Tetsuya Kuwajima

Follow

Person

Hamamatsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having manufacturing wiring structure with bur...
- Patent number 6,150,720
- Issue date Nov 21, 2000
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring structure having buried plugs in sem...
- Patent number 6,146,998
- Issue date Nov 14, 2000
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring-forming method
- Patent number 5,776,827
- Issue date Jul 7, 1998
- Yamaha Corporation
- Satoshi Hibino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized wiring
- Patent number 5,679,981
- Issue date Oct 21, 1997
- Yamaha Corporation
- Tetsuya Kuwajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having planarized w...
- Patent number 5,534,461
- Issue date Jul 9, 1996
- Yamaha Corporation
- Tetsuya Kuwajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring forming method
- Patent number 5,529,955
- Issue date Jun 25, 1996
- Yamaha Corporation
- Satoshi Hibino
- H01 - BASIC ELECTRIC ELEMENTS