Thomas M. Goida

Person

Windham, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low stress integrated device package
- Patent number 11,702,335
- Issue date Jul 18, 2023
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device packages
- Patent number 10,800,651
- Issue date Oct 13, 2020
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolation features for stacked dies
- Patent number 10,287,161
- Issue date May 14, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated device die and package with stress reduction features
- Patent number 9,698,127
- Issue date Jul 4, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pre-molded MEMS device package having conductive column coupled to...
- Patent number 9,573,800
- Issue date Feb 21, 2017
- Invensense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress compact device packages
- Patent number 9,533,878
- Issue date Jan 3, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Two-axis vertical mount package assembly
- Patent number 9,475,694
- Issue date Oct 25, 2016
- Analog Devices Global
- Arturo Martizon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with embedded ASIC
- Patent number 9,407,997
- Issue date Aug 2, 2016
- Invensense, Inc.
- Michael D. Delaus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated device die and package with stress reduction features
- Patent number 9,343,367
- Issue date May 17, 2016
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded MEMS device package with conductive shell
- Patent number 9,260,293
- Issue date Feb 16, 2016
- Invensense, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone system with offset apertures
- Patent number 9,258,634
- Issue date Feb 9, 2016
- Invensense, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced footprint microphone system with spacer member having throu...
- Patent number 9,215,519
- Issue date Dec 15, 2015
- Invensense, Inc.
- Thomas Goida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Double-sided package
- Patent number 9,209,121
- Issue date Dec 8, 2015
- Analog Devices, Inc.
- Thomas M. Goida
- G01 - MEASURING TESTING
Information Patent Grant
Pre-molded MEMS device package having conductive column coupled to...
- Patent number 9,162,872
- Issue date Oct 20, 2015
- Invensense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging
- Patent number 9,142,470
- Issue date Sep 22, 2015
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated microphone package
- Patent number 9,079,760
- Issue date Jul 14, 2015
- Invensense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for 3D integration including two stacked dies...
- Patent number 8,946,879
- Issue date Feb 3, 2015
- Analog Devices, Inc.
- Thomas Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device package with conductive shell
- Patent number 8,941,223
- Issue date Jan 27, 2015
- Invensense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged integrated device die between an external and internal hou...
- Patent number 8,779,535
- Issue date Jul 15, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages and methods for packaging using a lid having multiple cond...
- Patent number 8,723,308
- Issue date May 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package for MEMS sensors
- Patent number 8,624,380
- Issue date Jan 7, 2014
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 8,447,057
- Issue date May 21, 2013
- Analog Devices, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package for MEMS sensors
- Patent number 8,174,111
- Issue date May 8, 2012
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level CSP packaging concept
- Patent number 7,939,916
- Issue date May 10, 2011
- Analog Devices, Inc.
- Alan O'Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress free package and laminate-based isolator package
- Patent number 7,871,865
- Issue date Jan 18, 2011
- Analog Devices, Inc.
- Dipak Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stacked die packaging
- Patent number 7,829,379
- Issue date Nov 9, 2010
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for multiple chips on a single leadframe
- Patent number 5,084,753
- Issue date Jan 28, 1992
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY DEVICE PACKAGES
- Publication number 20240213188
- Publication date Jun 27, 2024
- Analog Devices, Inc.
- Santosh Anil Kudtarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGE
- Publication number 20220177298
- Publication date Jun 9, 2022
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGES
- Publication number 20170320725
- Publication date Nov 9, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION FEATURES FOR STACKED DIES
- Publication number 20170022051
- Publication date Jan 26, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
- Publication number 20160336297
- Publication date Nov 17, 2016
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW STRESS COMPACT DEVICE PACKAGES
- Publication number 20160167951
- Publication date Jun 16, 2016
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO...
- Publication number 20160130134
- Publication date May 12, 2016
- InvenSense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
- Publication number 20150181697
- Publication date Jun 25, 2015
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded MEMS Device Package with Conductive Shell
- Publication number 20150102436
- Publication date Apr 16, 2015
- InvenSense, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20140332947
- Publication date Nov 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE-SIDED PACKAGE
- Publication number 20140217566
- Publication date Aug 7, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- G01 - MEASURING TESTING
Information Patent Application
TWO-AXIS VERTICAL MOUNT PACKAGE ASSEMBLY
- Publication number 20140196540
- Publication date Jul 17, 2014
- ANALOG DEVICES, TECHNOLOGY
- Arturo Martizon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Microphone Package
- Publication number 20140169607
- Publication date Jun 19, 2014
- InvenSense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pre-Molded MEMS Device Package
- Publication number 20140070382
- Publication date Mar 13, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pre-Molded MEMS Device Package with Conductive Shell
- Publication number 20140070383
- Publication date Mar 13, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR 3D INTEGRATION
- Publication number 20140027867
- Publication date Jan 30, 2014
- Analog Devices, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20130241045
- Publication date Sep 19, 2013
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone System with Offset Apertures
- Publication number 20130195284
- Publication date Aug 1, 2013
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES
- Publication number 20120237073
- Publication date Sep 20, 2012
- Analog Devices, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vertical Mount Package for MEMS Sensors
- Publication number 20120235253
- Publication date Sep 20, 2012
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20120126347
- Publication date May 24, 2012
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone Package with Embedded ASIC
- Publication number 20120087521
- Publication date Apr 12, 2012
- Analog Devices, Inc.
- Michael D. Delaus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reduced Footprint Microphone System with Spacer Member Having Throu...
- Publication number 20120027234
- Publication date Feb 2, 2012
- Analog Devices, Inc.
- Thomas Goida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer Level Stacked Die Packaging
- Publication number 20110049712
- Publication date Mar 3, 2011
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Stacked Die Packaging
- Publication number 20090102060
- Publication date Apr 23, 2009
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY
- Publication number 20080197514
- Publication date Aug 21, 2008
- Thomas Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost Stacked Package
- Publication number 20080182434
- Publication date Jul 31, 2008
- Analog Devices, Inc.
- Thomas M. Goida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level CSP Packaging Concept
- Publication number 20080179730
- Publication date Jul 31, 2008
- Analog Devices, Inc.
- Alan O'Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS FREE PACKAGE AND LAMINATE-BASED ISOLATOR PACKAGE
- Publication number 20080176362
- Publication date Jul 24, 2008
- Dipak Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Back Side Conductive Paths
- Publication number 20080087979
- Publication date Apr 17, 2008
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thomas M. Goida

