Thomas E. Lombardi

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package with varying interconnects
- Patent number 12,183,702
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Near tier decoupling capacitors
- Patent number 11,694,992
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting a component to a substrate by adhesion to an oxidized so...
- Patent number 11,228,124
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating cracking within integrated circuit (IC) device carrier
- Patent number 10,985,129
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal warpage of a laminate
- Patent number 10,832,987
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 10,014,273
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures for underfill blockout regions
- Patent number 9,798,088
- Issue date Oct 24, 2017
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- G02 - OPTICS
Information Patent Grant
Selectively soluble standoffs for chip joining
- Patent number 9,673,177
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,543,253
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 9,455,234
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit boards
- Patent number 9,433,105
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,293,439
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,093,563
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for shaping a laminate substrate
- Patent number 9,059,240
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,048,245
- Issue date Jun 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 8,759,151
- Issue date Jun 24, 2014
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill method and chip package
- Patent number 8,492,910
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve current-carrying capabilities of C4...
- Patent number 8,367,543
- Issue date Feb 5, 2013
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overcoming laminate warpage and misalignment in flip-chip packages
- Patent number 8,304,290
- Issue date Nov 6, 2012
- International Business Machines Corporation
- Richard S. Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 8,188,597
- Issue date May 29, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill method and chip package
- Patent number 8,129,230
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing solder wetting in an optical device using diff...
- Patent number 6,762,119
- Issue date Jul 13, 2004
- International Bussiness Machines Corporation
- Sudipta K. Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of conductive adhesive to form temporary electrical connections...
- Patent number 6,528,352
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Raymond A. Jackson
- G01 - MEASURING TESTING
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,518,674
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Mario J. Interrante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface metallization structure for multiple chip test and burn-in
- Patent number 6,376,054
- Issue date Apr 23, 2002
- International Business Machines Corporation
- Scott I. Langenthal
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS
- Publication number 20230197658
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR TIER DECOUPLING CAPACITORS
- Publication number 20220271005
- Publication date Aug 25, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
- Publication number 20200328177
- Publication date Oct 15, 2020
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL WARPAGE OF A LAMINATE
- Publication number 20190295921
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN
- Publication number 20180104758
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING
- Publication number 20170170148
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL BLOCKOUT REGIONS
- Publication number 20170131476
- Publication date May 11, 2017
- GLOBALFOUNDRIES INC.
- Jeffrey P. Gambino
- G02 - OPTICS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20160329297
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20150136838
- Publication date May 21, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY
- Publication number 20150093859
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module Assembly With Patterned Adhesive Array
- Publication number 20150014836
- Publication date Jan 15, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20140197228
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130320069
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120187180
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERFILL METHOD AND CHIP PACKAGE
- Publication number 20120119353
- Publication date May 17, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120070940
- Publication date Mar 22, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
- Publication number 20110151627
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Richard S. Graf
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP CARRIERS WITH SIDE TERMINALS
- Publication number 20110048790
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Richard Stephen Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERFILL METHOD AND CHIP PACKAGE
- Publication number 20110037181
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4...
- Publication number 20070222073
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENTS FOR UNDERFILL CONTROL
- Publication number 20070099346
- Publication date May 3, 2007
- International Business Machines Corporation
- Mukta Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure and process for silicon optical bench
- Publication number 20020196996
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Sudipta K. Ray
- G02 - OPTICS
Information Patent Application
Temporary attach article and method for temporary attach of devices...
- Publication number 20010008778
- Publication date Jul 19, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS

Thomas E. Lombardi

Person

Patents Grantslast 30 patents

Electronic package with varying interconnects

Near tier decoupling capacitors

Connecting a component to a substrate by adhesion to an oxidized so...

Structure with controlled capillary coverage

Mitigating cracking within integrated circuit (IC) device carrier

Managing thermal warpage of a laminate

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Fixture to constrain laminate and method of assembly

Method and apparatus for strain relieving surface mount attached co...

Barrier structures for underfill blockout regions

Selectively soluble standoffs for chip joining

Method and apparatus for strain relieving surface mount attached co...

Method for shaping a laminate substrate

Fixture to constrain laminate and method of assembly

Method of fabricating printed circuit boards

Electronic module assembly with patterned adhesive array

Electronic module assembly with patterned adhesive array

Fixture for shaping a laminate substrate

Method for shaping a laminate substrate

Fixture to constrain laminate and method of assembly

Underfill method and chip package

Structure and method to improve current-carrying capabilities of C4...

Overcoming laminate warpage and misalignment in flip-chip packages

Fixture to constrain laminate and method of assembly

Underfill method and chip package

Method of preventing solder wetting in an optical device using diff...

Use of conductive adhesive to form temporary electrical connections...

Temporary attach article and method for temporary attach of devices...

Surface metallization structure for multiple chip test and burn-in

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS

NEAR TIER DECOUPLING CAPACITORS

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

Mitigating Cracking Within Integrated Circuit (IC) Device Carrier

MANAGING THERMAL WARPAGE OF A LAMINATE

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING

BARRIER STRUCTURES FOR UNDERFILL BLOCKOUT REGIONS

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

METHOD FOR SHAPING A LAMINATE SUBSTRATE

ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY

Electronic Module Assembly With Patterned Adhesive Array

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

FIXTURE FOR SHAPING A LAMINATE SUBSTRATE

METHOD FOR SHAPING A LAMINATE SUBSTRATE

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

UNDERFILL METHOD AND CHIP PACKAGE

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES

CHIP CARRIERS WITH SIDE TERMINALS

UNDERFILL METHOD AND CHIP PACKAGE

STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4...

SURFACE TREATMENTS FOR UNDERFILL CONTROL

Interconnect structure and process for silicon optical bench

Temporary attach article and method for temporary attach of devices...