Thomas Behrens

Person

Wenzenbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing of one or more carrier bodies and electronic components...
- Patent number 11,502,042
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloys and arrangements
- Patent number 9,735,126
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,583,413
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component comprising cutting a carrier
- Patent number 9,123,764
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Thomas Behrens
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit device and method for the production thereof
- Patent number 8,330,252
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including spacer element
- Patent number 8,304,884
- Issue date Nov 6, 2012
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 8,187,964
- Issue date May 29, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,705,441
- Issue date Apr 27, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive die attach material
- Patent number 7,667,337
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240030200
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Christian Irrgang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20230117806
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...
- Publication number 20210005557
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
- Publication number 20200365553
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REINFORCEMENT FOR ELECTRICAL CONNECTORS
- Publication number 20190148332
- Publication date May 16, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20170323865
- Publication date Nov 9, 2017
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Manufacturing a Component Comprising Cutting a Carrier
- Publication number 20140057396
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOYS AND ARRANGEMENTS
- Publication number 20120313230
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SPACER ELEMENT
- Publication number 20100230798
- Publication date Sep 16, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100207263
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20100099223
- Publication date Apr 22, 2010
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20090115060
- Publication date May 7, 2009
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL
- Publication number 20090079088
- Publication date Mar 26, 2009
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20080246137
- Publication date Oct 9, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20080220564
- Publication date Sep 11, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Arrangement
- Publication number 20080061449
- Publication date Mar 13, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Behrens

Person

Patents Grantslast 30 patents

Semiconductor device including a solder compound containing a compo...

Processing of one or more carrier bodies and electronic components...

Batch manufacture of packages by sheet separated into carriers afte...

Semiconductor device including a solder compound containing a compo...

Chip arrangements

Reinforcement for electrical connectors

Solder alloys and arrangements

Semiconductor device

Method of manufacturing a component comprising cutting a carrier

Integrated circuit device and method for the production thereof

Semiconductor device including spacer element

Integrated circuit device and method

Semiconductor module

Semiconductor device with conductive die attach material

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

CHIP ARRANGEMENTS

PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

REINFORCEMENT FOR ELECTRICAL CONNECTORS

CHIP ARRANGEMENTS

Method of Manufacturing a Component Comprising Cutting a Carrier

SOLDER ALLOYS AND ARRANGEMENTS

SEMICONDUCTOR DEVICE INCLUDING SPACER ELEMENT

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD

INTEGRATED CIRCUIT DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL

INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF

Semiconductor module

Semiconductor Component Arrangement