Person

Patents Grantslast 30 patents

Low stress integrated device package

Low stress integrated device packages

Stress isolation features for stacked dies

Integrated device die and package with stress reduction features

Pre-molded MEMS device package having conductive column coupled to...

Low stress compact device packages

Two-axis vertical mount package assembly

Microphone package with embedded ASIC

Integrated device die and package with stress reduction features

Pre-molded MEMS device package with conductive shell

Microphone system with offset apertures

Reduced footprint microphone system with spacer member having throu...

Double-sided package

Pre-molded MEMS device package having conductive column coupled to...

Packages and methods for packaging

Integrated microphone package

Packages and methods for 3D integration including two stacked dies...

MEMS device package with conductive shell

Packaged integrated device die between an external and internal hou...

Packages and methods for packaging using a lid having multiple cond...

Vertical mount package for MEMS sensors

Packages and methods for packaging MEMS microphone devices

Vertical mount package for MEMS sensors

Wafer level CSP packaging concept

Stress free package and laminate-based isolator package

Wafer level stacked die packaging

Packaging for multiple chips on a single leadframe

Patents Applicationslast 30 patents

HIGH FREQUENCY DEVICE PACKAGES

LOW STRESS INTEGRATED DEVICE PACKAGE

LOW STRESS INTEGRATED DEVICE PACKAGES

STRESS ISOLATION FEATURES FOR STACKED DIES

INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES

LOW STRESS COMPACT DEVICE PACKAGES

PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO...

INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES

Pre-Molded MEMS Device Package with Conductive Shell

PACKAGES AND METHODS FOR PACKAGING

DOUBLE-SIDED PACKAGE

TWO-AXIS VERTICAL MOUNT PACKAGE ASSEMBLY

Integrated Microphone Package

Pre-Molded MEMS Device Package

Pre-Molded MEMS Device Package with Conductive Shell

PACKAGES AND METHODS FOR 3D INTEGRATION

PACKAGES AND METHODS FOR PACKAGING

Microphone System with Offset Apertures

PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES

Vertical Mount Package for MEMS Sensors

PACKAGES AND METHODS FOR PACKAGING

Microphone Package with Embedded ASIC

Reduced Footprint Microphone System with Spacer Member Having Throu...

Wafer Level Stacked Die Packaging

Wafer Level Stacked Die Packaging

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Low Cost Stacked Package

Wafer Level CSP Packaging Concept

STRESS FREE PACKAGE AND LAMINATE-BASED ISOLATOR PACKAGE

Integrated Circuit with Back Side Conductive Paths