The present invention relates to an electronic arrangement and to a method for producing an electronic arrangement.
Electronic arrangements have an inhomogeneous optical appearance in the switched-off state. They can comprise optoelectronic components and non-optoelectronic components, the contact materials and surfaces of which can give different color and brightness impressions.
One object of the invention is to provide an electronic arrangement which has a homogeneous optical appearance in the switched-off state.
Various embodiments comprise an electronic arrangement comprising optoelectronic and non-optoelectronic components. The optical appearance is homogenized in the switched-off state.
The absorption losses are minimized in the switched-on state of the optoelectronic component.
The electronic arrangement comprises a carrier with at least one connecting area. At least one electronic component is fixed on the connecting area by means of a contact material. A covering area is arranged on the carrier and surrounds the connecting area. The electronic arrangement comprises at least one covered region covered by a covering material. The covering material is designed in such a way that an optical contrast between the covering area and the covered region is minimized.
In one preferred embodiment, the connecting area is an electrical, preferably metallic, contact-making area.
Alternatively or supplementarily, the connecting area is an, in particular non-metallic, adhesive-bonding area. This can be applied in the case of optoelectronic components grown on sapphire.
The optical contrast relates to a color contrast. Alternatively, or supplementarily, the optical contrast also relates to a brightness contrast. The optical contrast is minimized firstly by virtue of the fact that the covering area and the covering material have a similar, preferably an identical, reflectivity. Secondly, the optical contrast is minimized by virtue of the fact that the covering area and the covering material have a similar, preferably an identical, color.
Color locus differences and thus the color contrast can be represented by the color difference ΔE. The term “identical color stimulus specification” can be used synonymously with “identical color valence”. Color differences ΔE<2 are virtually imperceptible to the human eye. In contrast thereto, color difference of ΔE>5-10 are perceived as different colors. The color of the covering area and the color of the covering material preferably have a color difference of ΔE<5, particularly preferably of ΔE<3.
The similarity of the brightness impression of covering material with respect to covering area can be expressed in differences in reflectance. Before the covering, e.g. the gold-covered bonding pad has a reflectance of approximately 55%. The material of the covering area can have a reflectance of approximately 95%. The 40% difference thus defined can be defined as the disturbing initial state. The difference between the reflectivity of the covering area and the reflectivity of the covering material is preferably less than 20% and particularly preferably less than 10%. Each reduction in the difference between the reflectivities of covering area and covering material produces a more homogeneous brightness impression.
Besides minimizing contrast, the partial or complete covering of electronic components with covering material leads to corrosion protection for the electronic components.
The use of covering material is advantageous in comparison with the use of lenses composed of diffuse plastic or the roughening of lens surfaces or the coating of the lens surface with diffuse resin.
In one preferred embodiment, the contact material comprises solder or adhesive. This is advantageous since the electronic component can thereby be mechanically and/or electrically conductively connected to the connecting area.
In one preferred embodiment, the electronic component can be an optoelectronic component, in particular an LED. The optoelectronic component can be grown on a III-V compound semiconductor material, in particular a nitride compound semiconductor material such as gallium nitride (GaN). The optoelectronic component comprises at least one active zone that emits electromagnetic radiation. The active zones can be pn-junctions, a double heterostructure, a multiple quantum well structure (MQW), a single quantum well structure (SQW). Quantum well structure means: quantum wells (3-dim), quantum wires (2-dim) and quantum dots (1-dim).
In one preferred embodiment, the electronic component can be a non-optoelectronic component. An ESD semiconductor chip and/or a microchip, for example a memory or a controller, can be used as non-optoelectronic component. Alternatively or supplementarily, a passive component, in particular a resistor, a coil or a capacitor, can be used as non-optoelectronic component.
In one preferred embodiment, the optoelectronic component is a semiconductor chip with wire contact connections. Alternatively or supplementarily, the optoelectronic component can be configured as a flip-chip. The embodiment comprising an optoelectronic component in the form of a flip-chip is advantageous since the shading by the bonding wire is obviated and no active area is lost by virtue of the bonding pad on the optoelectronic component.
In one preferred embodiment, the region covered by the covering material comprises the area of the non-optoelectronic component which faces away from the carrier.
In one preferred embodiment, the covered region comprises the side areas of the electronic component.
In one preferred embodiment, the covered region comprises the regions of the connecting area which are not covered by the electrical component.
In one preferred embodiment, the covered region comprises the regions of the contact material which are not covered by the electrical component.
In one preferred embodiment, the bonding wires can be covered by the covering material.
In one preferred embodiment, fixing units, in particular screws can be covered by the covering material.
