Thomas WEISS

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated stiffener to control the warpage of electronic chip carriers
- Patent number 11,302,651
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarged conductive pad structures for enhanced chip bond assembly...
- Patent number 11,282,773
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalized copper block for selective solder removal
- Patent number 11,235,404
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting a component to a substrate by adhesion to an oxidized so...
- Patent number 11,228,124
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of terminal metallurgy on laminates and boards
- Patent number 11,168,400
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit
- Patent number 11,031,373
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge support structure
- Patent number 10,957,650
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free column interconnect
- Patent number 10,950,573
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip carrier for bridge assembly
- Patent number 10,916,507
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Charles L Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,892,249
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,840,214
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal warpage of a laminate
- Patent number 10,832,987
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor stiffener
- Patent number 10,756,031
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic package
- Patent number 10,636,746
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assemblies with bond protection
- Patent number 10,624,202
- Issue date Apr 14, 2020
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,515,929
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,431,563
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with tapered pedestal
- Patent number 10,424,527
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying pressure to adhesive using CTE mismatch between components
- Patent number 10,327,343
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Michael J. Fisher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tamper-respondent assemblies with bond protection
- Patent number 10,264,665
- Issue date Apr 16, 2019
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages formed with stressed glass
- Patent number 10,257,924
- Issue date Apr 9, 2019
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with vent structure
- Patent number 10,251,288
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Michael J. Fisher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooled compliant heat sink and related method
- Patent number 10,242,931
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooled compliant heat sink and related method
- Patent number 10,177,075
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Enclosure with inner tamper-respondent sensor(s) and physical secur...
- Patent number 10,178,818
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Michael J. Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...
- Publication number 20210320056
- Publication date Oct 14, 2021
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL
- Publication number 20210291287
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20210175207
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
- Publication number 20210104464
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE SUPPORT STRUCTURE
- Publication number 20210057341
- Publication date Feb 25, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20200312812
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE COLUMN INTERCONNECT
- Publication number 20200303339
- Publication date Sep 24, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
- Publication number 20200176383
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20200013732
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Kamal K. SIKKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF TERMINAL METALLURGY ON LAMINATES AND BOARDS
- Publication number 20190390348
- Publication date Dec 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190378816
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312009
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312011
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312010
- Publication date Oct 10, 2019
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL WARPAGE OF A LAMINATE
- Publication number 20190295921
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20190267332
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH TAPERED PEDESTAL
- Publication number 20190148260
- Publication date May 16, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH TRACE REGIONS OF INCREASED SUSCEP...
- Publication number 20180124915
- Publication date May 3, 2018
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH VENT STRUCTURE
- Publication number 20180110142
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Michael J. FISHER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCLOSURE WITH INNER TAMPER-RESPONDENT SENSOR(S) AND PHYSICAL SECUR...
- Publication number 20180110165
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Michael J. FISHER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION
- Publication number 20180103538
- Publication date Apr 12, 2018
- International Business Machines Corporation
- William L. BRODSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION
- Publication number 20180103537
- Publication date Apr 12, 2018
- International Business Machines Corporation
- William L. BRODSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH ENCLOSURE-TO-BOARD PROTECTION
- Publication number 20180098423
- Publication date Apr 5, 2018
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS
- Publication number 20180098424
- Publication date Apr 5, 2018
- International Business Machines Corporation
- James A. BUSBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS
- Publication number 20170332485
- Publication date Nov 16, 2017
- International Business Machines Corporation
- James A. BUSBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH ENCLOSURE-TO-BOARD PROTECTION
- Publication number 20170181274
- Publication date Jun 22, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thomas WEISS

Person

Patents Grantslast 30 patents

Spacer for die-to-die communication in an integrated circuit and me...

Alignment carrier for interconnect bridge assembly

Laminated stiffener to control the warpage of electronic chip carriers

Enlarged conductive pad structures for enhanced chip bond assembly...

Personalized copper block for selective solder removal

Mitigating thermal-mechanical strain and warpage of an organic lami...

Connecting a component to a substrate by adhesion to an oxidized so...

Formation of terminal metallurgy on laminates and boards

Spacer for die-to-die communication in an integrated circuit

Bridge support structure

Lead-free column interconnect

Multiple chip carrier for bridge assembly

Carrier and integrated memory

Carrier and integrated memory

Precision alignment of multi-chip high density interconnects

Managing thermal warpage of a laminate

Decoupling capacitor stiffener

Method of forming an electronic package

Tamper-respondent assemblies with bond protection

Lead-free solder joining of electronic structures

Carrier and integrated memory

Carrier and integrated memory

Electronic package with tapered pedestal

Applying pressure to adhesive using CTE mismatch between components

Tamper-respondent assemblies with bond protection

Tamper-proof electronic packages formed with stressed glass

Tamper-respondent assembly with vent structure

Liquid cooled compliant heat sink and related method

Liquid cooled compliant heat sink and related method

Enclosure with inner tamper-respondent sensor(s) and physical secur...

Patents Applicationslast 30 patents

ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...

PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY

BRIDGE SUPPORT STRUCTURE

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

LEAD-FREE COLUMN INTERCONNECT

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

FORMATION OF TERMINAL METALLURGY ON LAMINATES AND BOARDS

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

MANAGING THERMAL WARPAGE OF A LAMINATE

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

ELECTRONIC PACKAGE WITH TAPERED PEDESTAL

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

TAMPER-RESPONDENT ASSEMBLIES WITH TRACE REGIONS OF INCREASED SUSCEP...

TAMPER-RESPONDENT ASSEMBLY WITH VENT STRUCTURE

ENCLOSURE WITH INNER TAMPER-RESPONDENT SENSOR(S) AND PHYSICAL SECUR...

TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION

TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION

TAMPER-RESPONDENT ASSEMBLIES WITH ENCLOSURE-TO-BOARD PROTECTION

TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS

TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS

TAMPER-RESPONDENT ASSEMBLIES WITH ENCLOSURE-TO-BOARD PROTECTION