Tian-An Chen

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming semiconductor structures
- Patent number 8,513,111
- Issue date Aug 20, 2013
- Intel Corporation
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low coefficient of thermal expansion (CTE) thermosetting resins for...
- Patent number 8,431,223
- Issue date Apr 30, 2013
- Intel Corporation
- James C. Matayabas
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low coefficient of thermal expansion (CTE) thermosetting resins for...
- Patent number 8,242,216
- Issue date Aug 14, 2012
- Intel Corporation
- James C. Matayabas, Jr.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low coefficient of thermal expansion (CTE) thermosetting resins for...
- Patent number 7,999,042
- Issue date Aug 16, 2011
- Intel Corporation
- James C. Matayabas, Jr.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low temperature bumping process
- Patent number 7,718,216
- Issue date May 18, 2010
- Intel Corporation
- Terry Lee Sterrett
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
No-flow underfill composition and method
- Patent number 7,619,318
- Issue date Nov 17, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bumping process
- Patent number 7,521,115
- Issue date Apr 21, 2009
- Intel Corporation
- Terry Lee Sterrett
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Nanopowder coating for scribing and structures formed thereby
- Patent number 7,504,318
- Issue date Mar 17, 2009
- Intel Corporation
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip system and method of making same
- Patent number 7,470,564
- Issue date Dec 30, 2008
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microelectronic devices having underfill materials with improved fl...
- Patent number 7,303,944
- Issue date Dec 4, 2007
- Intel Corporation
- Tian-An Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance amine based no-flow underfill materials for flip c...
- Patent number 7,279,359
- Issue date Oct 9, 2007
- Intel Corporation
- Tian-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material to reduce ball limiting metallurgy delamination...
- Patent number 7,218,007
- Issue date May 15, 2007
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Patent number 7,179,684
- Issue date Feb 20, 2007
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of assembling soldered packages utilizing selective solder d...
- Patent number 7,153,765
- Issue date Dec 26, 2006
- Intel Corporation
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming chemical vapor depositable low dielectric constant layers
- Patent number 7,029,723
- Issue date Apr 18, 2006
- Intel Corporation
- Tian-An Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluxing agent for underfill materials
- Patent number 7,026,376
- Issue date Apr 11, 2006
- Intel Corporation
- Tian-An Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No-flow underfill composition and method
- Patent number 6,982,492
- Issue date Jan 3, 2006
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Patent number 6,899,960
- Issue date May 31, 2005
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of fabricating a bismaleimide (BMI) ASA sacrifical material...
- Patent number 6,872,654
- Issue date Mar 29, 2005
- Intel Corporation
- Tian-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment for microelectronic device substrate
- Patent number 6,794,225
- Issue date Sep 21, 2004
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill material
- Patent number 6,794,761
- Issue date Sep 21, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
- Patent number 6,780,517
- Issue date Aug 24, 2004
- Honeywell International Inc.
- Tian-An Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polycarbosilane adhesion promoters for low dielectric constant poly...
- Patent number 6,761,975
- Issue date Jul 13, 2004
- Honeywell International Inc.
- Tian-An Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polybenzoxazine based wafer-level underfill material
- Patent number 6,730,542
- Issue date May 4, 2004
- Intel Corporation
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polybenzoxazine based wafer-level underfill material
- Patent number 6,727,594
- Issue date Apr 27, 2004
- Intel Corporation
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidizing polishing slurries for low dielectric constant materials
- Patent number 6,610,114
- Issue date Aug 26, 2003
- Honeywell International Inc.
- Dan Towery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoporous polymers comprising macrocycles
- Patent number 6,380,347
- Issue date Apr 30, 2002
- Honeywell International Inc.
- Kreisler Lau
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymers having backbones with reactive groups employed in crosslin...
- Patent number 6,313,185
- Issue date Nov 6, 2001
- Honeywell International Inc.
- Kreisler Lau
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Poly(arylene ether) homopolymer compositions and methods of manufac...
- Patent number 6,303,733
- Issue date Oct 16, 2001
- AlliedSignal Inc.
- Kreisler S. Y. Lau
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent systems for low dielectric constant polymeric materials
- Patent number 6,291,628
- Issue date Sep 18, 2001
- Allied-Signal Inc.
- Tian-An Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LOW COEFFICIENT OF THERMAL EXPANSION (CTE) THERMOSETTING RESINS FOR...
- Publication number 20120282462
- Publication date Nov 8, 2012
- James C. Matayabas, JR.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW COEFFICIENT OF THERMAL EXPANSION (CTE) THERMOSETTING RESINS FOR...
- Publication number 20110250458
- Publication date Oct 13, 2011
- James C. Matayabas, JR.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW TEMPERATURE BUMPING PROCESS
- Publication number 20070148360
- Publication date Jun 28, 2007
- Intel Corporation
- Terry Lee Sterrett
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20070117263
- Publication date May 24, 2007
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER P...
- Publication number 20070085175
- Publication date Apr 19, 2007
- Intel Corporation
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nanopowder coating for scribing and structures formed thereby
- Publication number 20070066032
- Publication date Mar 22, 2007
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming semiconductor structures
- Publication number 20060255432
- Publication date Nov 16, 2006
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-filling in electronic assemblies including a TEC structure
- Publication number 20060243315
- Publication date Nov 2, 2006
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective solder deposition by self-assembly of nano-sized solder p...
- Publication number 20060226203
- Publication date Oct 12, 2006
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
One step capillary underfill integration for semiconductor packages
- Publication number 20060138643
- Publication date Jun 29, 2006
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
One step capillary underfill integration for semiconductor packages
- Publication number 20060138622
- Publication date Jun 29, 2006
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices having underfill materials with improved fl...
- Publication number 20060128834
- Publication date Jun 15, 2006
- Tian-An Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill material to reduce ball limiting metallurgy delamination...
- Publication number 20060071337
- Publication date Apr 6, 2006
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
High performance amine based no-flow underfill materials for flip c...
- Publication number 20060060987
- Publication date Mar 23, 2006
- Tian-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill composition and method
- Publication number 20060025500
- Publication date Feb 2, 2006
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low coefficient of thermal expansion (CTE) thermosetting resins for...
- Publication number 20050288454
- Publication date Dec 29, 2005
- James C. Matayabas
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20050196906
- Publication date Sep 8, 2005
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer supporting system for semiconductor wafers
- Publication number 20050147489
- Publication date Jul 7, 2005
- Tian-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill composition and method
- Publication number 20050087891
- Publication date Apr 28, 2005
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxes for flip chip assembly using water soluble polymers
- Publication number 20050067468
- Publication date Mar 31, 2005
- Daoqiang Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxing agent for underfill materials
- Publication number 20040261904
- Publication date Dec 30, 2004
- Tian-An Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Oxidizing polishing slurries for low dielectric constant materials
- Publication number 20040192172
- Publication date Sep 30, 2004
- Dan Towery
- B24 - GRINDING POLISHING
Information Patent Application
Forming semiconductor structures
- Publication number 20040145030
- Publication date Jul 29, 2004
- Robert P. Meagley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming chemical vapor depositable low dielectric constant layers
- Publication number 20040130031
- Publication date Jul 8, 2004
- Tian-An Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bismaleimide (BMI) polymer as a sacrificial material for an integra...
- Publication number 20040124495
- Publication date Jul 1, 2004
- Tian-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treatment for microelectronic device substrate
- Publication number 20040121512
- Publication date Jun 24, 2004
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature bumping process
- Publication number 20040115408
- Publication date Jun 17, 2004
- Intel Corporation
- Terry Lee Sterrett
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Flip-chip system and method of making same
- Publication number 20040082107
- Publication date Apr 29, 2004
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20030190477
- Publication date Oct 9, 2003
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polybenzoxazine based wafer-level underfill material
- Publication number 20030137043
- Publication date Jul 24, 2003
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Tian-An Chen