In one preferred embodiment, the non-optoelectronic components can be completely covered by a covering material. The complete covering of the non-optoelectronic components is particularly advantageous since the contrast between covered component and covering area is thus minimized, preferably disappears.
The covered regions are advantageous since the optical appearance of the electronic arrangement in the switched-off state is homogenized by the covering. Moreover, it is advantageous that the light absorption at poorly reflective surfaces of the electronic arrangement is reduced.
In one preferred embodiment, the covering area comprises a ceramic, preferably white, material. Alternatively, or supplementarily thereto, the covering area comprises a laminated epoxy resin. Alternatively or supplementarily thereto, the covering area comprises soldering resist.
In one preferred embodiment, the covering material comprises a colored silicone. Alternatively or supplementarily thereto, the covering material comprises a colored epoxy resin, in particular soldering resist. Alternatively or supplementarily thereto, the covering material comprises a thermoplastic.
In one preferred embodiment, the covering material is colored by pigments, in particular by titanium dioxide (TiO2) particles.
In one preferred embodiment, titanium dioxide particles are provided in the covering material in a proportion of up to 70 percent by weight, preferably of approximately 25 percent by weight.
In one preferred embodiment, the covering area is highly reflective with a reflectivity of greater than 70%. Alternatively or supplementarily thereto, the covering material is highly reflective with a reflectivity of greater than 70%.
Various embodiments comprise a method for producing an electronic arrangement. In one preferred embodiment, a covering area is applied to a carrier areally and in a structured fashion. In this case, the at least one connecting area is omitted. Afterward, at least one electronic component is mounted on the connecting area. Afterward, at least partly exposed regions on the connecting area are covered.
Alternatively or supplementarily, in the case of a non-optoelectronic component, the area of the electronic component which faces away from the carrier is covered with covering material.
In one preferred embodiment, covering with a covering material is effected by dispensing or metering.
In one preferred embodiment, covering with a covering material is effected by jetting.
Various exemplary embodiments of the solution according to the invention are explained in greater detail below with reference to the drawings.
Elements which are identical, of identical type or act identically are provided with the same reference signs in the figures. The figures and the size relationships of the elements illustrated in the figures among one another should not be regarded as to scale. Rather, individual elements may be illustrated with an exaggerated size in order to enable better illustration and in order to afford a better understanding.
The connecting area 6 can be an electrical contact-making area. Alternatively, the connecting area 6 can also be an, in particular non-metallic, adhesive-bonding area.
The optical contrast is a color contrast and/or a brightness contrast.
The contact material 4 can be a solder or an adhesive. The optoelectronic component 3a can be an LED.
The covered region 15 comprises the side areas 7 of the optoelectronic component 3a, the regions of the connecting area 6 which are not covered by the optoelectronic component 3a, and the regions of the contact material 4 which are not covered by the optoelectronic component 3a. The area 8 of the optoelectronic component 3a which faces away from the carrier 2 has no covering material 10. The electromagnetic radiation 21 generated in the active zone is preferably emitted through the area 8 facing away from the carrier 2.
The covering area 5 can be a ceramic, preferably white, material. Alternatively or supplementarily thereto, the covering area 5 can be a laminated epoxy resin. Alternatively or supplementarily thereto, the covering area 5 can comprise soldering resist or a thermoplastic (premold package).
The covering material 10 can be a colored silicone. Alternatively or supplementarily thereto, the covering material 10 can be a colored epoxy resin, in particular soldering resist. Alternatively or supplementarily thereto, the covering material 10 can comprise a thermoplastic.
The covering material 10 can be colored by pigments 11, in particular by titanium dioxide (TiO2) particles. The titanium dioxide particles are provided in the covering material up to a proportion of approximately 70 percent by weight, preferably of approximately 25 percent by weight.
The covering area 5 and/or the covering material (10) can be highly reflective. In this case, the respective reflectivities are greater than 70%.
To the observer, contact material 4 is discernible around the optoelectronic component 3a on all sides. Contact material 4 is also discernible on the bonding pad 20 of the optoelectronic component 3a. The connecting area 6 is directly discernible between the regions with exposed contact material 4 and covering area 5. The contact material 4 and the connecting area 6 have dark coloration in comparison with the covering area 5 and stand out distinctly from the covering area 5 with regard to color and brightness. This dark coloration is aesthetically disturbing to the observer of an electronic arrangement 1 with an optoelectronic component 3a in the switched-off state. Moreover, the dark regions of the electronic arrangement 1 with an optoelectronic component 3a in the switched-on state lead to undesirable absorption losses. In order to solve or to reduce both problems, a covering material 10 is applied to the region 15 with exposed connecting area 6 and exposed contact material 4. The result can be seen in
In an exemplary embodiment which is not shown, the bonding wire 14 is also covered with covering material 10.
