel Corporation
Tolga ACIKALIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECONDARY DIE WITH A GROUND PLANE FOR STRIP LINE ROUTING
Publication number
20230411350
Publication date
Dec 21, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE WITH A GROUNDED COPLANAR WAVEGUIDE ON A GLASS CORE
Publication number
20230411838
Publication date
Dec 21, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY ON PACKAGE (MOP) ARCHITECTURE
Publication number
20230395576
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY
Publication number
20230395493
Publication date
Dec 7, 2023
Intel Corporation
Jooi Wah WONG
G11 - INFORMATION STORAGE
Information
Patent Application
HEAT REMOVAL IN INTEGRATED CIRCUITS WITH TRANSISTORS AND DOUBLE-SID...
Publication number
20230395456
Publication date
Dec 7, 2023
Intel Corporation
Jean-Pierre Njante
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER...
Publication number
20230395578
Publication date
Dec 7, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
Publication number
20230395524
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
Publication number
20230397333
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOC-MEMORY INTEGRATION TO ACHIEVE SMALLEST AND THINNEST MEMORY ON P...
Publication number
20230395577
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISTRIBUTED RADIOHEAD SYSTEM
Publication number
20230361802
Publication date
Nov 9, 2023
Intel Corporation
Jayprakash THAKUR
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
Publication number
20230344131
Publication date
Oct 26, 2023
Intel Corporation
Feras EID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
Publication number
20230320021
Publication date
Oct 5, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
Publication number
20230246338
Publication date
Aug 3, 2023
Intel Corporation
Feras EID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES
Publication number
20230207405
Publication date
Jun 29, 2023
Intel Corporation
Arghya SAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH IN-GLASS BLIND AND THROUGH CAVITIES TO AC...
Publication number
20230207439
Publication date
Jun 29, 2023
Adel A. ELSHERBINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR WITH INTEGRATED MAGNETICS
Publication number
20230207493
Publication date
Jun 29, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES
Publication number
20230207494
Publication date
Jun 29, 2023
Jianyong XIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES
Publication number
20230207406
Publication date
Jun 29, 2023
Intel Corporation
Arghya SAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
Publication number
20230207407
Publication date
Jun 29, 2023
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS