Thomas Bemmerl

Person

Schwandorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and clip with a die attach
- Patent number 11,869,830
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with elevated lead and structure extending vertically from...
- Patent number 11,862,582
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated leadless package having an at least partially exposed...
- Patent number 10,978,378
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated shunt resistor
- Patent number 10,950,509
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor package including a leadframe and method f...
- Patent number 10,840,172
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic arrangement
- Patent number 10,026,710
- Issue date Jul 17, 2018
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic arrangement and method for producing an electronic arran...
- Patent number 9,681,566
- Issue date Jun 13, 2017
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 9,484,278
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens, optoelectronic component comprising a lens and method for pro...
- Patent number 8,848,297
- Issue date Sep 30, 2014
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- F21 - LIGHTING
Information Patent Grant
Process for producing a layer composite consisting of a luminescenc...
- Patent number 8,748,201
- Issue date Jun 10, 2014
- Osram Opto Semiconductors GmbH
- Stephan Preuss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device
- Patent number 8,030,741
- Issue date Oct 4, 2011
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through contacts through a plastic hous...
- Patent number 7,944,061
- Issue date May 17, 2011
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support with solder ball elements and a method for populating subst...
- Patent number 7,935,622
- Issue date May 3, 2011
- Infineon Technologies AG
- Michael Bauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with semiconductor device components embedded...
- Patent number 7,800,241
- Issue date Sep 21, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 7,737,537
- Issue date Jun 15, 2010
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel and semiconductor device having a composite plate with semico...
- Patent number 7,713,791
- Issue date May 11, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device comprising conductors made of carbonized plastic,...
- Patent number 7,709,379
- Issue date May 4, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having integrated cooling element with clearance...
- Patent number 7,064,429
- Issue date Jun 20, 2006
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
- Publication number 20230420317
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Michael STADLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20230095545
- Publication date Mar 30, 2023
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...
- Publication number 20220165687
- Publication date May 26, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Space Efficient Lead and Die Pad Design
- Publication number 20200373228
- Publication date Nov 26, 2020
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing Electronic Devices
- Publication number 20200352034
- Publication date Nov 5, 2020
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Lead Frame Stabilizer for Improved Lead Planarity
- Publication number 20200294896
- Publication date Sep 17, 2020
- Arivindran Navaretnasinggam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20200168575
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CLIP WITH A DIE ATTACH
- Publication number 20200152554
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A RECESS AND METHOD OF FABRICATING...
- Publication number 20200051880
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20200020649
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED SHUNT RESISTOR AND METHOD FOR...
- Publication number 20190348333
- Publication date Nov 14, 2019
- INFINEON TECHNOLOGIES AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP
- Publication number 20190333874
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190304858
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Leadless Package Having an at Least Partially Exposed...
- Publication number 20190189542
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining Materials, Electronic Devices and Methods for Manufacturing...
- Publication number 20180338379
- Publication date Nov 22, 2018
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LEADFRAME, SEMICONDUCTOR PACKAGE INCLUDING A LEADFRAME AND METHOD F...
- Publication number 20180233438
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas BEMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20170317036
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Arrangement
- Publication number 20170243850
- Publication date Aug 24, 2017
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20150145109
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20150064844
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING A LAYER COMPOSITE CONSISTING OF A LUMINESCENC...
- Publication number 20130210181
- Publication date Aug 15, 2013
- Osram Opto Semiconductors GmbH
- Stephan Preuss
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic Arrangement and Method for Producing an Electronic Arran...
- Publication number 20130077280
- Publication date Mar 28, 2013
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS, OPTOELECTRONIC COMPONENT COMPRISING A LENS AND METHOD FOR PRO...
- Publication number 20120162783
- Publication date Jun 28, 2012
- Osram Opto Semiconductors GmbH
- Thomas Bemmerl
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20100213587
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20090152694
- Publication date Jun 18, 2009
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Bemmerl

Person

Patents Grantslast 30 patents

Semiconductor device package comprising a pin in the form of a dril...

Semiconductor package and clip with a die attach

Semiconductor device having a contact clip with a contact region ha...

Package with elevated lead and structure extending vertically from...

Semiconductor device and method for fabricating a semiconductor device

Semiconductor package with space efficient lead and die pad design

Encapsulated leadless package having an at least partially exposed...

Semiconductor device comprising a composite material clip

Semiconductor device with integrated shunt resistor

Semiconductor package system

Leadframe, semiconductor package including a leadframe and method f...

Electronic arrangement

Electronic arrangement and method for producing an electronic arran...

Semiconductor package and method for producing the same

Multichip power semiconductor device

Multichip power semiconductor device

Lens, optoelectronic component comprising a lens and method for pro...

Process for producing a layer composite consisting of a luminescenc...

Electronic device

Semiconductor device having through contacts through a plastic hous...

Support with solder ball elements and a method for populating subst...

Semiconductor device with semiconductor device components embedded...

Electronic device

Panel and semiconductor device having a composite plate with semico...

Electrical device comprising conductors made of carbonized plastic,...

Electronic component and semiconductor wafer, and method for produc...

Electronic package having integrated cooling element with clearance...

Patents Applicationslast 30 patents

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS

Semiconductor Packages and Methods for Manufacturing Thereof

PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

Semiconductor Package with Space Efficient Lead and Die Pad Design

Methods for Manufacturing Electronic Devices

Lead Frame Stabilizer for Improved Lead Planarity

Semiconductor Device and Method for Fabricating a Semiconductor Device

SEMICONDUCTOR PACKAGE AND CLIP WITH A DIE ATTACH

SEMICONDUCTOR DEVICE COMPRISING A RECESS AND METHOD OF FABRICATING...

Cavity based feature on chip carrier

SEMICONDUCTOR DEVICE WITH INTEGRATED SHUNT RESISTOR AND METHOD FOR...

SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP

SEMICONDUCTOR PACKAGE SYSTEM

Encapsulated Leadless Package Having an at Least Partially Exposed...

Joining Materials, Electronic Devices and Methods for Manufacturing...

LEADFRAME, SEMICONDUCTOR PACKAGE INCLUDING A LEADFRAME AND METHOD F...

Cavity based feature on chip carrier

Electronic Arrangement

Semiconductor Package and Method for Producing the Same

Multichip Power Semiconductor Device

Multichip Power Semiconductor Device

PROCESS FOR PRODUCING A LAYER COMPOSITE CONSISTING OF A LUMINESCENC...

Electronic Arrangement and Method for Producing an Electronic Arran...

LENS, OPTOELECTRONIC COMPONENT COMPRISING A LENS AND METHOD FOR PRO...

ELECTRONIC DEVICE

Electronic device