Person

Patents Grantslast 30 patents

Forming semiconductor structures

Low coefficient of thermal expansion (CTE) thermosetting resins for...

Low coefficient of thermal expansion (CTE) thermosetting resins for...

Low coefficient of thermal expansion (CTE) thermosetting resins for...

Low temperature bumping process

No-flow underfill composition and method

Low temperature bumping process

Nanopowder coating for scribing and structures formed thereby

Flip-chip system and method of making same

Microelectronic devices having underfill materials with improved fl...

High performance amine based no-flow underfill materials for flip c...

Underfill material to reduce ball limiting metallurgy delamination...

Microelectronic or optoelectronic package having a polybenzoxazine-...

Method of assembling soldered packages utilizing selective solder d...

Forming chemical vapor depositable low dielectric constant layers

Fluxing agent for underfill materials

No-flow underfill composition and method

Microelectronic or optoelectronic package having a polybenzoxazine-...

Method of fabricating a bismaleimide (BMI) ASA sacrifical material...

Surface treatment for microelectronic device substrate

No-flow underfill material

Polycarbosilane adhesion promoters for low dielectric constant poly...

Polycarbosilane adhesion promoters for low dielectric constant poly...

Polybenzoxazine based wafer-level underfill material

Polybenzoxazine based wafer-level underfill material

Oxidizing polishing slurries for low dielectric constant materials

Nanoporous polymers comprising macrocycles

Polymers having backbones with reactive groups employed in crosslin...

Poly(arylene ether) homopolymer compositions and methods of manufac...

Solvent systems for low dielectric constant polymeric materials

Patents Applicationslast 30 patents

LOW COEFFICIENT OF THERMAL EXPANSION (CTE) THERMOSETTING RESINS FOR...

LOW COEFFICIENT OF THERMAL EXPANSION (CTE) THERMOSETTING RESINS FOR...

LOW TEMPERATURE BUMPING PROCESS

Microelectronic or optoelectronic package having a polybenzoxazine-...

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER P...

Nanopowder coating for scribing and structures formed thereby

Forming semiconductor structures

Gap-filling in electronic assemblies including a TEC structure

Selective solder deposition by self-assembly of nano-sized solder p...

One step capillary underfill integration for semiconductor packages

One step capillary underfill integration for semiconductor packages

Microelectronic devices having underfill materials with improved fl...

Underfill material to reduce ball limiting metallurgy delamination...

High performance amine based no-flow underfill materials for flip c...

No-flow underfill composition and method

Low coefficient of thermal expansion (CTE) thermosetting resins for...

Microelectronic or optoelectronic package having a polybenzoxazine-...

Wafer supporting system for semiconductor wafers

No-flow underfill composition and method

Fluxes for flip chip assembly using water soluble polymers

Fluxing agent for underfill materials

Oxidizing polishing slurries for low dielectric constant materials

Forming semiconductor structures

Forming chemical vapor depositable low dielectric constant layers

Bismaleimide (BMI) polymer as a sacrificial material for an integra...

Surface treatment for microelectronic device substrate

Low temperature bumping process

Flip-chip system and method of making same

Microelectronic or optoelectronic package having a polybenzoxazine-...

Polybenzoxazine based wafer-level underfill material