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Tetsushi Wakabayashi
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Yokohama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
6,347,037
Issue date
Feb 12, 2002
Fujitsu Limited
Makoto Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an assembly board with insulator filled through h...
Patent number
6,184,133
Issue date
Feb 6, 2001
Fujitsu Limited
Makoto Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and assembly board having through-holes filled...
Patent number
6,088,233
Issue date
Jul 11, 2000
Fujitsu Limited
Makoto Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and assembly board having through-holes filled...
Patent number
5,978,222
Issue date
Nov 2, 1999
Fujitsu Limited
Makoto Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit carrier having lead-socket array with various in...
Patent number
5,763,297
Issue date
Jun 9, 1998
Fujitsu Limited
Kazuhiro Tashiro
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device and assembly board having through-holes filled...
Patent number
5,729,435
Issue date
Mar 17, 1998
Fujitsu Limited
Makoto Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit carrier having lead-socket array with various in...
Patent number
5,668,407
Issue date
Sep 16, 1997
Fujitsu Limited
Kazuhiro Tashiro
G01 - MEASURING TESTING
Information
Patent Grant
Integrated circuit device having an improved package structure
Patent number
5,041,899
Issue date
Aug 20, 1991
Fujitsu Limited
Akihiro Oku
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
4,724,472
Issue date
Feb 9, 1988
Fujitsu Limited
Masahiro Sugimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having radiator
Patent number
4,688,077
Issue date
Aug 18, 1987
Fujitsu Limited
Tetsushi Wakabayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device having package with bypass capacitor
Patent number
4,598,307
Issue date
Jul 1, 1986
Fujitsu Limited
Tetsushi Wakabayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink for a semiconductor device
Patent number
4,535,384
Issue date
Aug 13, 1985
Fujitsu Ltd.
Tetsushi Wakabayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device
Patent number
D276719
Issue date
Dec 11, 1984
Fujitsu Limited
Masahiro Sugimoto
D13 - Equipment for production, distribution, or transformation of energy
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
Publication number
20020001178
Publication date
Jan 3, 2002
MAKOTO IIJIMA
H01 - BASIC ELECTRIC ELEMENTS