Tetsuya Enomoto

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing polyimide precursor, method for producing phot...
- Patent number 11,807,721
- Issue date Nov 7, 2023
- HD MICROSYSTEMS, LTD.
- Satoshi Yoneda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Positive photosensitive resin composition, patterned cured film pro...
- Patent number 11,048,167
- Issue date Jun 29, 2021
- HD MICROSYSTEMS, LTD.
- Daisaku Matsukawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polymide precursor resin composition
- Patent number 10,725,379
- Issue date Jul 28, 2020
- Hitachi Chemical DuPont Microsystems, Ltd.
- Keishi Ono
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polyimide precursor, photosensitive resin composition containing sa...
- Patent number 9,751,984
- Issue date Sep 5, 2017
- Hitachi Chemical DuPont Microsystems, Ltd.
- Tetsuya Enomoto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Thermosetting resin composition for sealing packing of semiconducto...
- Patent number 9,431,314
- Issue date Aug 30, 2016
- Hitachi Chemical Company, Ltd.
- Tetsuya Enomoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,129,898
- Issue date Sep 8, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 9,123,734
- Issue date Sep 1, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,024,455
- Issue date May 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 8,674,502
- Issue date Mar 18, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Production method of semiconductor device and bonding film
- Patent number 8,034,659
- Issue date Oct 11, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection board, and multi-layer wiring board, substrate for semic...
- Patent number 8,028,402
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 7,704,799
- Issue date Apr 27, 2010
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 7,205,645
- Issue date Apr 17, 2007
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CU...
- Publication number 20210311390
- Publication date Oct 7, 2021
- HD MICROSYSTEMS, LTD.
- Atsutaro YOSHIZAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN C...
- Publication number 20210116809
- Publication date Apr 22, 2021
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Etsuharu TSUCHIYA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOT...
- Publication number 20210018837
- Publication date Jan 21, 2021
- HD MICROSYSTEMS, LTD.
- Satoshi YONEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRO...
- Publication number 20180074403
- Publication date Mar 15, 2018
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Daisaku MATSUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SA...
- Publication number 20150353685
- Publication date Dec 10, 2015
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Tetsuya ENOMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYMIDE PRECURSOR RESIN COMPOSITION
- Publication number 20150337116
- Publication date Nov 26, 2015
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Keishi ONO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20140206148
- Publication date Jul 24, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20140015149
- Publication date Jan 16, 2014
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...
- Publication number 20120101191
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20120012999
- Publication date Jan 19, 2012
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20110291260
- Publication date Dec 1, 2011
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...
- Publication number 20110241228
- Publication date Oct 6, 2011
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM
- Publication number 20100003771
- Publication date Jan 7, 2010
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection board, and multi-layer wiring board, substrate for semic...
- Publication number 20090008141
- Publication date Jan 8, 2009
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080289868
- Publication date Nov 27, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080010819
- Publication date Jan 17, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...
- Publication number 20070161228
- Publication date Jul 12, 2007
- HITACHI CHEMICAL CO., Ltd.
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and method of manufacturing wir...
- Publication number 20030141596
- Publication date Jul 31, 2003
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tetsuya Enomoto

Person

Patents Grantslast 30 patents

Method for producing polyimide precursor, method for producing phot...

Positive photosensitive resin composition, patterned cured film pro...

Polymide precursor resin composition

Polyimide precursor, photosensitive resin composition containing sa...

Thermosetting resin composition for sealing packing of semiconducto...

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Production method of semiconductor device and bonding film

Connection board, and multi-layer wiring board, substrate for semic...

Method of manufacturing wiring substrate

Wiring board, semiconductor device, and method of manufacturing wir...

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CU...

PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN C...

METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOT...

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRO...

POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SA...

POLYMIDE PRECURSOR RESIN COMPOSITION

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM

Connection board, and multi-layer wiring board, substrate for semic...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...

Wiring board, semiconductor device, and method of manufacturing wir...