The electronic arrangement has been described on the basis of some exemplary embodiments in order to illustrate the underlying concept. In this case, the exemplary embodiments are not restricted to specific combinations of features. Even if some features and configurations have been described only in connection with one particular exemplary embodiment or individual exemplary embodiments, they can in each case be combined with other features from other exemplary embodiments. It is likewise conceivable, in exemplary embodiments, to omit or add individual presented features or particular configurations, insofar as the general technical teaching remains realized.
Number | Date | Country | Kind |
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10 2010 029 368 | May 2010 | DE | national |
This application is a continuation of U.S. application Ser. No. 13/700,414 filed Nov. 27, 2012 which claims the priority under 35 U.S.C. 371 of International application No. PCT/EP2011/055769 filed on Apr. 13, 2011. Priority is also claimed of German application no. 10 2010 029 368.7 filed on May 27, 2010. The entire contents of all these applications is hereby incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
5315070 | Maiwald | May 1994 | A |
5811736 | Lauffer | Sep 1998 | A |
6521997 | Huang | Feb 2003 | B1 |
6570259 | Alcoe | May 2003 | B2 |
6747293 | Nitta et al. | Jun 2004 | B2 |
7268437 | Liu | Sep 2007 | B2 |
7334907 | Nagayama | Feb 2008 | B2 |
7382628 | Kawamoto | Jun 2008 | B2 |
8716741 | Kashimura | May 2014 | B2 |
9287476 | Ichikawa et al. | Mar 2016 | B2 |
20020154366 | Horio | Oct 2002 | A1 |
20040036078 | Kondo | Feb 2004 | A1 |
20040217369 | Nitta et al. | Nov 2004 | A1 |
20060076666 | Lee et al. | Apr 2006 | A1 |
20070045800 | King et al. | Mar 2007 | A1 |
20080023711 | Tarsa et al. | Jan 2008 | A1 |
20080149962 | Kim et al. | Jun 2008 | A1 |
20090114929 | Lee et al. | May 2009 | A1 |
20090114938 | Hsu et al. | May 2009 | A1 |
20090141505 | Ushiki et al. | Jun 2009 | A1 |
20090283781 | Chan | Nov 2009 | A1 |
Number | Date | Country |
---|---|---|
1472809 | Feb 2004 | CN |
10 2006 046678 | Apr 2008 | DE |
10 2007 060206 | Jun 2009 | DE |
10 2010 021011 | Nov 2011 | DE |
0 308 676 | Aug 1988 | EP |
1 249 874 | Oct 2002 | EP |
1 768 182 | Sep 2006 | EP |
2 144 305 | Jan 2010 | EP |
2 325 901 | May 2011 | EP |
55-34496 | Mar 1980 | JP |
2000-022221 | Jan 2000 | JP |
2002-124703 | Apr 2002 | JP |
2002-314143 | Oct 2002 | JP |
2003-282950 | Oct 2003 | JP |
2004-023058 | Jan 2004 | JP |
2005-277227 | Oct 2005 | JP |
2006-120748 | May 2006 | JP |
2007-243226 | Sep 2007 | JP |
2007-281323 | Oct 2007 | JP |
2007-294506 | Nov 2007 | JP |
2007-294700 | Nov 2007 | JP |
2008-258296 | Oct 2008 | JP |
2009-040884 | Feb 2009 | JP |
2009-117825 | May 2009 | JP |
2009-130234 | Jun 2009 | JP |
2009-149879 | Jul 2009 | JP |
2009-194026 | Aug 2009 | JP |
2009-252899 | Oct 2009 | JP |
2009-295892 | Dec 2009 | JP |
2010-062272 | Mar 2010 | JP |
2010-100827 | May 2010 | JP |
2010-114144 | May 2010 | JP |
2011-503817 | Jan 2011 | JP |
2012-503876 | Feb 2012 | JP |
WO 2009038072 | Mar 2009 | WO |
WO 2009066026 | May 2009 | WO |
WO 2009066206 | May 2009 | WO |
WO 2009075530 | Jun 2009 | WO |
WO 2010035206 | Apr 2010 | WO |
WO 2010051758 | May 2010 | WO |
Number | Date | Country | |
---|---|---|---|
20170243850 A1 | Aug 2017 | US |
Number | Date | Country | |
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Parent | 13700414 | US | |
Child | 15589427 | US |